| 0.50mm Pitch M.2 NGFF Card Connector 67P ʻIke Kauoha
KLS1-NGFF01-3.2-67-B-G0
Kiʻekiʻe:1.2mm 1.5mm 1.8mm 3.2mm 4.0mm 5.8mm 6.4mm
kala: ʻeleʻele Pākuʻi: 1u"~30u"G1U-Gold 1u" G3U-Gold 3u"G30U-Gold30u"
- 0.5mm pitch me 67 kūlana
- Hoʻolālā ʻia no nā modula ʻelua a ʻelua ʻaoʻao
- Loaʻa i nā koho kī like ʻole no nā kāleka module
- Kākoʻo iā PCI Express 3.0, USB 3.0, a me SATA 3.0
- Koho i ke kiʻekiʻe, kūlana, hoʻolālā, a me ke koho kī
- Loaʻa i nā kiʻekiʻe like ʻole
- MHōʻike kikoʻī aterial:
- Noho: LCP+30% GF UL94 V-0.
- Hoʻopili: Copper Alloy (C5210) T=0.12mm.
- Wahi: Copper Alloy (C2680) T=0.20mm.
- ʻŌlelo kikoʻī:
- Hoʻokaʻaʻike: e nānā iā P/N.
- Leg: Matte Tin 50μ "min. holoʻokoʻa, Nickel 50μ" min.underplated.
- Hana Mechanical:
- Ka ikaika hoʻokomo: 20N max.
- Ka ikaika huki: 20N max.
- Ka lōʻihi: 60 mau pōkole min.
- Vibration: ʻAʻohe hoʻopau uila ma mua o 1u kekona.e hiki mai ana;
- Haʻalulu mīkini: 285G hapalua sine/6 axis.ʻaʻole hiki ke hoʻopau ʻia ka uila ma mua o 1u kekona;
- Hana Uila:
- Ka helu o kēia manawa: 0.5A (no kēlā me kēia pine).
- Voltage Rating: 50V AC (no ka pine).
- LLCR: Hoʻokaʻaʻike 55m?max.(hoʻomaka), 20m?max.hoʻololi i ʻae ʻia (hope).
- Palekana Insulation: 5,000M?min.ma 500V DC.
- ʻO ka dielectric e kū i ka uila: 300V AC/60s.
- IR Reflow:
E mālama ʻia ka wela wela ma luna o ka moku no 10 kekona ma 260±5°C. ʻO ka pae wela o ka hana: -40 ° C ~ 85 ° C (me ka ʻole o ka hana poho). ʻO nā ʻāpana āpau ʻo RoHS a me Reach. |
