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Hoʻohui kāleka Micro SD HINGED TYPE, H1.9mm KLS1-TF-017

ʻIke Huahana Hoʻohui kāleka Micro SD HINGED TYPE,H1.9mm Material: Insulator: High Temperature Thermoplastic Flammability Raring,UL94V-0,Black. Hoʻokaʻaʻike:Copper Alloys uhi:Stainless Steel Contact Area Plating:Gold voer Ni Solder Tail Coplanarity Pono i loko o 0.10MAX. Māhele No. Hōʻike PCS/CTN GW(KG) CMB(m3) OrderQty. Kauoha Manawa

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.4mm, me ka pine CD KLS1-TF-016

Product Information Micro SD card connector push push,H1.4mm,me CD pin Notes: 1.Coplanarity spec.for all solder tall and solder pad is 0.10mm 2.Electric features: 2-1.Current Rating:0.5 Amp.max. 2-2.Voltage:100V DC max. 2-3.Low pae conatct kū'ē:100mΩ Max. 2-4.Dielectric Withstanding Voltage:AC500V rms. 2-5. Kū'ē Kū'ē: 1000MΩ Min. (Hoʻopau) 100MΩ Min. 3. Mechanical hiʻona: 3-1. Durability:5000 Cycles. 3-2.Operatin...

ʻO ka mea hoʻohui kāleka Micro SD e huki huki, H1.42mm, me ka pine CD KLS1-TF-015

ʻIke Huahana Mea hoʻohui kāleka Micro SD pahu huki huki, H1.42mm, me ka pine CD Material: Metala ʻiʻo: ʻAi ʻole, Nickel holoʻokoʻa 50u" Hale: Liouid crystal polymer, UL94V-0

ʻAʻohe mea hoʻohui kāleka Micro SD, H1.8mm KLS1-TF-014

ʻIke Huahana Mea hoʻohui kāleka Micro SD ʻaʻohe pana, H1.8mm Material: Hale:LCP,UL94V-0, ʻEleʻele. Terminal: Copper Alloy, Gold Selective on Mating Area. Shell:Iron Electrical: Voltage Rating:5V I kēia manawa:0.5 A Max. Kū'ē Pili: 100mΩ Max. Kū'ē Kū'ē: 1000MΩ Min. Me ka Voltage: 500V 1 Minute. Ka lōʻihi: 10000 Cycles. Māhele No. Hōʻike PCS/CTN GW(KG) CMB(m3) OrderQty. Kauoha Manawa

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.4mm, me ka pine CD KLS1-TF-012

ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD pana i ka pana,H1.4mm, me ka pine CD Material: Insulator: Thermoplastic High Temperature, UL94V-0. Terminal: Copper Alloy, Plated 50u "Ni Overall. Plated Au Selective Contact Area Plated 100u" Sn Over Ni On Solder Area. Shell:Plated 50u" Ni Ka holoʻokoʻa. Plated Au Selective Contact Area Electrical: ʻO kēia manawa: 0.5 A AC/DC max. Voltage Rating:125V AC/DC Ambient Humidity Range:95% RH Max. Hoʻokaʻaʻike kū'ē:100m&Om...

Kāleka SD Micro CONN; ANO HINGED, H1.5mm & H1.8mm KLS1-TF-007

ʻIke huahana Micro SD Card CONN;HINGED TYPE,H1.5mm & H1.8mm Material: Insulator:Hi-Temperature Plastic,UL94V-0.Black. Terminal: Copper Alloy.AU Plating on all terminal contact area, and tin plating on solder huelo wahi. Shell:Sila ʻole. Uila: Ka helu o kēia manawa:0.5 A Voltage Rating:5.0 vrms Insulation Resistance:1000MΩ Min./500V DC Withstanding Voltage:250V AC No 1 minuke. Kū'ē Hoʻopili:100mΩ Max.AT 10mA/20mV Max Hana Hana ...

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD ma waena, H1.0mm, hoʻopaʻa me ka pine CD KLS1-TF-003E

ʻIke huahana Mid Mount Micro SD card connector push push,H1.0mm,luu me ka CD pin Material: Hale: Kiʻekiʻe Temperature Thermoplastic,UL94V-0

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.85mm, me ka pine CD KLS1-TF-003D

ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD pana pana,H1.85mm, me ka pine CD Material: Insulator: Thermoplastic High Temperature, LCP,UL94V-0. Hoʻokaʻaʻike: Copper Alloy T=0.15,Plated 50u "Ni Overall. Plated Au Selective Contact Area Plated 30u"-70u" Sn Over Ni On Solder Area. Shell:T=0.15,Plated 30u" Ni Overall min. Papa 0.5u" Au Selective ContactArea Uila: Loaʻa kēia manawa:0.5mA amx. Voltage Rating:3.3V Ambient Humidity Range:95% RH Ma...

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.85mm, me ka pine CD, GOLD KLS1-TF-003C

ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD pana pana, H1.85mm, me ka pine CD, GOLD Material: Insulator: Thermoplastic Kiʻekiʻe, LCP, UL94V-0. Hoʻokaʻaʻike: Copper Alloy T=0.15,Plated 50u "Ni Overall. Plated Au Selective Contact Area Plated 30u"-70u" Sn Over Ni On Solder Area. Shell:T=0.15,Plated 30u" Ni Overall min. Hoʻopili ʻia 0.5u" Au koho Hoʻokaʻaʻike wahi. Uila: Ka helu o kēia manawa: 0.5mA AC/DC amx. Voltage Rating: 125V AC/DC Ambient Humidit...

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD ma waena, H1.0mm, me ka pine CD KLS1-TF-003A

ʻIke Huahana ʻO Mid Mount Micro SD card connector push push,H1.0mm,me CD pin Material: Insulator: High Temperature Thermoplastic,UL94V-0. Hoʻokaʻaʻike: Copper Alloy ,Plated 50u "Ni Overall. Plated Au Selective Contact Area Plated 100u" Sn Over Ni On Solder Area. Shell:Plated 50u" Ni Ka holoʻokoʻa. Plated 1u" Au Selective Contact Area. Uila: Ka helu o kēia manawa:0.5mA AC/DC amx. Voltage Rating:125V AC/DC Ambient Humidity Range:95% RH Max. Hoʻokaʻaʻike...

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.85mm, me ka pine CD KLS1-TF-003

ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD pana pana,H1.85mm, me ka pine CD Material: Insulator: Thermoplastic High Temperature,UL94V-0. Hoʻokaʻaʻike: Copper Alloy T=0.15,Plated 50u "Ni Overall. Plated Au Selective Contact Area Plated 30u"-70u" Sn Over Ni On Solder Area. Shell:T=0.15,Plated 30u" Ni Overall min. Papa 0.5u" Au Waena Hoʻokaʻaʻike koho Uila: Ka helu o kēia manawa:0.5 A Voltage Rating:3.3V Ambient Humidity Range:95% RH Max. Hoʻopili ...

Hoʻohui Kāleka Micro SD; TYPE HINGED, H1.9mm KLS1-TF-002

ʻIke Huahana 1.1mmTF Card ConnectorMaterial:Housing Material: LCP UL94V-0Contact Material: Tin-BronzePackage: Tape and Reel Package Nā ʻano uila: Voltage rating: 100VAC Current Rating: 0.5A (MaxWithstand voltage: 200V AC/1MinuteInsulation resistance: 200V AC/1MinuteInsulation resistance: 200V AC/1MinuteInsulation resistance ≤30MΩKe ola:

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.85mm, pani ʻia KLS1-TF-001B

ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD pana pana,H1.85mm,Paʻa mau Mea: Hale:LCP,UL94V-0

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.85mm, pani ʻia KLS1-TF-001

ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD pana pana,H1.85mm,Paʻa mau Mea: Hale: Thermoplastic Kiʻekiʻe, UL94V-0

Hoʻohui Kāleka SIM, PUSH PUSH, 6P+2P, H2.25mm, me ka Post KLS1-SIM-030A

ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH, 6P + 2P, H2.25mm, me ka ʻole o ka Post Material: Hale: Hi-Temp Plastic, UL94V-0.Rated. Hoʻopili: Copper Alloy. ʻImi: ʻAiʻa ʻole.SUS 301,T=0.20mm. Plating: Contact area:G/F Plated over 30u" Nickel Solder area:80u" Tin Plated over 30u" Nickel.Under plate:30u" Min Nickel. Shell: 30u" Min, Nickel Plated Over All, SolderArea: Gold Flash

Hoʻohui Kāleka SIM, PUSH PUSH, 6P+2P, H1.85mm, me ka ʻole o ka Post KLS1-SIM-030

ʻIke Huahana Mea Hoʻohui Kāleka SIM, PUSH PUSH, 6P+2P, H1.85mm, me ka ʻole o ka Post Material: Insulator: H-Temperature Plastic, UL94V-0.Black. Hoʻokaʻaʻike: Copper Alloy,T=0.15mm;Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u" min Nickel Underplated on Allover,Gold Plating on Contact Arer,80u" min Tin on Solder Tail. Shell:50u" Nickel Underplated on Allover,Gold Flash on Solder Latch. Uila: Ratin o kēia manawa...

Hoʻohui Kāleka SIM 6P, PUSHPULL, H2.2mm H2.7mm H2.9mm KLS1-SIM-015

ʻIke Huahana 6P Kāleka Kāleka Hoʻohui, PUSH PULL, Rol pack,H2.0mm,H2.2mm,H2.7mm,H2.9mm Ka ʻIke Kauoha:KLS1-SIM-015-6P-H2.7Pins:6pinsKe kiʻekiʻe:H2.0mm,H2.2mm,H2.7mm,H2.9mm Material: Noho: Hi-Temp.Plastic,UL94V-0.Black. Terminal: Copper Alloy, (T=0.15mm),Gold Plated Over Nickel. Laka: Copper Alloy,(T=0.20mm),Tin Plated on Nickel. Uila: Ka helu o kēia manawa: 1.0 A max. Kū'ē Pili: 30mΩ Max. Dielectric Me ka Voltage: 500V AC RMS No Hoʻokahi Minute...

Hoʻohui Kāleka SIM;PUSH PULL,6P+2P,H3.0mm KLS1-SIM-C727-2

ʻIke Huahana Mea Hoʻohui Kāleka SIM; PUSH PULL, 6P+2P, H3.0mm, Roll pack. Material: Base: Hi Temp Thermoplastic, Black UL94V-0 Cover: Stainless Steel Data Contact: Copper Alloy,Gold plated Switch Contact 1: Copper Alloy,Gold plated Switch Contact 2: Copper Alloy,Gold plated General Characteristics Nā Ana: 15.85L*16.50W*3.00H mm P0.78% Weight: Ka lōʻihi: 5000 mau pōkole min. ʻAno Uila Kūʻai Kūʻē: 50mΩtypical 100mΩ Max. I loko o...

6P Hoʻohui Kāleka SIM ʻAno Hined, H1.9mm KLS1-SIM-019

ʻIke Huahana 6P Kāleka SIM Connector ʻAno Hinged,H1.9mm Order Information:KLS1-SIM-019-6P-RPins:6pinsR=Roll pack Material: Hale:LCP,UL94V-0.Black. Terminal:C5210R-EH T=0.15mm Shell:SUS304R-1/2H,T=0.20mmOperatingTemperature:-45ºC~+105ºC Part No. wehewehe PCS/CTN GW(KG) CMB(m3) OrderQty. Kauoha Manawa

6P Hoʻohui Kāleka SIM ʻAno Hined, H1.8mm KLS1-SIM-018A

Huahana Huahana 6P SIM Card Connector Hinged type,H1.8mm Order Information:KLS1-SIM-018A-6P-H1.8-RPins:6pinsH1.8=Height 1.8mmR=Roll pack NOTES: 1.0 RATING. 1.1 VOLTAGE: 12 VAC (rms) 1.2 CURRENT: 1 AMPERES MAX. NĀ HOʻOPIʻI UILA NO KA HOʻOPIʻI: 2.1 KA HOʻOPIʻI:60m? 2.2 INSULATION RESISTANCE: 1000M? 2.3 DIELECTRIC WITHSTANDING VOLTAGE: 500V AC NO 1 MINUTE 3.0 OPERATION OLA: 5000 CYCLES 4.0Operating Temperature:-45ºC~+105ºC...

6P

6P

6P & 8P Hoʻohui Kāleka SIM ʻAno Hined, H2.8mm KLS1-SIM-010

ʻIke Huahana 6P & 8P Kāleka SIM Connector Hinged type,H2.8mm Order Information:KLS1-SIM-010-6P-1-RPins:6pin,8pin0=Me ka peg 1=Me ka pegR=Roll pack T=Tube pack Material:Housing Material: LCP UL94V-0Contact Material: Gold0SolderContactArea:BronzeContact TinPackage: Tape and Reel Package Nā ʻano uila: Voltage rating: 100V ACCurrent Rating: 3.0A MaxWithstand voltage: 500V AC/1MinuteInsulation resistance: ≥5000Μ&Omeg...

6P & 8P Hoʻohui Kāleka SIM ʻAno Hined, H2.5mm KLS1-SIM-010A

Nā Kiʻi Huahana ʻIke Huahana 6P & 8P Kāleka SIM Connector ʻAno Hinged,H2.5mm Ka ʻIke Kauoha: KLS1-SIM-010A-H2.5-6P-1-R Nā Pins:6pin,8pin 0=Me ka peg 1=Me ka peg ʻole R=Roll pack Material: Insulator kino:LCP. Kala: ʻEleʻele Hoʻopili: Phosphor Bronze Plating: Finsh: Tin Gold a Duplex plated. Kūlana:Gold flash 3u” a puni Nickel Electrical: Ka helu o kēia manawa:0.5A. Dielectric Withstanding Voltage:500V AC Insulation Resistance:1000MΩ Min Contact Resistance:30mΩ Max. Life: 10000 Cy...
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