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Nā mea hoʻohui kāleka SIM a me nā mea hoʻohui kāleka Micro SIM a me nā mea hoʻohui Kāleka Nano SIM

Hoʻohui Kāleka SIM Micro,6Pin H1.42mm KLS1-SIM-105

Nā Kiʻi Huahana Huahana ʻIkepili Kāleka Micro SIM Connector,6Pin H1.42mm Material: Insulator: High Temperature Thermoplastic, UL 94V-0 Contact: Copper Alloy,Plated 50u” Ni Ooverall Contact Au 1U Shell:SUS,Plated 50u” Ni Ooverall,Plated 1u” Au Selective Contacts: 5 Electrical Characters Contacts. kiʻekiʻe.

Kāleka SIM Micro CONN,6P,H1.45mm,SMD KLS1-SIM-046

Nā Kiʻi Huahana Mea ʻIke Mea: Hale:LCP,UL94V-0 Hoʻokaʻaʻike:C5210 , Kāleka gula i uhi ʻia ma ka wahi pili; Kau ʻana o ke gula ma nā huelo kūʻai; Me ka Entrere Contact Underplated Nickel Shell:SUS304,Nickel Underplated Ma luna o nā mea a pau, Gold Flash Plated on Solder Tails ElectricaL Specifications: Loaʻa kēia manawa:0.5A Voltage Rating:5V Hoʻokaʻaʻike Kū'ē:50mΩ Max. Ke kū'ē kū'ē: 1000MΩ Min Durabiliy: 3000 Cycles Min

Hoʻohui Kāleka SIM Micro, 8Pin H1.5mm, ʻAno Hīkini KLS1-SIM-089

Nā Kiʻi Huahana ʻIke Huahana Hoʻohui Kāleka Micro SIM, 8Pin H1.5mm, ʻAno Hinged Mea hale: Thermoplastic, UL94V-0. Terminal:Phosphor Bronze,T=0.15,Ni Plated Under,Au Plated on Contact Area,G/F Plated on Soldertail. Shell:Stainless Steel,T=0.15,Ni Kau ʻia ma lalo,G/F i hoʻopaʻa ʻia ma Soldertail. Kū'ē Pili Uila:60mΩ Max. Kū'ē Kū'ē: 1000MΩ Min. Dielectric Withstanding Voltage: 500V AC No 1 Minute. Ka lōʻihi: 5000 Cycles. Ka Mahana Hana: -45ºC~+85ºC

Hoʻohui Kāleka SIM Micro, 6Pin H1.8mm, ʻAno Hinged KLS1-SIM-072

Nā Kiʻi Huahana ʻIke Huahana Hoʻohui Kāleka Micro SIM, 6Pin H1.8mm, ʻAno Hinged Mea: Hale: LCP, UL94V-0, ʻEleʻele. Terminal: Copper Alloy. Shell:Sila ʻole. Uila: Ka helu o kēia manawa: 1A Max. Ka helu Voltage: 30V DC max. Kū'ē Pili: 30mΩ Max. Kū'ē Kū'ē: 1000MΩ Min. Ka Voltage Dielectric: 500V rms / min. Ka lōʻihi: 5000 Cycles. Ka Mahana Hana: -45ºC~+85ºC

Hoʻohui Kāleka SIM Micro, 6Pin H1.5mm, ʻAno pā KLS1-SIM-075

Nā Kiʻi Huahana ʻIke Huahana Mea Hoʻohui Kāleka Micro SIM,6Pin H1.5mm, ʻAno pā Mea: Insulator: Hi–Temperature Plastic, UL94V-0, ʻEleʻele. Terminal: Copper Alloy.Gold Flash Plating on all terminal,Aad 50u” min Nickel Underplated on allover. Shell:50u” Nickel Underplating on allover,Gold flash on solder pad. Uila: Ka helu o kēia manawa:0.5A Voltage Rating Voltage:5.0 vrms Insulation Resistance:1000MΩ Min./500V DC Withstanding Voltage:250V ACrms No 1Minute Contact Res...

Hoʻohui Kāleka SIM Micro,6P, PUSH PULL, H1.5mm KLS1-SIM-099

Nā Kiʻi Huahana ʻIke Huahana Mea Hoʻohui Kāleka SIM Micro,6P,PUSH PULL,H1.5mm Mea Hale: Thermoplastic,UL94V-0. Terminal: Copper Alloy, Gold Plated on Contact Area and Solder huelo, Nickel Plated Overall. Shell:Stainless Steel.Nickel Plated Overall.GoldPlated on solder huelo. Uila: Ka helu o kēia manawa: 1.0 A max. Kū'ē Pili: 30mΩ Max. Dielectric Me ka Voltage: 500V AC Kū'ē Kū'ē: 1000MΩ Min./500V DC Ke Ana Hana Hana: -45ºC~+85ºC

Hoʻohui Kāleka SIM Micro,8P, PUSH PULL, H1.5mm KLS1-SIM-091

Nā Kiʻi Huahana ʻIke Huahana Mea Hoʻohui Kāleka Micro SIM,8P,PUSH PULL,H1.5mm Uila: Hoʻohālikelike ʻia i kēia manawa:1.0A Voltage i koho ʻia:30V Kūʻai Kūʻē:50mΩ Max. Kū'ē Kū'ē: 1000MΩ Min./500V DC Dielectric Withstanding Voltage:500V AC Solder abiltiy:250oC~%%P5oC,10%%P0.5s Mau loa:5000 Cycles Min. Kū'ē Pili: 50mΩ Max. Ka Mahana Hana: -45ºC~+85ºC

Hoʻohui Kāleka Micro SIM, 6P

Nā Kiʻi Huahana

Hoʻohui Kāleka Micro SIM, 6P

Nā Kiʻi Huahana

Hoʻohui Kāleka Micro SIM, 8P

Nā Kiʻi Huahana

Hoʻohui Kāleka Micro SIM, 8P

Nā Kiʻi Huahana

Hoʻohui Kāleka Micro SIM, 8P

Nā Kiʻi Huahana

Hoʻohui Kāleka Micro SIM, 6P

Nā Kiʻi Huahana

Hoʻohui Kāleka SIM Micro; PUSH PUSH, 6P+1P A i ʻole 8P+1P,H1.50mm KLS1-SIM-090

Nā Kiʻi Huahana ʻIke Huahana Hoʻohui Kāleka Micro SIM;PUSH PUSH,6P+1P A i ʻole 8P+1P,H1.50mm Uila Ka helu o kēia manawa: 0.5A Voltage Rating:5.0 vrms Hoʻokaʻaʻike kūʻē:100mΩ Max. Kū'ē kū'ē: 1000M Min. Me ka Voltage: 250V ACrms No 1 Minute. TempRange hana:-45 ℃-+ 105 ℃ Material: Insulator: Hi-Temperature plastic, UL94V-0, Black Terminal: Copper Alloy, Gold Flash Plating on All Terminal, and 50u” min nickel underplated on allover. Shell:Stainless Steel,50u&...

Hoʻohui Kāleka SIM Micro; PUSH PUSH, 6P A i ʻole 6P+1P, H1.35mm KLS1-SIM-069

Nā Kiʻi Huahana ʻIke Huahana Hoʻohui Kāleka SIM Micro; PUSH PUSH, 6P A i ʻole 6P+1P, H1.35mm, Me ka leka ʻole. Mea: Insulator: High Temperature Thermoplastic, UL94V-0 Contact: Copper Alloy,Plated 50U" Ni Overall Contact Au 1U Shell:SUS,Plated 50U" Ni Overall Plated 1u" Au Selective Contact Area Electrical: Current Rating: 0.5A Max. Voltage Rating: 5V AC/0DC Kū'ē:1000M Min./500VDC Ambient Humidity Range:95% RH Max.

Hoʻohui Kāleka SIM Micro 8P, PUSH PULL, H2.4mm KLS1-SIM-044-8P

Nā Kiʻi Huahana Huahana ʻIkepili Kāleka Micro SIM Connector 8P,PUSH PULL,H2.4mm Material: Base:Hi-Temp Thermoplastic,UL94V-0.Black. Hoʻokaʻaʻikeʻikepili: Copper Alloy, Gold Plated. Shell: Ke kila ʻole, i uhi ʻia i ke gula. Uila: Kū'ē Kū'ē: 50mΩ maʻamau, 100Ω Max. Kū'ē Kū'ē:> 1000MΩ / 500V DC. 3. Solderability Vapor pae:215ºC.30sec.Max. IR feflow:250ºC.5sec.Max. Kuʻi lima lima:370ºC.3sec.Max. Ka Mahana Hana: -45ºC~+105ºC

Hoʻohui Kāleka SIM Micro 6P, PUSH PULL, H2.4mm KLS1-SIM-044-6P

Nā Kiʻi Huahana Huahana ʻIkepili Kāleka Micro SIM Connector 6P,PUSH PULL,H2.4mm Material: Base:Hi-Temp Thermoplastic,UL94V-0.Black. Hoʻokaʻaʻikeʻikepili: Copper Alloy, Gold Plated. Shell: Ke kila ʻole, i uhi ʻia i ke gula. Uila: Kū'ē Kū'ē: 50mΩ maʻamau, 100Ω Max. Kū'ē Kū'ē:> 1000MΩ / 500V DC. 3. Solderability Vapor pae:215ºC.30sec.Max. IR feflow:250ºC.5sec.Max. Kuʻi lima lima:370ºC.3sec.Max. Ka Mahana Hana: -45ºC~+105ºC

Hoʻohui Kāleka SIM; PUSH PUSH, 6P+2P, H1.80mm, Me ka leka a me ka ʻole o ka leka. KLS1-SIM-110

Nā Kiʻi Huahana ʻIke Huahana Hoʻohui Kāleka SIM; PUSH PUSH,6P+2P,H1.80mm Me ka pou a i ʻole me ka leʻa ʻole. Mea: Mea Hale: LCP UL94V-0 Mea Hoʻopili: Tin-Bronze Pūʻulu: Tape a Reel Package Nā ʻano uila: Voltage rating: 100V AC Ka helu o kēia manawa: 0.5A Max Kūʻē i ka uila: 250V AC / 1Minute Insulation kū'ē: ≥1000ΜΩ Hoʻokaʻaʻike kū'ē: ≤0 Cycles kū'ē: ≤0 Cycles ≤03 Mahana: -45ºC~+85ºC

Hoʻohui Kāleka SIM, PUSH PUSH, 8P+1P, H1.9mm, me ka Post KLS1-SIM-108

Nā Kiʻi Huahana ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH,8P+1P,H1.9mm,me nā mea hoʻouna: Hale:Hi-Temp Plastic,UL94V-0.Rated. Hoʻopili: Copper Alloy. Huina: Copper Alloy. Palena: Wahi Hoʻopili: ʻAla gula. Solder wahi: 80u "Min, Matte tin alloy plated. Ma lalo o ka pā: 30u" min, Nickel. Shell:30u” Min, Nickel plated holoʻokoʻa Solder wahi: Gole flash. Uila: kēia manawa helu: 0.5A. Withstanding Voltage:AC500V rms Insulation Resistance:1000MΩMin, At DC 500V Contact R...

Hoʻohui Kāleka SIM, PUSH PUSH,6P+1P,H1.9mm,me Post KLS1-SIM-107

Nā Kiʻi Huahana ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH, 6P + 1P, H1.9mm, me ka Post Material: Hale: Hi-Temp Plastic, UL94V-0.Rated. Hoʻopili: Copper Alloy. Shell: Copper Alloy/Sila. Palena: Wahi Hoʻopili: ʻAla gula. Solder wahi: 80u "Min, Matte tin alloy plated. Ma lalo o ka pā: 30u" min, Nickel. Shell: 30u” Min, Nickel plated holoʻokoʻa Solder wahi: Gole flash. Uila: Ka helu o kēia manawa: 0.5A. Me ka Voltage Kū'ē: AC500V rms Kū'ē Kū'ē: 1000MΩMin, Ma DC 500V Cont...

Hoʻohui Kāleka SIM; PUSH PUSH,6P,H1.85mm KLS1-SIM-106

Nā Kiʻi Huahana ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH, 6P, H1.85mm, me ka Hale Paʻi: Hi-Temp Plastic, UL94V-0. Rated. Hoʻopili: Copper Alloy. Puhi:SUS. Hoʻopau: Ua uhi ʻia ke gula ma ka wahi conatct, ua uhi ʻia ka tin ma nā huelo solder.

Hoʻohui Kāleka SIM, PUSH PUSH, 6P, H1.85mm, me ka ʻole o ka Post KLS1-SIM-087

Nā Kiʻi Huahana ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH, 6P, H1.85mm, me ka ʻole o ka Post Material: Insulator: H-Temperature Plastic, UL94V-0.Black. Hoʻokaʻaʻike: Copper Alloy,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u” min Nickel Underplated on Allover,Gold Plating on Contact Arer,80u”min Tin on Solder Tail. Shell:50u” Nickel Underplated on Allover,Gold Flash on Solder Latch. Uila: I kēia manawa helu:0.5A. Voltage Rating:5.0 Vrms. Insulation Resistance:500...

Hoʻohui Kāleka SIM, PUSH PUSH, 6P+2P, H1.85mm, me ka Post KLS1-SIM-086

Nā Kiʻi Huahana ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH, 6P+2P, H1.85mm, me ka ʻole o ka Post Material: Insulator:H-Temperature Plastic,UL94V-0.Black. Hoʻokaʻaʻike: Copper Alloy,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u” min Nickel Underplated on Allover,Gold Plating on Contact Arer,80u”min Tin on Solder Tail. Shell:50u” Nickel Underplated on Allover,Gold Flash on Solder Latch. Uila: I kēia manawa helu:0.5A. Voltage Rating:5.0 Vrms. Insulation Resistance:...

Hoʻohui Kāleka SIM, PUSH PUSH, 8P+2P, H1.85mm, me ka ʻole o ka Post KLS1-SIM-085A

Nā Kiʻi Huahana ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH, 8P+2P, H1.85mm, me ka ʻole o ka Post Material: Insulator: H-Temperature Plastic, UL94V-0.Black. Hoʻokaʻaʻike: Copper Alloy,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u” min Nickel Underplated on Allover,Gold Plating on Contact Arer,80u”min Tin on Solder Tail. Shell:50u” Nickel Underplated on Allover,Gold Flash on Solder Latch. Uila: I kēia manawa helu:0.5A. Voltage Rating:5.0 Vrms. Insulation Resistance...
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