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Nā mea hoʻohui kāleka hoʻomanaʻo

Hoʻohui kāleka SD 4.0 NO pana,H3.0mm KLS1-SD4.0-002

ʻIke Huahana Hoʻohui kāleka SD 4.0 NO pana, H3.0mm Material: Insulator: LCP helu ʻia, UL94V-0

ʻO ka mea hoʻohui kāleka SD 4.0 pana pana,H3.0mm,Huli KLS1-SD4.0-001A

ʻIke Huahana Huahana SD 4.0 ka mea hoʻohui kāleka pahu pana, H3.0mm, Mea Hoʻohuli: Insulator: LCP helu ʻia, UL94V-0

ʻO ka mea hoʻohui kāleka SD 4.0 pana i ka pahu, H3.0mm KLS1-SD4.0-001

ʻIke Huahana ʻO SD 4.0 ka mea hoʻokuʻu kāleka pahu pana, H3.0mm Material: Insulator: LCP helu ʻia, UL94V-0

Huki huki ka mea hoʻohui kāleka SD, H2.5mm, me ka pine CD KLS1-TF-020

ʻIke Huahana Huki huki ka mea hoʻohui kāleka SD, H2.5mm, me ka pin CD Material: Hale: Hi-Temp plastic, UL94V-0. Hoʻopili: Copper Alloy. Nail:Sila ʻole. Hoʻopau: Hoʻokaʻaʻike:G/F Gold plated on conatct area; Hoʻopili ʻia ʻo G/F ma nā huelo solder, Base Nickel 50u" Min Nail:50u" Nickel Under,100u" Tin Overall. Part No. Description PCS/CTN GW(KG) CMB(m3) OrderQty. Time Order

Huki huki ka mea hoʻohui kāleka SD, H3.75mm KLS1-TF-006

ʻIke Huahana Mea hoʻohui kāleka SD pahu huki,H3.75mm Material: Hale: Thermoplastic,UL94V-0.Natural. Terminal: Copper Alloy, Au Plating.Contact Area:G/F; Matte Tin Plated on Soldering. Shell:Sila ʻole. Uila: Kū'ē Kū'ē: 80mΩ Max. Kū'ē Kū'ē: 100MΩ Min. Dielectric Withstanding Voltage:500V AC. Nā ʻano Mechanical Paʻa Manaʻo: Min.100gf/Pin. Māhele No. Hōʻike PCS/CTN GW(KG) CMB(m3) OrderQty. ...

Hoʻokuʻu ka mea hoʻohui kāleka SD, H3.4mm, me ka pine CD KLS1-TF-005S

ʻIke Huahana Hoʻohui kāleka SD pahu huki huki,H3.4mm,me CD pin Material:Insulator:Thermal Plastic UL94V-0Contacts:Copper Alloy Specification:I kēia manawa helu:1Amps MaxContact resistance:100mΩ Max.Insulation resistance:1000ΜΩ Min.Mating Cycle:10000 Cycles Minute Minute. mahana:-40ºC~+85ºC Māhele No. Hōʻike PCS/CTN GW(KG) CMB(m3) OrderQty. Kauoha Manawa

Hoʻokuʻu ka mea hoʻohui kāleka SD, H3.4mm, me ka pine CD KLS1-TF-005

ʻIke Huahana Hoʻohui kāleka SD pahu huki huki,H3.4mm,me CD pin Material:Housing:Kiʻekiʻe Temperature ThermoplasticContacts:Copper Alloy Specification:Current rating:0.5AVoltage Rating:250VRMContact resistance:100mΩ Max.Insulation resistance:100ΜΩ Min.Dielectric: 5000CM Voltage: 50ΜΩ Min. Hoʻomoe Minute.Mahana hana:-25ºC~+90ºC Māhele No. Hōʻike PCS/CTN GW(KG) CMB(m3) OrderQty. Ka Manawa...

Hoʻokuʻu ka mea hoʻohui kāleka SD, H2.75mm, me ka pine CD KLS1-SD112

ʻIke Huahana Huki huki ka mea hoʻohui kāleka SD, H2.75mm, me ka pin CD Material: Hale: Thermoplastic Kiʻekiʻe. Hoʻopili: Copper Alloy. Shell: Copper Alloy, Kāwili gula ma nā huelo solder, Underplated Nickel ma luna o nā mea a pau. Plating: Contact Area:Gold Plated over Ni. Solder Tail:30u" Min Sn Plated Over Ni. Uila: I kēia manawa helu: 0.5A. Voltage Rating: 250VRMS Hoʻokaʻaʻike kū'ē: 40mΩ Dielectric Kū'ē Voltage:500V AC. Insulation Kū'ē:100M&Ome...

Hoʻohui kāleka SD Reverse MID MOUNT 1.75mm, DIP me CD Pin KLS1-SD003

ʻIke Huahana Hoʻohui kāleka SD Reverse MID MOUNT 1.75mm, DIP me CD Pin Material: Hale:LCP S475,UL94V-0.Black. Shell:Sila ʻole SUS304. Hoʻokaʻaʻike: Copper Alloy C5210. Hoʻopau: Hoʻokaʻaʻike:Gold Plated on Contact Area.Matte Tin 100u "Min On Soldertail Area.50u" Min Nickel Plating Overall. Shell:30u" Min Solderable Nickel Plating Overall. Part No. Description PCS/CTN GW(KG) CMB(m3) OrderQty. Time Order

Hoʻokuʻu ka mea hoʻohui kāleka SD, H2.8mm, me ka pine CD KLS1-SD002

ʻIke Huahana Huki huki ka mea hoʻohui kāleka SD, H2.8mm, me ka pine CD Material: Hale:LCP,UL94V-0.Black. Terminal:C5191R-EH T = 0.20, Hoʻokaʻaʻike G / F, Ni 40u "min, Kino Kuʻi 80u WP Pin: C5191R-EH T = 0.20, Hoʻokaʻaʻike G / F, Ni 40u" min, Kino Kuʻi 80u CD Pin: C5191R-EH "TCon = 0.20" min, Kino Kuʻi 80u Shell: C2680-H, T=0.20, NI 40u" min. Uila: Hoʻokaʻaʻike i kēia manawa: 0.5Amperes. Dielectric Withstanding Voltage: AC500V rms. ʻO ka hoʻokuʻu ʻana...

Hoʻokuʻu ʻia ka mea hoʻohui kāleka SD, H2.8mm, me ka pine CD KLS1-SD-001 / KLS1-SD-101

ʻIke Huahana ʻO ka mea hoʻohui kāleka SD pana i ka pana,H2.8mm, me ka pine CD Material: Insulator: Thermoplastic High Temperature,UL94V-0. Hoʻokaʻaʻike: Copper Alloys.Plated 50u" Ni Overall Plated Au Selective Contact Area,Plated 100u" Sn Over Ni On Solder Area. Shell:Plated 50u" Ni Ka holoʻokoʻa. Uila: Voltage Rating: 125V AC/DC o kēia manawa: 0.5mA AC/DC Max. Ambient Humidity Range:95% RH Max. Hoʻokaʻaʻike kū'ē: 100mΩ Max. Insulation kū'ē: 1000M&O...

5 i loko o 1 Kāleka Hoʻohui, H4.3mm KLS1-MUT51-001

ʻIke Huahana 5 i loko o 1 Kāleka Hoʻohui,H4.3mm Material Insulator:Hi-Temperature Plastic,UL94V-0,Laula:ʻEleʻele Terminal: Copper Alloy,Selector Gold Flash Plating On Contact Area,AND 50U" Min Nickel Underplated On Allover Shell:Stainless Stell,50u" Nickel Underplated On Allover,Gold Electrical Flash min.AT DC 500V DC E kū i ka uila: 250V ACrms NO 1 Minute Hoʻopili kū'ē: 100mΩ max.AT 10mA/20mV ...

Hoʻokuʻu ʻia ka mea hoʻohui kāleka SD micro, H1.5mm KLS1-TF-011-H1.5-R

ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD pana huki huki,H1.5mm Mahele No. Hōʻike PCS/CTN GW(KG) CMB(m3) OrderQty. Kauoha Manawa

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD 4.0, H1.3mm KLS1-SD4.0-003

ʻIke Huahana ʻO Micro SD 4.0 ka mea hoʻohui kāleka pahu pana, H1.3mm Material: Insulator: Thermal Plastic, Pated UL94V-0. Hoʻopili: Phosphor Bronze. Shell:Sila ʻole. Hoʻokaʻaʻike Plating: Underplate: 50u "-100u" Nickel Hoʻokaʻaʻike wahi:Gold Flash Solder huelo wahi:100u"-200u" Tin Uila: Hana Voltage:10V kēia manawa helu:0.5A Min. Kū'ē Pili: 100mΩ Max. Kū'ē Insulation: 1000MΩ Dielectric Withstanding Voltage: 500VAC / 1 Minu...

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD 4.0 KLS1-SD4.0-004

ʻIke Huahana ʻO Micro SD 4.0 ka mea hoʻokuʻi kāleka pahu pahu Mea: Plastic:LCP,Thermoplastic UL94V-0.Black. Hoʻopili: Copper Alloy. Shell:Sila ʻole. Plating: Contact Area:Au 3u" Over Ni 50u". ʻĀpana Hiʻu Kūʻai: ʻO ka Tin Matted 80u "Min. Ma luna o Ni 50u". Solderability:Over Plating Ni 50" Over All. Part No. Description PCS/CTN GW(KG) CMB(m3) OrderQty. Time Order

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.28mm, me ka pine CD KLS1-SD113

ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD pana pana,H1.28mm, me ka pine CD Material: Insulator: Thermoplastic Kiʻekiʻe LCP SZ6505,UL94V-0, ʻEleʻele. Hoʻokaʻaʻike: Berylliun Copper (7035-TM06, T = 0.15mm), Plated 80u "min Ni holoʻokoʻa plated 1u" min Au ma luna o Ni ma solder wahi. Shell:SUS301-3/4H T=0.10mm.Solder huelo plated 1u "min Au overll 50u" min Ni. Uila: Ka helu o kēia manawa:0.5A AC/DC max. Voltage Rating:12V AC/DC Ambient Humidity Range:95% RH ...

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.68mm, me ka pine CD KLS1-SD114

ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD pana pana,H1.68mm, me ka pine CD Material: Insulator: Hi-Temperature Plastic, UL94V-0, Black. Terminal: Copper Alloy, Gold flash plating ma ka wahi hoʻopili & solder huelo. Shell:Stainless Steel, Nickel underplated on allover, kukui gula ma ka huelo solder. Uila: Kū'ē Insulation: 1000MΩ Min./500V DC Me ka Voltage Kū'ē: 250V AC / minuke. Kū'ē Pili: 100mΩ Max.AT 20mA/20mV Max Ka helu o kēia manawa:0.5 A Voltage...

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.85mm, wehe maʻamau KLS1-SD107

ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD pana pana,H1.85mm,Wehe maʻamau Uila: Hoʻokaʻaʻike i ka helu o kēia manawa:0.5A Max. Kūleʻa pili: 100mΩ Max. Palekana Insulation: 250V DC a i ʻole 300V AC no ka liʻiliʻi ma mua o 1 mau minuke Ka lōʻihi o ka male: 10000 Cycles Min. Ka ikaika hoʻokomo: 2.0kgf max. Ka ikaika o ka unuhi: 0.5kgf min. Ka Mahana Hana: -25ºC~+85ºC Māhele No. Hōʻike PCS/CTN GW(KG) CMB(m3) OrderQty. Kauoha Manawa

ʻO ka mea hoʻohui kāleka Micro SD e huki huki, H1.5mm, me ka pine CD KLS1-SD104

ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD e huki huki, H1.5mm, me ka pine CD Nā memo: Coplanarty spec.No nā huelo kūʻai a pau a me nā pad solder he 0.1mm max. Nā ʻano uila: Ka helu o kēia manawa: 0.5 Amp.MAX. Voltage: 100V DC.MAX Haʻahaʻa Haʻahaʻa Kūʻai Kūʻai: 100mΩ Max.Initially. Dielectric Withstanding Voltage:500V AC MIN.No 1 minuke. Kū'ē Insulation:(Initial)1000MΩ Min.(Hoʻopau)100MΩ Min. Ka Mahana Hana: -45ºC~+105ºC Durabilit...

ʻO ka mea hoʻohui kāleka Micro SD e huki huki, H1.5mm, me ka pine CD KLS1-TF-019

ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD e huki huki, H1.5mm, me ka pine CD Material: Hale: Thermoplastic Kiʻekiʻe, UL94V-0, ʻEleʻele. Hoʻokaʻaʻike: Copper Alloy T=0.15.Plated Gold Flash on Contact Area. Shell:Stainless Steel T=0.20.Plated Gold Flash on Solder huelo. Uila: Kuhi ʻia i kēia manawa:0.5A Ka Voltage i koho ʻia: 30V Kūʻai Kūʻai: 50mΩ Max. Kū'ē Kū'ē: 100MΩ Min./100V DC Dielectric Me ka Voltage: 100V AC Paʻa: 5000 Cycles. Oper...

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.29mm, me ka pine CD KLS1-TF-018

ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD pana pana,H1.29mm, me ka pine CD Material: Insulator:LCP,UL94V-0,Black. Paheʻe:LCP,UL94V-0,ʻEleʻele. Latch: Bronze Phosphor. Hoʻopili: Phosphor Bronze. Shell:SUS304 Puna:Stainless Steel. Crank-axle: Ke kila ʻole. Uila: Voltage:100V AC I kēia manawa:0.5A Max. Kū'ē Pili: 40mΩ Max. Hōʻoiaʻiʻo Voltage:: 500V AC Kū'ē Kū'ē: 1000MΩ Min. Kāleka Hoʻokomo/Hoʻihoʻi Manaʻo:10N Max. Hoʻoikaika i ka ikaika: 10N Durabi...

Hoʻohui kāleka Micro SD HINGED TYPE, H1.9mm KLS1-TF-017

ʻIke Huahana Hoʻohui kāleka Micro SD HINGED TYPE,H1.9mm Material: Insulator: High Temperature Thermoplastic Flammability Raring,UL94V-0,Black. Hoʻokaʻaʻike:Copper Alloys uhi:Stainless Steel Contact Area Plating:Gold voer Ni Solder Tail Coplanarity Pono i loko o 0.10MAX. Māhele No. Hōʻike PCS/CTN GW(KG) CMB(m3) OrderQty. Kauoha Manawa

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.4mm, me ka pine CD KLS1-TF-016

Product Information Micro SD card connector push push,H1.4mm,me CD pin Notes: 1.Coplanarity spec.for all solder tall and solder pad is 0.10mm 2.Electric features: 2-1.Current Rating:0.5 Amp.max. 2-2.Voltage:100V DC max. 2-3.Low pae conatct kū'ē:100mΩ Max. 2-4.Dielectric Withstanding Voltage:AC500V rms. 2-5. Kū'ē Kū'ē: 1000MΩ Min. (Hoʻopau) 100MΩ Min. 3. Mechanical hiʻona: 3-1. Durability:5000 Cycles. 3-2.Operatin...

ʻO ka mea hoʻohui kāleka Micro SD e huki huki, H1.42mm, me ka pine CD KLS1-TF-015

ʻIke Huahana Mea hoʻohui kāleka Micro SD pahu huki huki, H1.42mm, me ka pine CD Material: Metala ʻiʻo: ʻAi ʻole, Nickel holoʻokoʻa 50u" Hale: Liouid crystal polymer, UL94V-0
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