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CFast Host Connector,H8.35,PUSH PUSH Type KLS1-CFA-003A

ʻIke Huahana CFast Host Connector,H8.35,PUSH PUSH Type Material Hale:Engineering plastic,LCP me GF i hoʻoikaikaʻia,ʻeleʻele no kēlā me kēia,UL 94V-0,rate. Slider: ʻenekinia plastic, LCP me GF i hoʻoikaika ʻia, ʻeleʻele no kēlā me kēia, UL 94V-0, uku. Terminal:Phosphor Bronze, no JIS 5210,0.2T Puna: Piano thread Metala uhi:Stainless steel sheet SUS304 0.2T, Crank:Stainless rod SUS 304. Kāleka laka:Stainless steel SUS 304 Plating Solder zone:100u" matte Tin,50u" min...Nickel

CFast Host Connector,H6.05,ʻano LOCK KLS1-CFA-002B

ʻIke Huahana CFast Host Connector,H6.05, LOCK type Mea Hale Hale: Engineering plastic, LCP me GF i hoʻoikaika ʻia, ʻeleʻele no kēlā me kēia, UL 94V-0, uku. Terminal: Phosphor Bronze, no JIS 5210,0.2T Metala uhi:Stainless steel sheet SUS304 0.2T, Plating Solder zone:100u "matte Tin,50u" min, Nickel underplating over all. Māhele No. Hōʻike PCS/CTN GW(KG) CMB(m3) OrderQty. Kauoha Manawa

CFast Host Connector,H6.05,PUSH PUSH Type KLS1-CFA-002A

ʻIke Huahana CFast Host Connector,H6.05,PUSH PUSH Type Material Hale:Engineering plastic,LCP me GF hoʻoikaika,ʻeleʻele no kēlā me kēia,UL 94V-0,rate. Slider: ʻenekinia plastic, LCP me GF i hoʻoikaika ʻia, ʻeleʻele no kēlā me kēia, UL 94V-0, uku. Terminal:Phosphor Bronze, no JIS 5210,0.2T Puna: Piano thread Metala uhi:Stainless steel sheet SUS304 0.2T, Crank:Stainless rod SUS 304. Kāleka laka:Stainless steel SUS 304 Plating Contacts:30u" gula plating ma ka wahi pili a me 100u&quo...

Mea Hoʻohui Hoʻokipa CFast, Vertical SMT KLS1-CFA-001

ʻIke Huahana CFast Host Connector, Vertical SMT Material Housing: Engineering plastic, LCP me GF i hoʻoikaika ʻia, ʻeleʻele no kēlā me kēia, UL 94V-0, uku. Terminal: Phosphor Bronze, no JIS 5210,0.2T Plating Contacts: 30u "ka uhi gula ma ka wahi pili a me ka 100u" min.matte Tin i ka soldering zone, ma luna o ka pilina holoʻokoʻa i lalo me 50u "min, Nickel ma luna o nā mea a pau. Solder zone: 100u" matte Tin, 50u" min.

Hoʻohui kāleka CF 50P,L13.75mm,H3.9mm KLS1-CF-003

ʻIke Huahana CF kāleka Mea hoʻohui 50P,L13.75mm,H3.9mm Mea: Hale: Thermoplastic,UL94V-V0.White. Hoʻokaʻaʻike: Copper Alloy 0.40T.Gold Flash On Contact Area Matte-Tin plated on solder huelo a puni Nickel plated. Hoʻoponopono: Copper Alloy 0.30T.Tin plated on solder huelo a puni Nickel plated. Uila: Ka helu o kēia manawa: 0.5A AC, DC. Kū'ē Pili: 40mΩ Max. Kū'ē Kū'ē: 1000MΩ Min. Me ka Voltage: 500V AC/minuke Hana Hana:...

Hoʻohui kāleka CF 50P,L26mm,H5.4mm KLS1-CF-002

ʻIke Huahana CF kāleka Mea hoʻohui 50P,L26mm,H5.4mm Mea Hale:LCP, UL94V-0 Uila Ka helu o kēia manawa: 0.5A,AC,DC Ke kūʻai aku ʻana:40mΩ kiʻekiʻe Kūleʻa kūʻokoʻa:1000ΜΩ min E kū i ka uila: 500V AC/minuke Manaʻo Hana:-45ºC ʻAʻohe ʻāpana. GW(KG) CMB(m3) OrderQty. Kauoha Manawa

Hoʻohui kāleka CF 50P,L26.9mm,H3.85mm KLS1-CF-001

ʻIke Huahana CF kāleka Mea hoʻohui 50P,L26.9mm,H3.85mm Mea Hale:LCP, UL94V-0 Uila Ka helu o kēia manawa: 0.5A,AC,DC Kū'ē kū'ē: 40mΩ max Kū'ē kū'ē: 1000ΜΩ min Kū'ē i ka uila: 500V AC/minuke ºC Māhele:-4 Hōʻikeʻike PC5ºC ʻAʻohe ~ + 8. GW(KG) CMB(m3) OrderQty. Kauoha Manawa

3.96mm Pitch Edge Kāleka Mea Hoʻohui Solder Type KLS1-903S

ʻIkepili Huahana 3.96mm Pitch Edge Card Connector Solder Type Order InformationKLS1-903S-XX-L903S-Solder typeXX-No, of 10~100 pinL-Blue Material: Hale: Glass filled PBT UL94V-0Contacts: Brass or Phosphor BronzePlating: Contact gold and Dip Electrical Tin Tin AMPInsulator Kū'ē: 1000M Ohm min. ma DC 500VContact Kū'ē: 30m Ohm max. ma DC 100mAWithstanding Voltage: 1000V AC /rms 50Hz no 1 minuteOperation Te...

3.96mm Pitch Edge Kāleka Hoʻohui Kāleka PCB Dip 90 Type KLS1-903R

'Ikepili Huahana 3.96mm Pitch Edge Card Connector Slot PCB Dip 90 Type Order InformationKLS1-903R-XX-L903R-RightAnglePintypeXX-No, of 10~100 pinL-Blue B-Black Material:Housing:PBT+30% Glass fiber (UL94V-0)Contacts:Bbronsphors1 nickel 50u "Nīkini Uila: Loaʻa i kēia manawa: 3.0AIinsulator Kū'ē: 5000MΩ Min.Contact Kū'ē: 0.02Ω Max.Dielectric kū'ē i ka uila: 500V AC Hana Hana:-...

3.96mm Pitch Edge Kāleka Hoʻohui PCB dip 180 KLS1-903D

ʻIke Huahana 3.96mm Pitch Edge Card Connector PCB Dip 180 Type Order InformationKLS1-903D-1-XX-L903D-Dip 180 type1-Single row 2-Double rowXX-No, of 10~100 pinL-Blue Material:Housing: Glass filled PBT0Contact or 4. BronzePlating: Hoʻokaʻaʻike i ke gula a me ka Dip Tin ma luna o NickelElectrical Characteristics: Ka helu o kēia manawa: 2 AMPInsulator Resistance: 1000M Ohm min. ma DC 500VContact Kū'ē: 30m Ohm max. ma DC 100mAWithstanding Voltage:1000V AC /r...

Hoʻohui kāleka SD 4.0 NO pana,H3.0mm KLS1-SD4.0-002

ʻIke Huahana Hoʻohui kāleka SD 4.0 NO pana, H3.0mm Material: Insulator: LCP helu ʻia, UL94V-0

ʻO ka mea hoʻohui kāleka SD 4.0 pana pana,H3.0mm,Huli KLS1-SD4.0-001A

ʻIke Huahana Huahana SD 4.0 ka mea hoʻohui kāleka pahu pana, H3.0mm, Mea Hoʻohuli: Insulator: LCP helu ʻia, UL94V-0

ʻO ka mea hoʻohui kāleka SD 4.0 pana i ka pahu, H3.0mm KLS1-SD4.0-001

ʻIke Huahana ʻO SD 4.0 ka mea hoʻokuʻu kāleka pahu pana, H3.0mm Material: Insulator: LCP helu ʻia, UL94V-0

Huki huki ka mea hoʻohui kāleka SD, H2.5mm, me ka pine CD KLS1-TF-020

ʻIke Huahana Huki huki ka mea hoʻohui kāleka SD, H2.5mm, me ka pin CD Material: Hale: Hi-Temp plastic, UL94V-0. Hoʻopili: Copper Alloy. Nail:Sila ʻole. Hoʻopau: Hoʻokaʻaʻike:G/F Gold plated on conatct area; Hoʻopili ʻia ʻo G/F ma nā huelo solder, Base Nickel 50u" Min Nail:50u" Nickel Under,100u" Tin Overall. Part No. Description PCS/CTN GW(KG) CMB(m3) OrderQty. Time Order

Huki huki ka mea hoʻohui kāleka SD, H3.75mm KLS1-TF-006

ʻIke Huahana Mea hoʻohui kāleka SD pahu huki,H3.75mm Material: Hale: Thermoplastic,UL94V-0.Natural. Terminal: Copper Alloy, Au Plating.Contact Area:G/F; Matte Tin Plated on Soldering. Shell:Sila ʻole. Uila: Kū'ē Kū'ē: 80mΩ Max. Kū'ē Kū'ē: 100MΩ Min. Dielectric Withstanding Voltage:500V AC. Nā ʻano Mechanical Paʻa Manaʻo: Min.100gf/Pin. Māhele No. Hōʻike PCS/CTN GW(KG) CMB(m3) OrderQty. ...

Hoʻokuʻu ka mea hoʻohui kāleka SD, H3.4mm, me ka pine CD KLS1-TF-005S

ʻIke Huahana Hoʻohui kāleka SD pahu huki huki,H3.4mm,me CD pin Material:Insulator:Thermal Plastic UL94V-0Contacts:Copper Alloy Specification:I kēia manawa helu:1Amps MaxContact resistance:100mΩ Max.Insulation resistance:1000ΜΩ Min.Mating Cycle:10000 Cycles Minute Minute. mahana:-40ºC~+85ºC Māhele No. Hōʻike PCS/CTN GW(KG) CMB(m3) OrderQty. Kauoha Manawa

Hoʻokuʻu ka mea hoʻohui kāleka SD, H3.4mm, me ka pine CD KLS1-TF-005

ʻIke Huahana Hoʻohui kāleka SD pahu huki huki,H3.4mm,me CD pin Material:Housing:Kiʻekiʻe Temperature ThermoplasticContacts:Copper Alloy Specification:Current rating:0.5AVoltage Rating:250VRMContact resistance:100mΩ Max.Insulation resistance:100ΜΩ Min.Dielectric: 5000CM Voltage: 50ΜΩ Min. Hoʻomoe Minute.Mahana hana:-25ºC~+90ºC Māhele No. Hōʻike PCS/CTN GW(KG) CMB(m3) OrderQty. Ka Manawa...

Hoʻokuʻu ka mea hoʻohui kāleka SD, H2.75mm, me ka pine CD KLS1-SD112

ʻIke Huahana Huki huki ka mea hoʻohui kāleka SD, H2.75mm, me ka pin CD Material: Hale: Thermoplastic Kiʻekiʻe. Hoʻopili: Copper Alloy. Shell: Copper Alloy, Kāwili gula ma nā huelo solder, Underplated Nickel ma luna o nā mea a pau. Plating: Contact Area:Gold Plated over Ni. Solder Tail:30u" Min Sn Plated Over Ni. Uila: I kēia manawa helu: 0.5A. Voltage Rating: 250VRMS Hoʻokaʻaʻike kū'ē: 40mΩ Dielectric Kū'ē Voltage:500V AC. Insulation Kū'ē:100M&Ome...

Hoʻohui kāleka SD Reverse MID MOUNT 1.75mm, DIP me CD Pin KLS1-SD003

ʻIke Huahana Hoʻohui kāleka SD Reverse MID MOUNT 1.75mm, DIP me CD Pin Material: Hale:LCP S475,UL94V-0.Black. Shell:Sila ʻole SUS304. Hoʻokaʻaʻike: Copper Alloy C5210. Hoʻopau: Hoʻokaʻaʻike:Gold Plated on Contact Area.Matte Tin 100u "Min On Soldertail Area.50u" Min Nickel Plating Overall. Shell:30u" Min Solderable Nickel Plating Overall. Part No. Description PCS/CTN GW(KG) CMB(m3) OrderQty. Time Order

Hoʻokuʻu ka mea hoʻohui kāleka SD, H2.8mm, me ka pine CD KLS1-SD002

ʻIke Huahana Huki huki ka mea hoʻohui kāleka SD, H2.8mm, me ka pine CD Material: Hale:LCP,UL94V-0.Black. Terminal:C5191R-EH T = 0.20, Hoʻokaʻaʻike G / F, Ni 40u "min, Kino Kuʻi 80u WP Pin: C5191R-EH T = 0.20, Hoʻokaʻaʻike G / F, Ni 40u" min, Kino Kuʻi 80u CD Pin: C5191R-EH "TCon = 0.20" min, Kino Kuʻi 80u Shell: C2680-H, T=0.20, NI 40u" min. Uila: Hoʻokaʻaʻike i kēia manawa: 0.5Amperes. Dielectric Withstanding Voltage: AC500V rms. ʻO ka hoʻokuʻu ʻana...

Hoʻokuʻu ʻia ka mea hoʻohui kāleka SD, H2.8mm, me ka pine CD KLS1-SD-001 / KLS1-SD-101

ʻIke Huahana ʻO ka mea hoʻohui kāleka SD pana i ka pana,H2.8mm, me ka pine CD Material: Insulator: Thermoplastic High Temperature,UL94V-0. Hoʻokaʻaʻike: Copper Alloys.Plated 50u" Ni Overall Plated Au Selective Contact Area,Plated 100u" Sn Over Ni On Solder Area. Shell:Plated 50u" Ni Ka holoʻokoʻa. Uila: Voltage Rating: 125V AC/DC o kēia manawa: 0.5mA AC/DC Max. Ambient Humidity Range:95% RH Max. Hoʻokaʻaʻike kū'ē: 100mΩ Max. Insulation kū'ē: 1000M&O...

5 i loko o 1 Kāleka Hoʻohui, H4.3mm KLS1-MUT51-001

ʻIke Huahana 5 i loko o 1 Kāleka Hoʻohui,H4.3mm Material Insulator:Hi-Temperature Plastic,UL94V-0,Laula:ʻEleʻele Terminal: Copper Alloy,Selector Gold Flash Plating On Contact Area,AND 50U" Min Nickel Underplated On Allover Shell:Stainless Stell,50u" Nickel Underplated On Allover,Gold Electrical Flash min.AT DC 500V DC E kū i ka uila: 250V ACrms NO 1 Minute Hoʻopili kū'ē: 100mΩ max.AT 10mA/20mV ...

Hoʻokuʻu ʻia ka mea hoʻohui kāleka SD micro, H1.5mm KLS1-TF-011-H1.5-R

ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD pana huki huki,H1.5mm Mahele No. Hōʻike PCS/CTN GW(KG) CMB(m3) OrderQty. Kauoha Manawa

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD 4.0, H1.3mm KLS1-SD4.0-003

ʻIke Huahana ʻO Micro SD 4.0 ka mea hoʻohui kāleka pahu pana, H1.3mm Material: Insulator: Thermal Plastic, Pated UL94V-0. Hoʻopili: Phosphor Bronze. Shell:Sila ʻole. Hoʻokaʻaʻike Plating: Underplate: 50u "-100u" Nickel Hoʻokaʻaʻike wahi:Gold Flash Solder huelo wahi:100u"-200u" Tin Uila: Hana Voltage:10V kēia manawa helu:0.5A Min. Kū'ē Pili: 100mΩ Max. Kū'ē Insulation: 1000MΩ Dielectric Withstanding Voltage: 500VAC / 1 Minu...
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