Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.4mm, me ka pine CD KLS1-TF-012
ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD pana i ka pana,H1.4mm, me ka pine CD Material: Insulator: Thermoplastic High Temperature, UL94V-0. Terminal: Copper Alloy, Plated 50u "Ni Overall. Plated Au Selective Contact Area Plated 100u" Sn Over Ni On Solder Area. Shell:Plated 50u" Ni Ka holoʻokoʻa. Plated Au Selective Contact Area Electrical: ʻO kēia manawa: 0.5 A AC/DC max. Voltage Rating:125V AC/DC Ambient Humidity Range:95% RH Max. Hoʻokaʻaʻike kū'ē:100m&Om...
Kāleka SD Micro CONN; ANO HINGED, H1.5mm & H1.8mm KLS1-TF-007
ʻIke huahana Micro SD Card CONN;HINGED TYPE,H1.5mm & H1.8mm Material: Insulator:Hi-Temperature Plastic,UL94V-0.Black. Terminal: Copper Alloy.AU Plating on all terminal contact area, and tin plating on solder huelo wahi. Shell:Sila ʻole. Uila: Ka helu o kēia manawa:0.5 A Voltage Rating:5.0 vrms Insulation Resistance:1000MΩ Min./500V DC Withstanding Voltage:250V AC No 1 minuke. Kū'ē Hoʻopili:100mΩ Max.AT 10mA/20mV Max Hana Hana ...
Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.85mm, me ka pine CD KLS1-TF-003D
ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD pana pana,H1.85mm, me ka pine CD Material: Insulator: Thermoplastic High Temperature, LCP,UL94V-0. Hoʻokaʻaʻike: Copper Alloy T=0.15,Plated 50u "Ni Overall. Plated Au Selective Contact Area Plated 30u"-70u" Sn Over Ni On Solder Area. Shell:T=0.15,Plated 30u" Ni Overall min. Papa 0.5u" Au Selective ContactArea Uila: Loaʻa kēia manawa:0.5mA amx. Voltage Rating:3.3V Ambient Humidity Range:95% RH Ma...
Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.85mm, me ka pine CD, GOLD KLS1-TF-003C
ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD pana pana, H1.85mm, me ka pine CD, GOLD Material: Insulator: Thermoplastic Kiʻekiʻe, LCP, UL94V-0. Hoʻokaʻaʻike: Copper Alloy T=0.15,Plated 50u "Ni Overall. Plated Au Selective Contact Area Plated 30u"-70u" Sn Over Ni On Solder Area. Shell:T=0.15,Plated 30u" Ni Overall min. Hoʻopili ʻia 0.5u" Au koho Hoʻokaʻaʻike wahi. Uila: Ka helu o kēia manawa: 0.5mA AC/DC amx. Voltage Rating: 125V AC/DC Ambient Humidit...
Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD ma waena, H1.0mm, me ka pine CD KLS1-TF-003A
ʻIke Huahana ʻO Mid Mount Micro SD card connector push push,H1.0mm,me CD pin Material: Insulator: High Temperature Thermoplastic,UL94V-0. Hoʻokaʻaʻike: Copper Alloy ,Plated 50u "Ni Overall. Plated Au Selective Contact Area Plated 100u" Sn Over Ni On Solder Area. Shell:Plated 50u" Ni Ka holoʻokoʻa. Plated 1u" Au Selective Contact Area. Uila: Ka helu o kēia manawa:0.5mA AC/DC amx. Voltage Rating:125V AC/DC Ambient Humidity Range:95% RH Max. Hoʻokaʻaʻike...
Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.85mm, me ka pine CD KLS1-TF-003
ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD pana pana,H1.85mm, me ka pine CD Material: Insulator: Thermoplastic High Temperature,UL94V-0. Hoʻokaʻaʻike: Copper Alloy T=0.15,Plated 50u "Ni Overall. Plated Au Selective Contact Area Plated 30u"-70u" Sn Over Ni On Solder Area. Shell:T=0.15,Plated 30u" Ni Overall min. Papa 0.5u" Au Waena Hoʻokaʻaʻike koho Uila: Ka helu o kēia manawa:0.5 A Voltage Rating:3.3V Ambient Humidity Range:95% RH Max. Hoʻopili ...