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Nā mea hoʻopili kāleka hoʻomanaʻo a me nā mea hoʻohui kāleka SD & Nā mea hoʻohui CompactFlash

CFast Host Connector,H8.35,ʻano LOCK KLS1-CFA-003B

Nā Kiʻi Huahana ʻIke Huahana CFast Host Connector,H8.35,LOCK type Mea Hale:Engineering plastic,LCP with GF reinforced,black per,UL 94V-0,rate. Terminal: Phosphor Bronze, no JIS 5210,0.2T Puna: Piano thread Metala uhi:Stainless steel sheet SUS304 0.2T, Plating Solder zone:100u" matte Tin,50u" min, Nickel underplating over all.

CFast Host Connector,H8.35,PUSH PUSH Type KLS1-CFA-003A

Nā Kiʻi Huahana ʻIke Huahana CFast Host Connector,H8.35,PUSH PUSH Type Material Housing:Engineering plastic,LCP with GF reinforced,black per,UL 94V-0,rate. Slider: ʻenekinia plastic, LCP me GF i hoʻoikaika ʻia, ʻeleʻele no kēlā me kēia, UL 94V-0, uku. Terminal:Phosphor Bronze,no JIS 5210,0.2T Puna: Piano thread Metala uhi:Stainless steel sheet SUS304 0.2T, Crank:Stainless rod SUS 304. Kāleka laka:Stainless steel SUS 304 Plating Solder zone:100u” matte Tin,50u” mining o...

CFast Host Connector,H6.05,ʻano LOCK KLS1-CFA-002B

Nā Kiʻi Huahana ʻIke Huahana CFast Host Connector,H6.05, LOCK type Mea Hale Hale: Engineering plastic, LCP me GF i hoʻoikaika ʻia, ʻeleʻele no kēlā me kēia, UL 94V-0, uku. Terminal: Phosphor Bronze, no JIS 5210,0.2T Metala uhi:Stainless steel sheet SUS304 0.2T, Plating Solder zone:100u "matte Tin,50u" min, Nickel underplating over all.

CFast Host Connector,H6.05,PUSH PUSH Type KLS1-CFA-002A

Nā Kiʻi Huahana ʻIke Huahana CFast Host Connector,H6.05,PUSH PUSH Type Material Housing:Engineering plastic,LCP with GF reinforced,black per,UL 94V-0,rate. Slider: ʻenekinia plastic, LCP me GF i hoʻoikaika ʻia, ʻeleʻele no kēlā me kēia, UL 94V-0, uku. Terminal:Phosphor Bronze, no JIS 5210,0.2T Puna: Piano thread Metala uhi:Stainless steel sheet SUS304 0.2T, Crank:Stainless rod SUS 304. Kāleka laka:Stainless steel SUS 304 Plating Contacts:30u” gula plating ma ka wahi pili a me 100u” min....

Mea Hoʻohui Hoʻokipa CFast, Vertical SMT KLS1-CFA-001

Nā Kiʻi Huahana ʻIke Huahana CFast Host Connector, Vertical SMT Material Housing: Engineering plastic, LCP me GF i hoʻoikaika ʻia, ʻeleʻele no kēlā me kēia, UL 94V-0, uku. Terminal: Phosphor Bronze, no JIS 5210,0.2T Plating Contacts:30u "gula plating ma ka contact wahi a me 100u" min.matte Tin ma soldering zone, ma luna o ka pau hui underplated me 50u "min, Nickel ma luna o nā mea a pau.

Hoʻohui kāleka CF 50P,L13.75mm,H3.9mm KLS1-CF-003

Nā Kiʻi Huahana ʻIke Huahana Kāleka CF Hoʻohui 50P,L13.75mm,H3.9mm Mea: Hale: Thermoplastic,UL94V-V0.White. Hoʻokaʻaʻike: Copper Alloy 0.40T.Gold Flash On Contact Area Matte-Tin plated on solder huelo a puni Nickel plated. Hoʻoponopono: Copper Alloy 0.30T.Tin plated on solder huelo a puni Nickel plated. Uila: Ka helu o kēia manawa: 0.5A AC, DC. Kū'ē Pili: 40mΩ Max. Kū'ē Kū'ē: 1000MΩ Min. Me ka Voltage: 500V AC/minuke Hana Hana: -45ºC~+85ºC

Hoʻohui kāleka CF 50P,L26mm,H5.4mm KLS1-CF-002

Nā Kiʻi Huahana ʻIke Huahana Kāleka CF Mea hoʻohui 50P,L26mm,H5.4mm Mea Hale:LCP, UL94V-0 Uila Ka helu o kēia manawa: 0.5A,AC,DC Kūleʻa hoʻopili:40mΩ max Kūʻokoʻa kūʻokoʻa:1000ΜΩ min E kū i ka uila: 500V AC/minuke Keʻena Hana: -45ºC~+85ºC.

Hoʻohui kāleka CF 50P,L26.9mm,H3.85mm KLS1-CF-001

Nā Kiʻi Huahana ʻIke Huahana Kāleka CF Mea hoʻohui 50P,L26.9mm,H3.85mm Mea Hale:LCP, UL94V-0 Uila Ka helu o kēia manawa: 0.5A,AC,DC Hoʻokaʻaʻike pale:40mΩ max Kūʻokoʻa kūʻokoʻa:1000ΜΩ min E kū i ka uila: 500V AC/minuke: -45ºC ~ 45ºC~

Hoʻohui kāleka SD 4.0 ʻAʻohe pana,H3.0mm KLS1-SD4.0-002 & KLS1-SD4.0-002A

Nā Kiʻi Huahana ʻIke Huahana SD 4.0 Kāleka mea hoʻohui NO ka pana, H3.0mm Material: Insulator: LCP helu ʻia, UL94V-0， ʻEleʻele. Hoʻokaʻaʻike:Phosphor Bronze.Tin 80u” Min ma Solder Tail,Gula i koho ʻia ma ka wahi hoʻopili. Me ka Voltage: 500VAC/1 Minute Ka lōʻihi: 10000 Cyc...

ʻO ka mea hoʻohui kāleka SD 4.0 pana pana,H3.0mm,Huli KLS1-SD4.0-001A

Nā Kiʻi Huahana ʻIke Huahana ʻO SD 4.0 ka mea hoʻokuʻu kāleka pahu pana,H3.0mm,Reverse Material: Insulator: LCP helu ʻia,UL94V-0， ʻEleʻele. Hoʻokaʻaʻike:Phosphor Bronze.Tin 80u” Min ma Solder Tail,Gula i koho ʻia ma ka wahi hoʻopili. ʻO ka Voltage Paʻa: 500VAC/1 Minute.

ʻO ka mea hoʻohui kāleka SD 4.0 pana i ka pahu, H3.0mm KLS1-SD4.0-001

Nā Kiʻi Huahana ʻIke Huahana SD 4.0 ka mea hoʻokuʻu kāleka pahu pana, H3.0mm Material: Insulator: LCP helu ʻia, UL94V-0， ʻEleʻele. Hoʻokaʻaʻike:Phosphor Bronze.Tin 80u” Min ma Solder Tail,Gula i koho ʻia ma ka wahi hoʻopili. Voltage: 500VAC / 1 Minute Kū'ē Kū'ē: 100mΩ Nā pōʻai male: 10000 Cycles &...

Huki huki ka mea hoʻohui kāleka SD, H2.5mm KLS1-TF-020

Nā Kiʻi Huahana ʻIke Huahana Kāleka SD hoʻokuʻu huki huki,H2.5mm Material: Hale:Hi-Temp plastic,UL94V-0. Hoʻopili: Copper Alloy. Nail: Ke kila ʻole. Hoʻopau: Hoʻokaʻaʻike:G/F Gold plated on conatct area; Hoʻopili ʻia ʻo G/F ma nā huelo solder, Base Nickel 50u” Min Nail:50u” Nickel Under,100u” Tin Overall.

Huki huki ka mea hoʻohui kāleka SD, H2.5mm & H3.75mm KLS1-TF-006

Nā Kiʻi Huahana ʻIke Huahana Kāleka SD hoʻokuʻu huki huki,H2.5mm & H3.75mm Material: Hale: Thermoplastic,UL94V-0.Natural. Terminal: Copper Alloy, Au Plating.Contact Area:G/F; Matte Tin Plated on Soldering. Shell:Sila ʻole. Uila: Kū'ē Kū'ē: 80mΩ Max. Kū'ē Kū'ē: 100MΩ Min. Dielectric Withstanding Voltage:500V AC. Nā ʻano Mechanical Paʻa Manaʻo: Min.100gf/Pin.

Hoʻokuʻu ka mea hoʻohui kāleka SD, H3.4mm, me ka pine CD KLS1-TF-005S

Nā Kiʻi Huahana ʻIke Huahana Kāleka SD hoʻokuʻu huki huki,H3.4mm,me CD pin Material: Insulator:Thermal Plastic UL94V-0 Nā Hoʻokaʻaʻike: Copper Alloy Hōʻike: Ka helu o kēia manawa: 1Amps Max Hoʻokaʻaʻike pale: 100mΩ Max. ʻO ke kūʻokoʻa ʻana: 1000ΜΩ Min. Kaʻa male: 10000 mau minuke. Hana wela:-40ºC~+85ºC

Hoʻokuʻu ka mea hoʻohui kāleka SD, H3.4mm, me ka pine CD KLS1-TF-005

Nā Kiʻi Huahana ʻIke Huahana Kāleka SD hoʻokuʻu huki huki,H3.4mm,me CD pin Material: Hale: High Temperature Thermoplastic Contacts:Copper Alloy Specification: Loaʻa kēia manawa:0.5A Voltage Rating:250VRM Contact resistance:100mΩ Max. ʻO ke kūʻokoʻa ʻana: 100ΜΩ Min. Dielectric Withstanding Voltage:500VAC Mating Cycle:10000 Cycles Minute. Hana wela:-25ºC~+90ºC

Hoʻokuʻu ka mea hoʻohui kāleka SD, H2.75mm, me ka pine CD KLS1-SD112

Nā Kiʻi Huahana ʻIke Huahana Kāleka SD hoʻokuʻu i ka huki huki,H2.75mm,me CD pin Material: Hale: High Temperature Thermoplastic. Hoʻopili: Copper Alloy. Shell: Copper Alloy, Kāwili gula ma nā huelo solder, Underplated Nickel ma luna o nā mea a pau. Plating: Contact Area:Gold Plated over Ni. Hulo Solder:30u” Min Sn Plated Ma luna o Ni. Uila: Ka helu o kēia manawa: 0.5A. Voltage Rating: 250VRMS Kū'ē Kū'ē: 40mΩ Dielectric Kū'ē Voltage: 500V AC. Kū'ē Kū'ē: 100MΩ Mana Hoʻokomo: 4...

Hoʻohui kāleka SD mauna, huki huki, H1.75mm, me CD Pin KLS1-SD003

Nā Kiʻi Huahana ʻIke Huahana ʻO Mid Mount SD card connector, pana huki,H1.75mm,me CD Pin Material: Hale:LCP S475,UL94V-0.Black. Shell:Sila ʻole SUS304. Hoʻokaʻaʻike: Copper Alloy C5210. Hoʻopau: Hoʻokaʻaʻike:Gold Plated on Contact Area.Matte Tin 100u "Min On Soldertail Area.50u" Min Nickel Plating Overall. Shell:30u” Min Solderable Nickel Plating Overall.

Hoʻokuʻu ka mea hoʻohui kāleka SD, H2.8mm, me ka pine CD KLS1-SD002

Nā Kiʻi Huahana ʻIke Huahana Kāleka SD hoʻokuʻu huki huki,H2.8mm,me CD pin Material: Hale:LCP,UL94V-0.Black. Terminal:C5191R-EH T=0.20,Contact G/F,Ni 40u” min,Solding Tin 80u WP Pin:C5191R-EH T=0.20,Contact G/F,Ni 40u”min,Solding Tin 80u CD Pin:C5191R-EH,TCon=0.20FCon=0.20,TCon=0.20u” min, Kino Kuʻi 80u Shell: C2680-H, T = 0.20, NI 40u "min. Uila: Hoʻokaʻaʻike i kēia manawa: 0.5Amperes. Dielectric Withstanding Voltage: AC500V rms. Kū'ē ka Insulation...

Hoʻokuʻu ʻia ka mea hoʻohui kāleka SD, H2.8mm, me ka pine CD KLS1-SD-001 / KLS1-SD-101

Nā Kiʻi Huahana ʻIkepili Huahana Kāleka SD hoʻokuʻu i ka pahu,H2.8mm,me CD pin Material: Insulator: High Temperature Thermoplastic,UL94V-0. Hoʻokaʻaʻike: Copper Alloys.Plated 50u” Ni Overall Plated Au Selective Contact Area,Plated 100u” Sn Over Ni On Solder Area. Shell:Plated 50u” Ni Ka holoʻokoʻa. Uila: Voltage Rating:125V AC/DC kēia manawa: 0.5mA AC/DC Max. Ambient Humidity Range:95% RH Max. Hoʻokaʻaʻike kū'ē:100mΩ Max. Insulation kū'ē: 1000MΩ Min./500V DC ...

5 i loko o 1 Kāleka Hoʻohui, H4.3mm KLS1-MUT51-001

Nā Kiʻi Huahana ʻIke Huahana 5 i loko o 1 Kāleka Hoʻohui,H4.3mm Material Insulator:Hi-Temperature Plastic,UL94V-0,Ka waihoʻoluʻu:ʻEleʻele Terminal: Copper Alloy,Selective Gold Flash Plating On Contact Area,AND 50U" Min Nickel Underplated On Allover Shell:Stainless Stell,50u" Nickel Underplated On Allover,PLulation0Gold Flashed On Allover,PGAD0 min.AT DC 500V DC E kū i ka uila: 250V ACrms NO 1 Minute Hoʻokaʻaʻike pale: 100mΩ max.AT 10mA/20mV max Ratin o kēia manawa...

Hoʻokuʻu ʻia ka mea hoʻohui kāleka SD micro, H1.5mm KLS1-TF-011-H1.5-R

Nā Kiʻi Huahana ʻIke Hula Mea hoʻohui kāleka Micro SD pana huki,H1.5mm

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD 4.0, H1.3mm KLS1-SD4.0-003

Nā Kiʻi Huahana ʻIke Huahana ʻO Micro SD 4.0 ka mea hoʻokuʻu kāleka pahu pana,H1.3mm Material: Insulator: Thermal Plastic,Pated UL94V-0. Hoʻopili: Phosphor Bronze. Shell: Ke kila kila. Hoʻokaʻaʻike Plating: Underplate: 50u "-100u" Nickel Hoʻokaʻaʻike wahi:Gold Flash Solder huelo wahi:100u"-200u" Tin Uila: Hana Voltage:10V kēia manawa helu:0.5A Min. Kū'ē Pili: 100mΩ Max. Palekana Insulation: 1000MΩ Dielectric Withstanding Voltage: 500VAC / 1 Minute. Nā pōʻaiapili male:...

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD 4.0 KLS1-SD4.0-004

Nā Kiʻi Huahana ʻIke Huahana ʻO Micro SD 4.0 ka mea hoʻokuʻu kāleka pahu pahu Mea: Plastic:LCP,Thermoplastic UL94V-0.Black. Hoʻopili: Copper Alloy. Shell:Sila ʻole. Plating: Contact Area:Au 3u” Over Ni 50u”. ʻĀpana Hiʻu Kūʻai: ʻOi ʻia ʻo 80u” Min. Ma luna o Ni 50u”. Solderability: Over Plating Ni 50″ Ma luna o nā mea a pau.

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.28mm, me ka pine CD KLS1-SD113

Nā Kiʻi Huahana ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD pana pana,H1.28mm, me ka pine CD Material: Insulator: High Temperature Thermoplastic LCP SZ6505,UL94V-0,Black. Hoʻokaʻaʻike: Berylliun Copper (7035-TM06, T = 0.15mm), Plated 80u "min Ni holoʻokoʻa plated 1u" min Au ma luna o Ni ma solder wahi. Shell:SUS301-3/4H T=0.10mm.Solder huelo plated 1u” min Au overll 50u” min Ni. Uila: Ka helu o kēia manawa:0.5A AC/DC max. Voltage Rating:12V AC/DC Ambient Humidity Range:95% RH Max. ...
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