Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.85mm, me ka pine CD KLS1-TF-003

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.85mm, me ka pine CD KLS1-TF-003

ʻO ka wehewehe pōkole:


Huahana Huahana

Huahana Huahana

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.85mm, me ka pine CD Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.85mm, me ka pine CD

ʻIkepili Huahana
Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.85mm, me ka pine CD

Material:
Insulator: Thermoplastic wela kiʻekiʻe, UL94V-0.
Hoʻokaʻaʻike: Copper Alloy T=0.15, Plated 50u" Ni Overall. Plated Au Selective
Hoʻokaʻaʻike Area Plated 30u"-70u" Sn Ma luna o Ni Ma Solder Area.
Shell:T=0.15,Plated 30u" Ni Overall min. Plated 0.5u" Au Selective Contact Area

Uila:
Ka helu o kēia manawa: 0.5 A
Ka helu Voltage: 3.3V
Māhele Haʻahaʻa Ambient:95% RH Max.
Kū'ē Pili: 100mΩ Max.
Kū'ē Kū'ē: 1000MΩ Min./500VDC
Nā pōʻaiapili male:5000 hoʻokomo.
Ka Mahana Hana: -45ºC~+105ºC


Mahele No. wehewehe PCS/CTN GW(KG) CMB(m3) OrderQty. Manawa Kauoha


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