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Hoʻohui Kāleka Nano SIM, 6Pin, H1.4mm, ʻAno Hined, me ka Pin CD KLS1-SIM-101

Nā Kiʻi Huahana ʻIke Huahana Nano SIM Kāleka Hoʻohui,6Pin,H1.4mm,Hinged Type,me CD Pin Material: Hale: High Temperature Thermoplastic,UL94V-0.Black. Terminal: Copper Alloy, Plated Gold ma ka wahi pili a me nā huelo solder, Underplated Nickel ma luna o nā mea a pau. Shell:Stainless Steel, Kāwili ʻia i ke gula ma nā huelo solder, Underplated Nickel ma luna o nā mea a pau. Uila: Ua helu ʻia i kēia manawa:0.5A ʻO ka Voltage i koho ʻia: 30V AC Kūʻai Kūʻē: 100mΩ Max. Kū'ē Kū'ē: 1000MΩ Min./500V DC Dielectric Withsta...

Hoʻohui Kāleka Nano SIM, 6Pin, H1.4mm, ʻAno Hined, me ka Pin CD KLS1-SIM-077A

Nā Kiʻi Huahana ʻIke Huahana Nano SIM Kāleka Hoʻohui,6Pin,H1.4mm,Hinged Type,me CD Pin Material: Insulator: High Temperature Thermoplastic,UL94V-0. Hoʻokaʻaʻike:Copper Alloy,Plated 50u” Ni Ka holoʻokoʻa Hoʻokaʻaʻike All Au 1U. Shell:SUS.All Ni 30U MIN. Uila: Ka helu o kēia manawa:0.5A AC/DC MAX. Voltage Rating:125V AC/DC Ambient Humidity Range:95% RH Max. Hoʻokaʻaʻike kū'ē:80mΩ Max. Nā pōʻaiapili male: 5000 hoʻokomo ʻana i ka wela hana: -45ºC~+85...

Hoʻohui Kāleka Nano SIM, 6Pin, H1.4mm, ʻAno Hined, me ka ʻole CD Pin KLS1-SIM-077

Nā Kiʻi Huahana Nā Mea Hoʻohui Kāleka SIM Nano,6Pin,H1.4mm,Hinged Type,me ka ʻole CD Pin Material: Insulator:Kiʻekiʻe Temperature Thermoplastic,UL94V-0. Hoʻokaʻaʻike:C5210,Plated 50u” Ni Kakau Hoʻokaʻaʻike All Au 1U. Shell:SUS.All Ni 30U/MIN. Uila: Ka helu o kēia manawa:0.5A Voltage Rating:5V AC/DC Ambient Humidity Range:95% RH Max. Hoʻokaʻaʻike kū'ē: 80mΩ Max. Maikaʻi Min.V DC. Nā pōʻai: 10000 Hoʻokomo ʻana i ka wela hana: -45ºC~+85ºC Nano SIM Kāleka Hoʻohui, 6Pin, H1....

Hoʻohui Kāleka Nano SIM, PUSH PULL, 6Pin, H1.4mm, me CD Pin KLS1-SIM-092

Nā Kiʻi Huahana Huahana ʻIkepili Kāleka Nano SIM, PUSH PULL,6Pin,H1.4mm,me CD Pin Material: Hale:Hi-Temperature Thermoplastic,UL94V-0.Black. Terminal:Copper Alloy,koho 1u" Au ma ka wahi pili. Shell:Stainless Steel.selective Gold Flash ma ka solder wahi. Uila: Rated keia manawa:0.5A Max Rated Voltage:30V AC Contact Resistance:100mΩ Max. Insulation Resistance:1000MΩ Min./500V DC AC/50V DC Dielectric Withstanding Voltage. Nā pōʻaiapuni.

Mea hoʻohui Kāleka SIM Nano; PUSH PULL, 6Pin, H1.35mm KLS1-SIM-076

Nā Kiʻi Huahana ʻIke Huahana Nā Mea Hoʻohui Kāleka SIM Nano;PUSH PULL,6Pin,H1.35mm Material: Insulator: Kiʻekiʻe Mahana Thermoplastic,UL94V-0. Contact:C5210.Plated 50u” Ni Overall,Contact All Au 1u. Shell:SUS,Plated 50u” Ni Overall,PAD Au 1u. Uila: Ka helu o kēia manawa:0.5A AC/DC max. Voltage Rating:125V AC/DC Hoʻokaʻaʻike Kūʻē:100mΩ Max. Kū'ē Kū'ē: 1000MΩ Min.500V DC Hana Hana: -45ºC~+85ºC

Mea hoʻohui Kāleka SIM Nano; PUSH PULL, 6Pin, H1.2mm KLS1-SIM-D01

Nā Kiʻi Huahana Huahana Mea Pono: Hale: High Temp.Thermoplastic,UL94V-0.Black Contact: Copper Alloy 0.10T,Gold Flash On Contact Area and Solder Area 50U” Min Nickel Under-Plated Shell:Stainless Steel 0.10T,Nickel Plating Over ALL Electrical: Current Rating:10A Contact Resistance:1A Ins ΩM Resistance:1A Ω. Min Dielectric Withstanding Voltage:500V RMS Min Life Test:1500 Cycles

Hoʻohui Kāleka SIM Micro,6Pin H1.42mm KLS1-SIM-105

Nā Kiʻi Huahana Huahana ʻIkepili Kāleka Micro SIM Connector,6Pin H1.42mm Material: Insulator: High Temperature Thermoplastic, UL 94V-0 Contact: Copper Alloy,Plated 50u” Ni Ooverall Contact Au 1U Shell:SUS,Plated 50u” Ni Ooverall,Plated 1u” Au Selective Contacts: 5 Electrical Characters Contacts. kiʻekiʻe.

Kāleka SIM Micro CONN,6P,H1.45mm,SMD KLS1-SIM-046

Nā Kiʻi Huahana Mea ʻIke Mea: Hale:LCP,UL94V-0 Hoʻokaʻaʻike:C5210 , Kāleka gula i uhi ʻia ma ka wahi pili; Kau ʻana o ke gula ma nā huelo kūʻai; Me ka Entrere Contact Underplated Nickel Shell:SUS304,Nickel Underplated Ma luna o nā mea a pau, Gold Flash Plated on Solder Tails ElectricaL Specifications: Loaʻa kēia manawa:0.5A Voltage Rating:5V Hoʻokaʻaʻike Kū'ē:50mΩ Max. Ke kū'ē kū'ē: 1000MΩ Min Durabiliy: 3000 Cycles Min

Hoʻohui Kāleka SIM Micro, 8Pin H1.5mm, ʻAno Hīkini KLS1-SIM-089

Nā Kiʻi Huahana ʻIke Huahana Hoʻohui Kāleka Micro SIM, 8Pin H1.5mm, ʻAno Hinged Mea hale: Thermoplastic, UL94V-0. Terminal:Phosphor Bronze,T=0.15,Ni Plated Under,Au Plated on Contact Area,G/F Plated on Soldertail. Shell:Stainless Steel,T=0.15,Ni Kau ʻia ma lalo,G/F i hoʻopaʻa ʻia ma Soldertail. Kū'ē Pili Uila:60mΩ Max. Kū'ē Kū'ē: 1000MΩ Min. Dielectric Withstanding Voltage: 500V AC No 1 Minute. Ka lōʻihi: 5000 Cycles. Ka Mahana Hana: -45ºC~+85ºC

Hoʻohui Kāleka SIM Micro, 6Pin H1.8mm, ʻAno Hinged KLS1-SIM-072

Nā Kiʻi Huahana ʻIke Huahana Hoʻohui Kāleka Micro SIM, 6Pin H1.8mm, ʻAno Hinged Mea: Hale: LCP, UL94V-0, ʻEleʻele. Terminal: Copper Alloy. Shell:Sila ʻole. Uila: Ka helu o kēia manawa: 1A Max. Ka helu Voltage: 30V DC max. Kū'ē Pili: 30mΩ Max. Kū'ē Kū'ē: 1000MΩ Min. Ka Voltage Dielectric: 500V rms / min. Ka lōʻihi: 5000 Cycles. Ka Mahana Hana: -45ºC~+85ºC

Hoʻohui Kāleka SIM Micro, 6Pin H1.5mm, ʻAno pā KLS1-SIM-075

Nā Kiʻi Huahana ʻIke Huahana Mea Hoʻohui Kāleka Micro SIM,6Pin H1.5mm, ʻAno pā Mea: Insulator: Hi–Temperature Plastic, UL94V-0, ʻEleʻele. Terminal: Copper Alloy.Gold Flash Plating on all terminal,Aad 50u” min Nickel Underplated on allover. Shell:50u” Nickel Underplating on allover,Gold flash on solder pad. Uila: Ka helu o kēia manawa:0.5A Voltage Rating Voltage:5.0 vrms Insulation Resistance:1000MΩ Min./500V DC Withstanding Voltage:250V ACrms No 1Minute Contact Res...

Hoʻohui Kāleka SIM Micro,6P, PUSH PULL, H1.5mm KLS1-SIM-099

Nā Kiʻi Huahana ʻIke Huahana Mea Hoʻohui Kāleka SIM Micro,6P,PUSH PULL,H1.5mm Mea Hale: Thermoplastic,UL94V-0. Terminal: Copper Alloy, Gold Plated on Contact Area and Solder huelo, Nickel Plated Overall. Shell:Stainless Steel.Nickel Plated Overall.GoldPlated on solder huelo. Uila: Ka helu o kēia manawa: 1.0 A max. Kū'ē Pili: 30mΩ Max. Dielectric Me ka Voltage: 500V AC Kū'ē Kū'ē: 1000MΩ Min./500V DC Ke Ana Hana Hana: -45ºC~+85ºC

Hoʻohui Kāleka SIM Micro,8P, PUSH PULL, H1.5mm KLS1-SIM-091

Nā Kiʻi Huahana ʻIke Huahana Mea Hoʻohui Kāleka Micro SIM,8P,PUSH PULL,H1.5mm Uila: Hoʻohālikelike ʻia i kēia manawa:1.0A Voltage i koho ʻia:30V Kūʻai Kūʻē:50mΩ Max. Kū'ē Kū'ē: 1000MΩ Min./500V DC Dielectric Withstanding Voltage:500V AC Solder abiltiy:250oC~%%P5oC,10%%P0.5s Mau loa:5000 Cycles Min. Kū'ē Pili: 50mΩ Max. Ka Mahana Hana: -45ºC~+85ºC

Hoʻohui Kāleka Micro SIM, 6P

Nā Kiʻi Huahana

Hoʻohui Kāleka Micro SIM, 6P

Nā Kiʻi Huahana

Hoʻohui Kāleka Micro SIM, 8P

Nā Kiʻi Huahana

Hoʻohui Kāleka Micro SIM, 8P

Nā Kiʻi Huahana

Hoʻohui Kāleka Micro SIM, 8P

Nā Kiʻi Huahana

Hoʻohui Kāleka Micro SIM, 6P

Nā Kiʻi Huahana

Hoʻohui Kāleka SIM Micro; PUSH PUSH, 6P+1P A i ʻole 8P+1P,H1.50mm KLS1-SIM-090

Nā Kiʻi Huahana ʻIke Huahana Hoʻohui Kāleka Micro SIM;PUSH PUSH,6P+1P A i ʻole 8P+1P,H1.50mm Uila Ka helu o kēia manawa: 0.5A Voltage Rating:5.0 vrms Hoʻokaʻaʻike kūʻē:100mΩ Max. Kū'ē kū'ē: 1000M Min. Me ka Voltage: 250V ACrms No 1 Minute. TempRange hana:-45 ℃-+ 105 ℃ Material: Insulator: Hi-Temperature plastic, UL94V-0, Black Terminal: Copper Alloy, Gold Flash Plating on All Terminal, and 50u” min nickel underplated on allover. Shell:Stainless Steel,50u&...

Hoʻohui Kāleka SIM Micro; PUSH PUSH, 6P A i ʻole 6P+1P, H1.35mm KLS1-SIM-069

Nā Kiʻi Huahana ʻIke Huahana Hoʻohui Kāleka SIM Micro; PUSH PUSH, 6P A i ʻole 6P+1P, H1.35mm, Me ka leka ʻole. Mea: Insulator: High Temperature Thermoplastic, UL94V-0 Contact: Copper Alloy,Plated 50U" Ni Overall Contact Au 1U Shell:SUS,Plated 50U" Ni Overall Plated 1u" Au Selective Contact Area Electrical: Current Rating: 0.5A Max. Voltage Rating: 5V AC/0DC Kū'ē:1000M Min./500VDC Ambient Humidity Range:95% RH Max.

Hoʻohui Kāleka SIM Micro 8P, PUSH PULL, H2.4mm KLS1-SIM-044-8P

Nā Kiʻi Huahana Huahana ʻIkepili Kāleka Micro SIM Connector 8P,PUSH PULL,H2.4mm Material: Base:Hi-Temp Thermoplastic,UL94V-0.Black. Hoʻokaʻaʻikeʻikepili: Copper Alloy, Gold Plated. Shell: Ke kila ʻole, i uhi ʻia i ke gula. Uila: Kū'ē Kū'ē: 50mΩ maʻamau, 100Ω Max. Kū'ē Kū'ē:> 1000MΩ / 500V DC. 3. Solderability Vapor pae:215ºC.30sec.Max. IR feflow:250ºC.5sec.Max. Kuʻi lima lima:370ºC.3sec.Max. Ka Mahana Hana: -45ºC~+105ºC

Hoʻohui Kāleka SIM Micro 6P, PUSH PULL, H2.4mm KLS1-SIM-044-6P

Nā Kiʻi Huahana Huahana ʻIkepili Kāleka Micro SIM Connector 6P,PUSH PULL,H2.4mm Material: Base:Hi-Temp Thermoplastic,UL94V-0.Black. Hoʻokaʻaʻikeʻikepili: Copper Alloy, Gold Plated. Shell: Ke kila ʻole, i uhi ʻia i ke gula. Uila: Kū'ē Kū'ē: 50mΩ maʻamau, 100Ω Max. Kū'ē Kū'ē:> 1000MΩ / 500V DC. 3. Solderability Vapor pae:215ºC.30sec.Max. IR feflow:250ºC.5sec.Max. Kuʻi lima lima:370ºC.3sec.Max. Ka Mahana Hana: -45ºC~+105ºC

Hoʻohui Kāleka SIM; PUSH PUSH, 6P+2P, H1.80mm, Me ka leka a me ka ʻole o ka leka. KLS1-SIM-110

Nā Kiʻi Huahana ʻIke Huahana Hoʻohui Kāleka SIM; PUSH PUSH,6P+2P,H1.80mm Me ka pou a i ʻole me ka leʻa ʻole. Mea: Mea Hale: LCP UL94V-0 Mea Hoʻopili: Tin-Bronze Pūʻulu: Tape a Reel Package Nā ʻano uila: Voltage rating: 100V AC Ka helu o kēia manawa: 0.5A Max Kūʻē i ka uila: 250V AC / 1Minute Insulation kū'ē: ≥1000ΜΩ Hoʻokaʻaʻike kū'ē: ≤0 Cycles kū'ē: ≤0 Cycles ≤03 Mahana: -45ºC~+85ºC
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