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Hoʻohui Kāleka Nano SIM, 6Pin, H1.4mm, ʻAno Hined, me ka ʻole CD Pin KLS1-SIM-077

ʻIke Huahana Nā Mea Hoʻohui Kāleka SIM Nano, 6Pin, H1.4mm, ʻAno Hinged, me ka ʻole CD Pin Material: Insulator: Kiʻekiʻe Temperature Thermoplastic, UL94V-0. Contact:C5210,Plated 50u" Ni Overall Contact All Au 1U. Shell:SUS.All Ni 30U/MIN. Uila: Ka helu o kēia manawa:0.5A Voltage Rating:5V AC/DC Ambient Humidity Range:95% RH Max. Hoʻokaʻaʻike kū'ē:80mΩ Max. Insulation Maika 000 DC. Nā pōʻaiapuni: 10000 Hoʻokomo. Ka Mahana Hana: -45&...

Hoʻohui Kāleka Nano SIM, PUSH PULL, 6Pin, H1.4mm, me CD Pin KLS1-SIM-092

ʻIke Huahana Nā Mea Hoʻohui Kāleka SIM Nano, PUSH PULL,6Pin,H1.4mm,me CD Pin Material: Hale:Hi-Temperature Thermoplastic,UL94V-0.Black. Terminal: Copper Alloy, koho 1u" Au ma ka wahi pili. Shell:Stainless Steel.selective Gold Flash ma solder wahi. Uila: Rated keia manawa:0.5A Max Rated Voltage:30V AC Contact Resistance:100mΩ Max. Insulation Resistance:1000MΩ Min./500V DC AC/500V DC Dielectric Withstanding Voltage.

Mea hoʻohui Kāleka SIM Nano; PUSH PULL, 6Pin, H1.35mm KLS1-SIM-076

ʻIke Huahana Mea Hoʻohui Kāleka SIM Nano; PUSH PULL, 6Pin, H1.35mm Material: Insulator: Thermoplastic Kiʻekiʻe, UL94V-0. Contact:C5210.Plated 50u" Ni Overall,Contact All Au 1u. Shell:SUS,Plated 50u" Ni Overall,PAD Au 1u. Uila: Ka helu o kēia manawa:0.5A AC/DC max. Voltage Rating:125V AC/DC Hoʻokaʻaʻike Kūʻē:100mΩ Max. Kū'ē Insulation: 1000MΩ Min.500V DCOperating Temperature: -45ºC ~ + 85ºC Māhele No.

Hoʻohui Kāleka SIM Micro, 8Pin H1.5mm, ʻAno Hīkini KLS1-SIM-089

ʻIke Huahana Mea Hoʻohui Kāleka SIM Micro, 8Pin H1.5mm, ʻAno Hinged Mea Hale: Thermoplastic, UL94V-0. Terminal:Phosphor Bronze,T=0.15,NiPlated Under,Au Plated On ContactArea,G/F Plated on Soldertail. Shell:Stainless Steel,T=0.15,Ni PlatedUnder,G/F i hoʻopaʻa ʻia ma Soldertail. Kū'ē Pili Uila:60mΩ Max. Kū'ē Kū'ē: 1000MΩ Min. Dielectric Withstanding Voltage:500V AC No1 Minute. Ka lōʻihi:5000 Cycles.Operating Temperature: ...

Hoʻohui Kāleka SIM Micro, 6Pin H1.8mm, ʻAno Hinged KLS1-SIM-072

ʻIke Huahana Mea Hoʻohui Kāleka SIM Micro, 6Pin H1.8mm, ʻAno Hinged Mea: Hale: LCP, UL94V-0, ʻEleʻele. Terminal: Copper Alloy. Shell:Sila ʻole. Uila: Ka helu o kēia manawa: 1A Max. Ka helu Voltage: 30V DC max. Kū'ē Pili: 30mΩ Max. Kū'ē Kū'ē: 1000MΩ Min. Ka Voltage Dielectric: 500V rms / min. ʻO ka lōʻihi: 5000 Cycles. Ka Mahana Hana: -45ºC ~ + 85ºC Māhele No. Hōʻike PCS / CTN GW (KG) CMB (m3) OrderQty. ...

Hoʻohui Kāleka SIM Micro, 6Pin H1.5mm, ʻAno pā KLS1-SIM-075

ʻIke Huahana Mea Hoʻohui Kāleka SIM Micro,6Pin H1.5mm, ʻAno pā Mea: Insulator: Hi–Temperature Plastic, UL94V-0, ʻEleʻele. Terminal: Copper Alloy.Gold Flash Plating on allterminal,Aad 50u" min Nickel Underplated on allover. Shell:50u" Nickel Underplating on allover,Gold flash onsolder pad. Uila: Ka helu o kēia manawa:0.5A Voltage Rating Voltage:5.0 vrms Insulation Resistance:1000MΩ Min./500V DC Withstanding Voltage:250V ACrms No 1Minute ...

Hoʻohui Kāleka SIM Micro,6P, PUSH PULL, H1.5mm KLS1-SIM-099

ʻIke Huahana Mea Hoʻohui Kāleka SIM Micro,6P, PUSH PULL, H1.5mm Mea Hale: Thermoplastic, UL94V-0. Terminal: Copper Alloy, Gold Plated on ContactArea and Solder Tails, Nickel Plated Overall. Shell:Stainless Steel.Nickel Plated Overall.GoldPlated on solder huelo. Uila: Ka helu o kēia manawa: 1.0 A max. Kū'ē Pili: 30mΩ Max. Dielectric Me ka Voltage: 500V AC Kū'ē Kū'ē: 1000MΩ Min./500V DC Ke Ana Hana Hana: -45ºC~+8...

Hoʻohui Kāleka SIM Micro,8P, PUSH PULL, H1.5mm KLS1-SIM-091

ʻIke Huahana Mea hoʻohui Kāleka SIM Micro,8P, PUSH PULL, H1.5mm Uila: Hoʻoholo ʻia i kēia manawa:1.0A Ka Voltage i koho ʻia:30V Kūʻai Kūʻē: 50mΩ Max. Kū'ē Insulation: 1000MΩ Min./500V DC Dielectric Withstanding Voltage: 500V AC Solder abiltiy: 250oC~%% P5oC,10%%P0.5s Ka lōʻihi: 5000 Cycles Min.Contact Resistance:50mΩ Max.Operating Temperature: TN45ºC ~ ʻAʻohe. GW(KG) CMB(m3) OrderQty. Manawa O...

Hoʻohui Kāleka SIM Micro,6P,H1.45mm KLS1-SIM-046

ʻIke Huahana Mea Hoʻohui Kāleka SIM Micro,6P,H1.45mm Material: Insulator:Hi-Temperature Plastic,UL94V-0.Black. Terminal: Copper Alloy,50u" min Nickel underplated onallover,gole plated allover. Shell:Stainless Steel,50u" Nickel underplated onallover,gole flash on solder latch. Uila: Ka helu o kēia manawa:0.5 A Voltage Rating:5.0 V Insulation Resistance:500MΩ Min./500V DC Withstanding Voltage:250V AC No 1 minuke. Kū'ē pili:100mΩ ...

Hoʻohui Kāleka Micro SIM, 6P

Hoʻohui Kāleka Micro SIM, 6P

Hoʻohui Kāleka Micro SIM, 8P

Hoʻohui Kāleka Micro SIM, 8P

Hoʻohui Kāleka Micro SIM, 8P

Hoʻohui Kāleka Micro SIM, 6P

Hoʻohui Kāleka SIM Micro; PUSH PUSH, 6P+1P A i ʻole 8P+1P,H1.50mm KLS1-SIM-090

Hoʻohui Kāleka SIM Micro; PUSH PUSH, 6P A i ʻole 6P+1P, H1.35mm KLS1-SIM-069

ʻIke Huahana Hoʻohui Kāleka SIM Micro; PUSH PUSH, 6P A i ʻole 6P+1P, H1.35mm, Me ka leka ʻole. Material: Insulator: High TemperatureThermoplastic, UL94V-0 Contact: Copper Alloy,Plated 50U" NiOverall Contact Au 1U Shell:SUS,Plated 50U" Ni Overall Plated 1u"Au Selective Contact Area Electrical: Current Rating: 0.5A Max. Voltage Rating: 5V. Kū'ē: 1000M Min./500VDC Ambient Humidity Range: 95% RH Ma...

Hoʻohui Kāleka SIM Micro 8P, PUSH PULL, H2.4mm KLS1-SIM-044-8P

ʻIke Huahana Mea Hoʻohui Kāleka Micro SIM 8P, PUSH PULL, H2.4mm Material: Base: Hi-Temp Thermoplastic, UL94V-0.Black. Hoʻokaʻaʻikeʻikepili: Copper Alloy, Gold Plated. Shell: Ke kila ʻole, i uhi ʻia i ke gula. Uila: Kū'ē Kū'ē: 50mΩ maʻamau, 100Ω Max. Kū'ē Kū'ē:> 1000MΩ / 500V DC. 3. Solderability Vapor pae:215ºC.30sec.Max. IR feflow:250ºC.5sec.Max. Kuʻi lima lima:370ºC.3sec.Max. Ka Mahana Hana: -45ºC~+105&o...

Hoʻohui Kāleka SIM Micro 6P, PUSH PULL, H2.4mm KLS1-SIM-044-6P

ʻIke Huahana Mea Hoʻohui Kāleka Micro SIM 6P, PUSH PULL, H2.4mm Material: Base: Hi-Temp Thermoplastic, UL94V-0.Black. Hoʻokaʻaʻikeʻikepili: Copper Alloy, Gold Plated. Shell: Ke kila ʻole, i uhi ʻia i ke gula. Uila: Kū'ē Kū'ē: 50mΩ maʻamau, 100Ω Max. Kū'ē Kū'ē:> 1000MΩ / 500V DC. 3. Solderability Vapor pae:215ºC.30sec.Max. IR feflow:250ºC.5sec.Max. Kuʻi lima lima:370ºC.3sec.Max. Ka Mahana Hana: -45ºC~+105&o...

Hoʻohui Kāleka SIM; PUSH PUSH, 6P+2P, H1.80mm, Me ka leka a me ka ʻole o ka leka. KLS1-SIM-110

ʻIke Huahana Hoʻohui Kāleka SIM; PUSH PUSH,6P+2P,H1.80mm Me ka pou a i ʻole me ka ʻole o ka post.Material:Housing Material: LCP UL94V-0Contact Material: Tin-BronzePackage: Tape and Reel PackageElectrical Characteristics:Voltage rating: 100V ACCurrent Rating: 0Vstand. AC/1MinuteInsulation kū'ē: ≥1000ΜΩContact pale: ≤30mΩLife:

Hoʻohui Kāleka SIM, PUSH PUSH, 8P+1P, H1.9mm, me ka Post KLS1-SIM-108

ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH, 8P + 1P, H1.9mm, me ka Post Material: Hale: Hi-Temp Plastic, UL94V-0.Rated. Hoʻopili: Copper Alloy. Huina: Copper Alloy. Palena: Wahi Hoʻopili: ʻAla gula. Solder wahi: 80u "Min, Matte tin alloy plated. Ma lalo o ka pā: 30u" min, Nickel. Shell: 30u" Min, Nickel plated overallSolder wahi: Gole flash. Uila: Ka helu o kēia manawa: 0.5A. Me ka Voltage Kū'ē: AC500V rms Kū'ē Kū'ē: 1000MΩMin, Ma DC 500V ...

Hoʻohui Kāleka SIM, PUSH PUSH,6P+1P,H1.9mm,me Post KLS1-SIM-107

ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH, 6P + 1P, H1.9mm, me ka Post Material: Hale: Hi-Temp Plastic, UL94V-0.Rated. Hoʻopili: Copper Alloy. Shell: Copper Alloy/Sila. Palena: Wahi Hoʻopili: ʻAla gula. Solder wahi: 80u "Min, Matte tin alloy plated. Ma lalo o ka pā: 30u" min, Nickel. Shell: 30u" Min, Nickel plated holoʻokoʻa Solder wahi: Gole flash. Uila: kēia manawa helu: 0.5A. Withstanding Voltage: AC500V rms Insulation Resistance:1000MΩMin, At...

Hoʻohui Kāleka SIM; PUSH PUSH,6P,H1.85mm KLS1-SIM-106

ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH, 6P, H1.85mm, me ka Hale Paʻi: Hi-Temp Plastic, UL94V-0. Rated. Hoʻopili: Copper Alloy. Puhi:SUS. Hoʻopau: Ua uhi ʻia ke gula ma ka wahi conatct, ua uhi ʻia ka tin ma nā huelo solder. Māhele No. Hōʻike PCS/CTN GW(KG) CMB(m3) OrderQty. Kauoha Manawa

Hoʻohui Kāleka SIM, PUSH PUSH, 6P, H1.85mm, me ka ʻole o ka Post KLS1-SIM-087

ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH, 6P, H1.85mm, me ka ʻole o ka Post Material: Insulator: H-Temperature Plastic, UL94V-0.Black. Hoʻokaʻaʻike: Copper Alloy,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u" min Nickel Underplated on Allover,Gold Plating on Contact Arer,80u"min Tin on Solder Tail. Shell:50u" Nickel Underplated on Allover,Gold Flash on Solder Latch. Uila: Loaʻa i kēia manawa:0.5A. Voltage Rating:5.0 Vrms. Hoʻopaʻa i ka Insulation ...
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