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ʻO ka mea hoʻokuʻu kāleka Micro SD 4.0 e pana Material: Pākīpika:LCP,Thermoplastic UL94V-0.ʻeleʻele. Hoʻopili: Copper Alloy. Shell:Sila ʻole. Pāpala: Contact Area:Au 3u" Over Ni 50u". ʻĀpana Hiʻu Kūʻai: ʻO ka Tin Matted 80u "Min. Ma luna o Ni 50u". Solderability: Over Plating Ni 50" Ma luna o nā mea a pau. |
Mahele No. | wehewehe | PCS/CTN | GW(KG) | CMB(m3) | OrderQty. | Manawa | Kauoha |