ʻIke Huahana CFast Host Connector,H8.35,ʻano LOCK Mea hale hale: ʻenekinia plastic, LCP me GF i hoʻoikaika ʻia, ʻeleʻele no kēlā me kēia, UL 94V-0, uku. Terminal: Phosphor Bronze, no JIS 5210,0.2T Puna: Piano thread Metala uhi:Stainless steel sheet SUS304 0.2T, Plating Solder zone:100u" matte Tin,50u" min, Nickel underplating over all. Māhele No. Hōʻike PCS/CTN GW(KG) CMB(m3) OrderQty. Kauoha Manawa
CFast Host Connector,H8.35,PUSH PUSH Type KLS1-CFA-003A
ʻIke Huahana CFast Host Connector,H8.35,PUSH PUSH Type Material Hale:Engineering plastic,LCP me GF i hoʻoikaikaʻia,ʻeleʻele no kēlā me kēia,UL 94V-0,rate. Slider: ʻenekinia plastic, LCP me GF i hoʻoikaika ʻia, ʻeleʻele no kēlā me kēia, UL 94V-0, uku. Terminal:Phosphor Bronze, no JIS 5210,0.2T Puna: Piano thread Metala uhi:Stainless steel sheet SUS304 0.2T, Crank:Stainless rod SUS 304. Kāleka laka:Stainless steel SUS 304 Plating Solder zone:100u" matte Tin,50u" min...Nickel
ʻIke Huahana CFast Host Connector,H6.05, LOCK type Mea Hale Hale: Engineering plastic, LCP me GF i hoʻoikaika ʻia, ʻeleʻele no kēlā me kēia, UL 94V-0, uku. Terminal: Phosphor Bronze, no JIS 5210,0.2T Metala uhi:Stainless steel sheet SUS304 0.2T, Plating Solder zone:100u "matte Tin,50u" min, Nickel underplating over all. Māhele No. Hōʻike PCS/CTN GW(KG) CMB(m3) OrderQty. Kauoha Manawa
CFast Host Connector,H6.05,PUSH PUSH Type KLS1-CFA-002A
ʻIke Huahana CFast Host Connector,H6.05,PUSH PUSH Type Material Hale:Engineering plastic,LCP me GF hoʻoikaika,ʻeleʻele no kēlā me kēia,UL 94V-0,rate. Slider: ʻenekinia plastic, LCP me GF i hoʻoikaika ʻia, ʻeleʻele no kēlā me kēia, UL 94V-0, uku. Terminal:Phosphor Bronze, no JIS 5210,0.2T Puna: Piano thread Metala uhi:Stainless steel sheet SUS304 0.2T, Crank:Stainless rod SUS 304. Kāleka laka:Stainless steel SUS 304 Plating Contacts:30u" gula plating ma ka wahi pili a me 100u&quo...
Mea Hoʻohui Hoʻokipa CFast, Vertical SMT KLS1-CFA-001
ʻIke Huahana CFast Host Connector, Vertical SMT Material Housing: Engineering plastic, LCP me GF i hoʻoikaika ʻia, ʻeleʻele no kēlā me kēia, UL 94V-0, uku. Terminal: Phosphor Bronze, no JIS 5210,0.2T Plating Contacts: 30u "ka uhi gula ma ka wahi pili a me ka 100u" min.matte Tin i ka soldering zone, ma luna o ka pilina holoʻokoʻa i lalo me 50u "min, Nickel ma luna o nā mea a pau. Solder zone: 100u" matte Tin, 50u" min.
ʻIke Huahana CF kāleka Mea hoʻohui 50P,L13.75mm,H3.9mm Mea: Hale: Thermoplastic,UL94V-V0.White. Hoʻokaʻaʻike: Copper Alloy 0.40T.Gold Flash On Contact Area Matte-Tin plated on solder huelo a puni Nickel plated. Hoʻoponopono: Copper Alloy 0.30T.Tin plated on solder huelo a puni Nickel plated. Uila: Ka helu o kēia manawa: 0.5A AC, DC. Kū'ē Pili: 40mΩ Max. Kū'ē Kū'ē: 1000MΩ Min. Me ka Voltage: 500V AC/minuke Hana Hana:...
ʻIke Huahana CF kāleka Mea hoʻohui 50P,L26mm,H5.4mm Mea Hale:LCP, UL94V-0 Uila Ka helu o kēia manawa: 0.5A,AC,DC Ke kūʻai aku ʻana:40mΩ kiʻekiʻe Kūleʻa kūʻokoʻa:1000ΜΩ min E kū i ka uila: 500V AC/minuke Manaʻo Hana:-45ºC ʻAʻohe ʻāpana. GW(KG) CMB(m3) OrderQty. Kauoha Manawa
3.96mm Pitch Edge Kāleka Mea Hoʻohui Solder Type KLS1-903S
ʻIkepili Huahana 3.96mm Pitch Edge Card Connector Solder Type Order InformationKLS1-903S-XX-L903S-Solder typeXX-No, of 10~100 pinL-Blue Material: Hale: Glass filled PBT UL94V-0Contacts: Brass or Phosphor BronzePlating: Contact gold and Dip Electrical Tin Tin AMPInsulator Kū'ē: 1000M Ohm min. ma DC 500VContact Kū'ē: 30m Ohm max. ma DC 100mAWithstanding Voltage: 1000V AC /rms 50Hz no 1 minuteOperation Te...
ʻIke Huahana 3.96mm Pitch Edge Card Connector PCB Dip 180 Type Order InformationKLS1-903D-1-XX-L903D-Dip 180 type1-Single row 2-Double rowXX-No, of 10~100 pinL-Blue Material:Housing: Glass filled PBT0Contact or 4. BronzePlating: Hoʻokaʻaʻike i ke gula a me ka Dip Tin ma luna o NickelElectrical Characteristics: Ka helu o kēia manawa: 2 AMPInsulator Resistance: 1000M Ohm min. ma DC 500VContact Kū'ē: 30m Ohm max. ma DC 100mAWithstanding Voltage:1000V AC /r...
Huki huki ka mea hoʻohui kāleka SD, H2.5mm, me ka pine CD KLS1-TF-020
ʻIke Huahana Huki huki ka mea hoʻohui kāleka SD, H2.5mm, me ka pin CD Material: Hale: Hi-Temp plastic, UL94V-0. Hoʻopili: Copper Alloy. Nail:Sila ʻole. Hoʻopau: Hoʻokaʻaʻike:G/F Gold plated on conatct area; Hoʻopili ʻia ʻo G/F ma nā huelo solder, Base Nickel 50u" Min Nail:50u" Nickel Under,100u" Tin Overall. Part No. Description PCS/CTN GW(KG) CMB(m3) OrderQty. Time Order