Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD 4.0 KLS1-SD4.0-004
E ʻoluʻolu e hoʻoiho i ka ʻike PDF:
Huahana Huahana
Huahana Huahana
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| Puke ka mea hoʻohui kāleka Micro SD 4.0 Material: Pākīpika:LCP, Thermoplastic UL94V-0. ʻEleʻele. Hoʻopili: Copper Alloy. Shell:Sila ʻole. Pāpala: Contact Area:Au 3u" Over Ni 50u". ʻĀpana Hiʻu Kūʻai: ʻO ka Tin Matted 80u "Min. Ma luna o Ni 50u". Solderability: Over Plating Ni 50" Ma luna o nā mea a pau. |
| Mahele No. | wehewehe | PCS/CTN | GW(KG) | CMB(m3) | OrderQty. | Manawa | Kauoha |
