Hoʻohui Kāleka akamai PUSH PULL,8P+2P KLS1-ISC-009
ʻIke Huahana Mea Hoʻohui Kāleka Naʻauao PUSH PULL,8P+2P Nā ʻAno Uila Ka lōʻihi: 300000 mau pōkole min. Kū'ē Kū'ē: 50Ω maʻamau, 100Ω Max. Kū'ē Kū'ē:> 1000MΩ / 500V DC. Māhele Māmā o Solderability:215ºC.30sec.Max. IR feflow:260ºC.10sec.Max. Kuʻi lima lima:370ºC.3sec.Max. 4.Environmental 'ano wela hana:-40ºCTO + 85ºC hana haʻahaʻa: 10%-+ 95% RH. Mahele Helu. wehewehe...
Hoʻohui Kāleka akamai PUSH PULL,8P+2P KLS1-ISC-008
ʻIke Huahana Hoʻohui Kāleka akamai PUSH PULL,8P + 2P Material: 1.Base:Hi-temp Thermoplastic,Black UL94V-0 2.Cover:SUS,Sold area:Tin plated 3.Data Contact:Copper Alloy,Contact area:Gold plated 4.Switch Contact:Contact area:Silver plated Contact SUS:Silver plated Contact SUS5. maʻamau, 100Ω max Insulation kū'ē:> 1000MΩ / 500V DCDurability:300,000 cycles min.Operating wela: -40°C ~ +85°CPro...
Hoʻohui Kāleka akamai PUSH PULL,8P+2P KLS1-ISC-007
'Ikepili Huahana Mea Ho'ohui Kāleka akamai PUSH PULL,8P+2P Uila Ki'iPlastic: 'ele'ele ki'eki'e wela UL94V-0;Terminal: copper alloyRated manawa: 1.0A maxRated voltage: 50V AC/DCOperating temperature: -40°C ~ +85°CCContact resistance: 100m ohms max.Withstand AC: 100m ohms max.Withstand 1000M ohm min./500VDC Nā manawa lōʻihi: 50000 mau manawa ʻO ke kūpaʻa wela o ka huahana: 260±5°C 10SFlatness: 0.10mm MAX. ...
Hoʻohui Kāleka akamai PUSH PULL,8P+2P, me ka ʻole o ka leka KLS1-ISC-F006
ʻIke Huahana Huahana Kāleka Hoʻohui Push PULL,8P+2P,Me ka ʻole o ka pou Material: Base:Hi-temp Thermoplastic,Black UL94V-0 Ka uhi:SUS,Solder wahi:Tin plated Data Contact:Copper Alloy,Contact area:Gold platedCurrent Rating: 1A Contact Resistance:50m? maʻamau,100m? max. Kū'ē Kū'ē: 1000M? min Dielectric withstanding voltage: AC 500V(rms) /60s Ka lōʻihi: 100,000 cycles min.Ka mahana hana: -40 ° C ~ + 85 ° CProduct temperature resistance: 260 & ...
Hoʻohui Kāleka akamai PUSH PULL,8P+2P,Me ka pou KLS1-ISC-F002
Product Information Smart Card Connector PUSH PULL,8P + 2P,Me ka pou Material: 1. Bracket: PC UL94V-0, black 2. Cover plate: bracket: PCUL94V-0, black 3. Small door: bracket: PCUL94V-0, black 4. Reed: phosphor copper, lalo Ni, surface local phosphor phosphor: Large copper local Au 5. 7. Pihi: PC, ʻeleʻele 8. ʻO ka puna puka liʻiliʻi: ke kila kila Electrical ch...
AMP C70210M0089254 Mea Hoʻohui Kāleka Naauao & RU-618 Mea Hoʻohui Kāleka Naʻauao KLS1-SCC01 (RU-618)
ʻIke Huahana AMP C70210M0089254 Hoʻohui Kāleka akamai & RU-618 Hoʻohui Kāleka Smart Nā ʻano uila: Ka helu o nā CONTACTS : 8 Pins i helu ʻia: 50V MAX i helu ʻia i kēia manawa: 1A MAX Dielectric withstanding voltage : 500V AC rms 1min (sealevel) Māhele No. Kauoha Manawa
2.54mm Pitch Edge Kāleka Mea Hoʻohui Kau PCB Dip 90 180 Type KLS1-603D
ʻIke Huahana 2.54mm Pitch Edge Card Connector Slot PCB Dip 90 180 Type Order InformationKLS1-603D-XX-S603D-Me ka Ear XX-No.of 12-100pinS-Straight pin R-Right Angle Pin Material:Housing: Glass filled PBT UL94V-0Contact gold: Bralat BronsContact E hoʻopaʻa i ka Tin ma luna o Nickel Electrical Characteristics: Ka helu o kēia manawa: 2 AMPInsulator Resistance: 1000M Ohm min. ma DC 500V DCContact Kū'ē: 30m Ohm max. ma DC 100mAWithsstand...
2.54mm Pitch Edge Kāleka Mea Hoʻohui Kau PCB Dip 90 180 Type KLS1-603C
ʻIke Huahana 2.54mm Pitch Edge Card Connector Slot PCB Dip 90 180 Type Order InformationKLS1-603C-XX-RXX-No.of 10-100pinS-Straight pin R-Right Angle Pin Material:Housing: Glass filled PBT UL94V-0Contacts: Brass and Bronze Phosphor Contacts Nā hiʻohiʻona: Ka helu o kēia manawa: 2 AMPInsulator Resistance: 1000M Ohm min. ma DC 500V DCContact Kū'ē: 30m Ohm max. ma DC 100mAWiths kūmau Volt...
1.27mm Pitch Hui Kāleka PCI 120 Pin DIP 180 KLS1-503C
ʻIke Huahana 1.27mmPitchPCI Kāleka Hoʻohui 120 Pin DIP 180 ʻIkepili KauohaKLS1-503C-120-S-W120-No.o 120pinS-Piki pololei W-White G-Green B-ʻEleʻele MATERIAL INSULATOR: GLASS-REINFORCED THERMOPLASTICED. HOOLAHA: ALLOY COPPER. PLATING: MATING AREA-GOLD FLASH GOLD OVER NICKEL.SOLDER AREA-TIN/LEAD OVER NICKEL. KA PALAPALA UILA: 250 VAC RMS. KA LĀKAI KĀWAI: 1 AMP. DIELECTRIC WITHSTANDING VILTAGE: 500 VAC RMA 60Hz NO 1 MINUTE. INSULATION...
1.27mm Pitch Hui Kāleka PCI 120 Pin DIP 180 KLS1-503B
ʻIke Huahana 1.27mmPitchPCI Kāleka Hoʻohui 120 Pin DIP 180 ʻIkepili KauohaKLS1-503B-120-S-W120-No.o 120pinS-Piki pololei W-Keʻokeʻo G-Green B-ʻEleʻele MATERIAL INSULATOR: GLASS-REINFORCED THERMOPLASTICED. HOOLAHA: ALLOY COPPER. PLATING: MATING AREA-GOLD FLASH GOLD OVER NICKEL.SOLDER AREA-TIN/LEAD OVER NICKEL. KA PALAPALA UILA: 250 VAC RMS. KA LĀKAI KĀWAI: 1 AMP. DIELECTRIC WITHSTANDING VILTAGE: 500 VAC RMA 60Hz NO 1 MINUTE. INSULATIO...
1.27mm Pitch Edge Kāleka Hoʻohui Kau PCB Dip 90 180 SMT Type KLS1-503
ʻIke Huahana 1.27mmPitch Edge Card Connector Slot PCB Dip 90 180 SMT Type Order InformationKLS1-503-XX-S-BXX-No.of 04-68pinS-Straight pin R-Right Angle Pin T1-SMT PinW-White G-Green B-ʻeleʻele O-PA mea hoʻopiha:PBT. UL94V-0Contacts: BrassPlating: Hoʻokaʻaʻike i ke gula a me ka Dip Tin ma luna o NickelElectrical Characteristics:Ka helu o kēia manawa: 1 AMP Voltage Rating:250 VACIinsulator Resistance: 1000M Ohm min. ma ka DC 500V DCContact Resistan...
1.0mm Pitch PCIE Kāleka Hoʻohui 164P KLS1-PCIE05C
ʻIkepili Huahana 1.0mmPitchPCIE kāleka Connector164P ʻIkepili KauohaKLS1-PCIE05C-164-B-G1U-R164-No.of 164pinsB-ʻeleʻele Y-Yellow L-Blue W-WhitePlating:1u"Gold ~30u"GoldG1U=Gold 1u"GTray Mea Pahu E-Pahu: Hale:PBT/PA66,UL94V-0 Hoʻokaʻaʻike: Pale keleawe: Kau gula ma luna o Nickel. Mechanical Insertion Forge: 1.15N Max Per Contact Pair Withdrawal Force: 0.15N Min no kēlā me kēia hui pilina Hoʻopaʻa Paʻa Manaʻo: 4.9N Min...
1.0mm Pitch PCIE Kāleka Hoʻohui 164P KLS1-PCIE05B
ʻIkepili Huahana 1.0mmPitchPCIE Kāleka Mea Hoʻohui 164P ʻIkepili KauohaKLS1-PCIE05B-164-B-G1U-R164-No.o 164pinsB-ʻeleʻele Y-Yellow L-Blue W-WhitePlating:1u"Gold ~30u"GoldG1U=Gold 1u="AGT-Gold 1u"A Mea Pahu E-Pahu: Hale:PBT/PA66,UL94V-0 Hoʻokaʻaʻike: Pale keleawe: Kau gula ma luna o Nickel. Mechanical Insertion Forge: 1.15N Max Per Contact Pair Withdrawal Force: 0.15N Min per contact pair Contact Retention Force: 4.9N M...
1.0mm Pitch PCIE Kāleka Hoʻohui 164P KLS1-PCIE05A
ʻIke Huahana 1.0mmPitchPCIE Kāleka Hoʻohui 164P ʻIkepili KauohaKLS1-PCIE05A-164-B-G1U-R164-No.of 164pinsB-ʻEleʻele Y-Yellow L-Blue W-WhitePlating:1u"Gold ~30u"GoldG1U=Gold 1u="AGT-Gold 1u"A Mea Pahu E-Pahu: Hale:PBT/PA66,UL94V-0 Hoʻokaʻaʻike: Pale keleawe: Kau gula ma luna o Nickel. Mechanical Insertion Forge: 1.15N Max Per Contact Pair Withdrawal Force: 0.15N Min per contact pair Contact Retention Force: 4.9N Mi...
1.0mm Pitch PCIE kāleka Mea hoʻohui pū pcb dip 90 KLS1-PCIE04
ʻIke Huahana 1.0mmPitchPCIE kāleka Mea hoʻohui slot pcb dip 9036P 64P 98P 164P 280P ʻIke KauohaKLS1-PCIE04-XX-B-G1U-AXX-No.o 36-280PpinsB-ʻeleʻele G-Green O-WhiteuPlatu G-Green O-Alani L-Blue W-3" GoldG1U=Gold 1u" G30U=Gold 30u"A-Tube C-Tray E-Box Material: Hale:PBT/PA66,UL94V-0 Contact: Brass Plating: Gold Plating Over Nickel. Hoʻokomo Mechanical Forge: 1.15N Max no kēlā me kēia hui ʻana i ka hoʻokuʻu ʻana i ka ikaika: 0.15...
1.0mm Pitch PCIE Kāleka Hoʻohui SMT Type KLS1-PCIE03A
ʻIkepili Huahana 1.0mmPitchPCIE Kāleka Mea hoʻohui SMT Type 36P 64P 98P 164P ʻIke KauohaKLS1-PCIE03A-XX-B-G1U-AXX-No.o 36-164pinsB-ʻeleʻele G-Green O-Alani L-Blue W-WhitePlating ~1u"=1u"Gold:1u"=1u" G30U=Gold 30u"A-Tube R-Reel Material: Housing:PA6T/LCP,UL94V-0 Contact: Brass Plating: Gold Plating Over Nickel. Mechanical Insertion Forge: 1.15N Max no kēlā me kēia Hoʻokaʻaʻike Pair Withdrawal Force: 0.15N Min no ka hoʻopili...
1.0mm Pitch PCIE Kāleka Hoʻohui Māhele ʻAno KLS1-PCIE02C
ʻIkepili Huahana 1.0mmPitchPCIE Kāleka Hoʻohui Kāleka Splint Type 36P 64P 98P 164P Order InformationKLS1-PCIE02C-XX-B-G1U-AXX-No.of 36-164pinsB-ʻeleʻele G-Green O-Alani L-Blue W-WhiteGolding ~3u"=1u"=1u" G30U=Gold 30u"A-Tube C-Tray E-Box Material: Housing:PBT/PA66,UL94V-0 Contact: Brass Plating: Gold Plating Over Nickel. Mechanical Insertion Forge: 1.15N Max Per Contact Pair Withdrawal Force: 0.15N ...
1.0mm Pitch PCIE Kāleka Hoʻohui Māhele ʻAno KLS1-PCIE02B
ʻIke Huahana 1.0mmPitchPCIE Kāleka Hoʻohui Kāleka Splint Type 36P 64P 98P 164P Order InformationKLS1-PCIE02B-XX-B-G1U-AXX-No.of 36-164pinsB-ʻeleʻele G-Green O-Alani L-Blue W-WhiteGolding ~3u"=1u"=1u" G30U=Gold 30u"A-Tube C-Tray E-Box Material: Housing:PBT/PA66,UL94V-0 Contact: Brass Plating: Gold Plating Over Nickel. Mechanical Insertion Forge: 1.15N Max no kēlā me kēia Hoʻopili Pair Withdrawal Force: 0.15N Min per cont...
1.0mm Pitch PCIE Kāleka Hoʻohui Māhele ʻAno KLS1-PCIE02A
ʻIkepili Huahana 1.0mmPitchPCIE Kāleka Hoʻohui Kāleka Splint Type 36P 64P 98P 164P Order InformationKLS1-PCIE02A-XX-B-G1U-AXX-No.of 36-164pinsB-ʻEleʻele G-Green O-Alani L-Blue W-WhiteGolding ~3u"=1u"=1u" G30U=Gold 30u"A-Tube C-Tray E-Box Material: Housing:PBT/PA66,UL94V-0 Contact: Brass Plating: Gold Plating Over Nickel. Mechanical Insertion Forge: 1.15N Max no kēlā me kēia Hoʻokaʻaʻike Pair Withdrawal Force: 0.15N Min no ka hoʻopili...
1.0mm Pitch PCIE kāleka Mea hoʻohui pū pcb dip 180 KLS1-PCIE01
ʻIke Huahana 1.0mmPitchPCIE kāleka Mea hoʻohui slot pcb dip 18026P 36P 64P 98P 164P ʻIke KauohaKLS1-PCIE01-XX-B-G1U-AXX-No.o 26-164pinsB-ʻeleʻele G-Green O-Alani L-Blue W-WhiuGold":WhiuGold":30WhiuGold GoldG1U=Gold 1u" G30U=Gold 30u"A-Tube C-Tray E-Box Material: Hale:PBT/PA66,UL94V-0 Contact: Brass Plating: Gold Plating Over Nickel. Hoʻokomo Mechanical Forge: 1.15N Max no kēlā me kēia Hoʻopili Pair Withdrawal Force: 0.1...
0.8mm Pitch Mini PCIE Mea Hoʻohui SMT 52P, Kiʻekiʻe 2.0mm 3.0mm 4.0mm 5.2mm 5.6mm 6.8mm 7.0mm 8.0mm 9.0mm 9.9mm KLS1-PCI06E-52P
ʻIke Huahana 0.8mm Pitch Mini PCI-E Mea hoʻohui SMT 52P,Kiʻekiʻe 2.0mm 3.0mm 4.0mm 5.2mm 5.6mm 6.8mm 7.0mm 8.0mm 9.0mm 9.9mm ʻIke KauohaKLS1-PCI06E-52P-H4.0=H3.0-H2. H3.0=3.0mm H4.0=4.00mm H5.2=5.20mmH5.6=5.60mmH6.8=6.80mmH7.0=7.00mm H8.0=8.00mmH9.0=9.00mm H9.9=9.90mm Plating:1u"Gold 10u" G3U=Gold 3u"G30U=Gold30u" Mea hale hale: Thermoplastic, Temp kiʻekiʻe, UL9...
0.50mm Pitch M.2 NGFF Card Connector 67P, Kiʻekiʻe 1.2mm 1.5mm 1.8mm 3.1mm 4.0mm 5.8mm 6.4mm KLS1-NGFF01
ʻIke Huahana 0.50mm Pitch M.2 NGFF Kāleka Mea Hoʻohui 67P ʻIkepili KauohaKLS1-NGFF01-3.2-67-B-G0 Kiʻekiʻe:1.2mm 1.5mm 1.8mm 3.2mm 4.0mm 5.8mm 6.4mmGʻula: ʻEleʻele Plating:1u"~30u"Gold Gold 3u "G30U-Gold30u" 0.5mm pitch me 67 kūlana Hoʻolālā ʻia no nā modula hoʻokahi a ʻelua ʻaoʻao Loaʻa i nā koho kī like ʻole no nā kāleka module Kākoʻo iā PCI Express 3.0, USB 3.0, a me SATA 3.0 Koho i ke kiʻekiʻe, kūlana, de...
ʻO ka mea hoʻohui kāleka Micro SD e huki huki, H1.5mm, me ka pine CD KLS1-TF-019
ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD e huki huki, H1.5mm, me ka pine CD Material: Hale: Thermoplastic Kiʻekiʻe, UL94V-0, ʻEleʻele. Hoʻokaʻaʻike: Copper Alloy T=0.15.Plated Gold Flash on Contact Area. Shell:Stainless Steel T=0.20.Plated Gold Flash on Solder huelo. Uila: Kuhi ʻia i kēia manawa:0.5A Ka Voltage i koho ʻia: 30V Kūʻai Kūʻai: 50mΩ Max. Kū'ē Kū'ē: 100MΩ Min./100V DC Dielectric Me ka Voltage: 100V AC Paʻa: 5000 Cycles. Oper...
Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.29mm, me ka pine CD KLS1-TF-018
ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD pana pana,H1.29mm, me ka pine CD Material: Insulator:LCP,UL94V-0,Black. Paheʻe:LCP,UL94V-0,ʻEleʻele. Latch: Bronze Phosphor. Hoʻopili: Phosphor Bronze. Shell:SUS304 Puna:Stainless Steel. Crank-axle: Ke kila ʻole. Uila: Voltage:100V AC I kēia manawa:0.5A Max. Kū'ē Pili: 40mΩ Max. Hōʻoiaʻiʻo Voltage:: 500V AC Kū'ē Kū'ē: 1000MΩ Min. Kāleka Hoʻokomo/Hoʻihoʻi Manaʻo:10N Max. Hoʻoikaika i ka ikaika: 10N Durabi...- English
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