Mea ʻIke Huahana: Hale: Thermoplastic, UL94V-0 Contact: Copper Alloy. Puhi:SUS201. Hoʻopili: Hoʻokaʻaʻike:Paʻi gula E ʻike i ka pākaukau AT ʻĀpana Hoʻokaʻa ʻia ʻo Tin Plating AT Solder Area. Nickel Under plated All Over. Shell: Hoʻopili ʻia ʻo Nickel Solder ma nā wahi a pau. Uila: Ka Mahana Hana:-20°C A i +80°C. Māhele No. Hōʻike PCS/CTN GW(KG) CMB(m3) OrderQty. Kauoha Manawa
ʻIke Huahana Mea Hana Hale:Hing Temperature Thermoplastics, UL94V-0 LCP, ʻEleʻele. Hoʻokaʻaʻike:C2680/C5191. Iho: kila. Hoʻopau: Hoʻopili:Plated Gold In Mating Area; Kino Lead on Solder Talls. ʻO ka ʻili: ʻO ka pā kepau. Uila: Kū'ē Kū'ē: 30mΩ Max. Dielectric Withstanding Voltage: 50 V AC AT Sea Level. Kū'ē Kū'ē: 100MΩ Min. Māhele No. Hōʻike PCS/CTN GW(KG) CMB(m3) OrderQty. Ka Manawa...
Hoʻopili i ka MICRO USB TYPE B CLIP L8.8 KLS1-236-5M7
ʻIke Huahana Hale:Hing Temperature Thermoplastic me gf,UL94V-0. Pili: Copper Alloy, t=0.20mm. Ka pūpū:SUS,t=0.20mm. Uila: Ka helu o kēia manawa: 1A Max. Dielectric Withstanding Voltage: 100 V AC no 1 min. Kū'ē Pili: 50mΩ Max. Kū'ē Kū'ē: 100MΩ Min. Ka nui o ka ikaika male: 3.57 kgf Max. Huina Unmating Force:1.0 kgf Min. Kaulana Mahana: -30°C A hiki i +80°C Mahele No. wehewehe PCS/CTN GW..
Hoʻopili i ka MICRO USB TYPE B CLIP L6.8 KLS1-236-5M6
ʻIke Huahana Mea Hana Hale:Hing Temperature Thermoplastic me gf,UL94V-0. Pili: Copper Alloy, t=0.20mm. Ka pūpū:SUS,t=0.20mm. Uila: Ka helu o kēia manawa: 1A Max. Dielectric Withstanding Voltage: 100 V AC no 1 min. Kū'ē Pili: 50mΩ Max. Kū'ē Kū'ē: 100MΩ Min. Ka nui o ka ikaika male: 3.57 kgf Max. Huina Unmating Force:1.0 kgf Min. Kaulana Mahana: -30°C A hiki i +80°C Mahele No. Descripti...