Mea ʻIke Huahana: Hale: Thermoplastic, UL94V-0 Contact: Copper Alloy. Puhi:SUS201. Hoʻopili: Hoʻokaʻaʻike:Paʻi gula E ʻike i ka pākaukau AT ʻĀpana Hoʻokaʻa ʻia ʻo Tin Plating AT Solder Area. Nickel Under plated All Over. Shell: Hoʻopili ʻia ʻo Nickel Solder ma nā wahi a pau. Uila: Ka Mahana Hana:-20°C A i +80°C. Māhele No. Hōʻike PCS/CTN GW(KG) CMB(m3) OrderQty. Kauoha Manawa
ʻIke Huahana Mea Hana Hale:Hing Temperature Thermoplastics, UL94V-0 LCP, ʻEleʻele. Hoʻokaʻaʻike:C2680/C5191. Iho: kila. Hoʻopau: Hoʻopili:Plated Gold In Mating Area; Kino Lead on Solder Talls. ʻO ka ʻili: ʻO ka pā kepau. Uila: Kū'ē Kū'ē: 30mΩ Max. Dielectric Withstanding Voltage: 50 V AC AT Sea Level. Kū'ē Kū'ē: 100MΩ Min. Māhele No. Hōʻike PCS/CTN GW(KG) CMB(m3) OrderQty. Ka Manawa...
Hoʻopili i ka MICRO USB TYPE B CLIP L8.8 KLS1-236-5M7
ʻIke Huahana Hale:Hing Temperature Thermoplastic me gf,UL94V-0. Pili: Copper Alloy, t=0.20mm. Ka pūpū:SUS,t=0.20mm. Uila: Ka helu o kēia manawa: 1A Max. Dielectric Withstanding Voltage: 100 V AC no 1 min. Kū'ē Pili: 50mΩ Max. Kū'ē Kū'ē: 100MΩ Min. Ka nui o ka ikaika male: 3.57 kgf Max. Huina Unmating Force:1.0 kgf Min. Kaulana Mahana: -30°C A hiki i +80°C Mahele No. wehewehe PCS/CTN GW..
Hoʻopili i ka MICRO USB TYPE B CLIP L6.8 KLS1-236-5M6
ʻIke Huahana Mea Hana Hale:Hing Temperature Thermoplastic me gf,UL94V-0. Pili: Copper Alloy, t=0.20mm. Ka pūpū:SUS,t=0.20mm. Uila: Ka helu o kēia manawa: 1A Max. Dielectric Withstanding Voltage: 100 V AC no 1 min. Kū'ē Pili: 50mΩ Max. Kū'ē Kū'ē: 100MΩ Min. Ka nui o ka ikaika male: 3.57 kgf Max. Huina Unmating Force:1.0 kgf Min. Kaulana Mahana: -30°C A hiki i +80°C Mahele No. Descripti...
ʻIke Huahana Mea Hana Hale:Hing Temperature Thermoplastics, UL94V-0 LCP, ʻEleʻele. Hoʻokaʻaʻike:C2680/C5191. ʻO ka pūpū: Copper/hao/stainless steel. Hoʻopau: Hoʻopili:Plated Gold In Mating Area; Kino Lead on Solder Talls. ʻO ka ʻili: ʻO ka pā kepau. Uila: Kū'ē Kū'ē: 30mΩ Max. Dielectric Withstanding Voltage: 50 V AC AT Sea Level. Kū'ē Kū'ē: 100MΩ Min. Māhele No. Hōʻike PCS/CTN GW(KG) CMB(m3) Ord...
Hoʻopili i ka MICRO USB TYPE B PCB MID MOUNT KLS1-236-5M1
ʻIke Huahana Mea Hana Hale:LCP,UL94V-0,ʻEleʻele. Hoʻopili: Copper Alloy. Puhi:SUS 304 T=0.20. Hoʻopau: Hoʻokaʻaʻike: ʻO ka Plating Gula ma ka wahi Hoʻopili. 80u "Sn Plating on solder huelo wahi. 50u" Min.Nickel Under plating ma luna o nā mea a pau. Uila: Voltage Rating:30VAC RMS. Ka helu o kēia manawa: 2.0A (pin 1 5); 1.0A(pin 2 3 4). Kū'ē Pili: 50mΩ Max. Kū'ē Kū'ē: 100MΩ Min. Dielectric Withstanding Voltage: 500 V AC No ...
ʻIkepili Huahana Mea Hana: Hale:LCP E130,UL94V-0 ʻEleʻele Hoʻokaʻaʻike:Brass 5210. Shell:Stainless Steel,T=0.20±0.03mm. Plating: Contact:Plated Gold Flash For Contact Area. Shell:Nickel Over All (paʻakai paʻakai no 24H). Shell:Gold Over All (paʻakai paʻakai no 24H). Uila: Ka Mahana Hana:-20°C A i +80°C. Huahana Hoʻopaʻa i ka noi RoHS Part No. Hōʻike PCS/CTN GW(KG) CMB(m3) OrderQty. Kauoha Manawa
Mea ʻIke Huahana: Hale:LCP ,UL94V-0 ʻEleʻele. Pili: Phosphor Bronze, T=0.20±0.01mm. ʻO ka ʻili mua: ʻAi ʻole, T=0.20±0.01mm. Puʻupuʻu Puʻupuʻu: Ke kila ʻole, T=0.20±0.01mm. Paʻa: ʻAi ʻole, T=0.40±0.01mm. Hoʻopau: Hoʻopili: ʻAna ke gula, ma ka wahi Hoʻopili. 100u-120u" Tin.Plating, ma nā huelo solder. 50u-80u" Nickel, Underplating ma luna o nā mea a pau. Uila: Ka helu o kēia manawa: 1A Max. Dielectric me ka Volta...
Hoʻopili i ka MICRO USB TYPE B Solder T3.0,L8.8mm KLS1-235-2
ʻIke Huahana Mea Hana Hale:Hing Temperature Thermoplastics, UL94V-0 LCP, ʻEleʻele. Hoʻokaʻaʻike: Copper Alloy C2680. Huina: Copper Alloy C2680/SPCC. Hoʻopau: Hoʻopili:Plated Gold In Mating Area; Kino ma Solder Talls. ʻO ka pūʻulu: Nickel Plating. Uila: Ka helu o kēia manawa:1.5A/Contact Terminal. Voltage Rating:30V DC Hoʻokaʻaʻike Kū'ē:30mΩ Max. Dielectric Withstanding Voltage: 500 V AC AT Sea Level. Kū'ē Kū'ē: 1000MΩ Min. Hoʻohui...
Hoʻopili i ka MICRO USB TYPE B Solder T3.0,L6.8mm KLS1-235-1
ʻIke Huahana Mea Hana Hale:Hing Temperature Thermoplastics, UL94V-0 LCP, ʻEleʻele. Hoʻokaʻaʻike: Copper Alloy C2680. Huina: Copper Alloy C2680/SPCC. Hoʻopau: Hoʻopili:Plated Gold In Mating Area; Kino ma Solder Talls. ʻO ka pūʻulu: Nickel Plating. Uila: Ka helu o kēia manawa:1.5A/Contact Terminal. Voltage Rating:30V DC Hoʻokaʻaʻike Kū'ē:30mΩ Max. Dielectric Withstanding Voltage: 500 V AC AT Sea Level. Kū'ē Kū'ē: 1000MΩ Min. Hoʻohui...
Hoʻopili i ka micro USB TYPE B solder T5.0 KLS1-235-0
Mea ʻIke Huahana: Hale: LCP+30%GF Ka helu ʻana o ka hiki ke hoʻā ʻia: UL 94V-0 ʻEleʻele. Shell:Sila ʻole. Hoʻokaʻaʻike:Brass Contacts Plating Gold Standard:Flash. Uila: Ka helu o kēia manawa: 0.5 Amp. Voltage: 100 V AC/DC Max. ʻO ke kūpaʻa Dielectric: 500 V AC no hoʻokahi minuke. Hana Hana:-55 ° C ~ + 85 ° C Mahele No. wehewehe PCS / CTN GW (KG) CMB (m3) OrderQty. Kauoha Manawa
Mea ʻIke Huahana: Mea Insulation Material Thermoplastic. Huina: Copper Alloy/SPCC,T=0.30mm. Hoʻopili: Nikela. Kūlana: Copper Alloy, T=0.25mm. Pākuʻi:Gold/Tin Plated. Uila: Kū'ē Kū'ē: 1000MΩ Min. Kū'ē Pili: 30mΩ Max. Me ka Voltage: 500 V AC. Nā ʻano Mechanical: Mana Hoʻokomo: 3.5kgf Max. ʻO ka ikaika o ka unuhi ʻana: 1.02kgf Min. Māhele No. Hōʻike PCS/CTN GW(KG) CMB(m3) OrderQty. Kauoha Manawa
ʻIke Huahana NĀ MEA: 1.Current Rating o kēia manawa:1.0A(Signal PIN 2 3 4); 1.8A (Power PIN 1 5) 2.Contact Resistance:40mΩ Max. 3.Insulation Kū'ē:100MΩ Min. 4.Dielectric Withstanding:100 V AC Min. 5.Durability: 10000 cycles. 6. Nā pūʻali hoʻohui hoʻohui: 35N Max (3.57Kgf). 7.Connector Unmating ikaika:8N Min (0.30Kgf). 8. Hoʻokō ka huahana i ka noi o ka RoHS Part No. Description PCS / CTN GW (KG) CMB (m3) OrderQty. Ti...
ʻIke Huahana Mea Hana Hale:Hing Temperature Thermoplastics,Black. Hoʻokaʻaʻike: Copper Alloy C1591. Huina: Copper Alloy C2680/SPCC. Hoʻopau: Hoʻokaʻaʻike:Plated Gold In Mating Area;Tin On Solder Talls. ʻO ka pūʻulu: Nickel Plating. Uila: Ka helu o kēia manawa:1.5A/Contact Terminal. Voltage Rating:30V DC Hoʻokaʻaʻike Kū'ē:30mΩ Max. Dielectric Withstanding Voltage:500 V AC AT Sea Level. Kū'ē Kū'ē: 1000MΩ Min. Mea hoʻohui hoa a me ka hoa pili ʻole no ka...
Solder A Male Plug USB Connector KLS1-1833 / KLS1-1838
ʻIke Huahana Mea Hana Hale: Hing Temperature Thermoplastic, UL94V-0 PBT, ʻEleʻele/Keʻokeʻo. Hoʻokaʻaʻike: Copper Alloy C2680. Huina: Copper Alloy C2680/SPCC. Hoʻopau: Hoʻokaʻaʻike:Plated Gold In Mating Area;Tin On Solder Talls. ʻO ka pūʻulu: Nickel Plating. Uila: Ka helu o kēia manawa:1.5A/Contact Terminal. Voltage Rating:30V DC Hoʻokaʻaʻike Kū'ē:30mΩ Max. Dielectric Withstanding Voltage:500 V AC AT Sea Level. Kū'ē Kū'ē: 1000MΩ Min. Mea hoʻohui Mate a me Unma...
ʻIke Huahana Mea Hana Hale: Hing Temperature Thermoplastic, UL94V-0 PBT/LCP, ʻEleʻele/Keʻokeʻo. Hoʻokaʻaʻike: Copper Alloy C2680. Huina: Copper Alloy C2680/SPCC. Hoʻopau: Hoʻopili:Plated Gold In Mating Area; Pin ma nā huelo kūʻai. ʻO ka pūʻulu: Nickel Plating. Uila: Ka helu o kēia manawa:1.5A/Contact Terminal. Voltage Rating:30V DC Hoʻokaʻaʻike Kū'ē:30mΩ Max. Dielectric Withstanding Voltage: 500 V AC AT Sea Level. Kū'ē kū'ē: 1000MΩ Mi...
ʻIke Huahana Mea Hana Hale: Hing Temperature Thermoplastic, UL94V-0 PBT/LCP, ʻEleʻele/Keʻokeʻo. Hoʻokaʻaʻike: Copper Alloy C2680. Huina: Copper Alloy C2680/SPCC. Hoʻopau: Hoʻopili:Plated Gold In Mating Area; Pin ma nā huelo kūʻai. ʻO ka pūʻulu: Nickel Plating. Uila: Ka helu o kēia manawa:1.5A/Contact Terminal. Voltage Rating:30V DC Hoʻokaʻaʻike Kū'ē:30mΩ Max. Dielectric Withstanding Voltage: 500 V AC AT Sea Level. Kū'ē kū'ē: 1000MΩ ...
ʻIke Huahana Mea Hana Hale: Hing Temperature Thermoplastic, UL94V-0 LCP, Hoʻopili ʻeleʻele: Copper Alloy C2680. Huina: Copper Alloy C2680/SPCC. Hoʻopau: Hoʻopili:Plated Gold In Mating Area; Pin ma nā huelo kūʻai. ʻO ka pūʻulu: Nickel Plating. Uila: Ka helu o kēia manawa:1.5A/Contact Terminal. Voltage Rating:30V DC Hoʻokaʻaʻike Kū'ē:30mΩ Max. Dielectric Withstanding Voltage: 500 V AC AT Sea Level. Kū'ē kū'ē: 1000MΩ M...