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Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.85mm, me ka pine CD KLS1-TF-003
Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.85mm, me ka pine CD KLS1-TF-003 Kiʻi Hōʻikeʻike.
  • Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.85mm, me ka pine CD KLS1-TF-003

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.85mm, me ka pine CD KLS1-TF-003

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Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.85mm, me ka pine CD Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.85mm, me ka pine CD

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Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.85mm, me ka pine CD

Material:
Insulator: Thermoplastic wela kiʻekiʻe, UL94V-0.
Hoʻokaʻaʻike: Copper Alloy T=0.15,Plated 50u” Ni Overall. Plated Au Selective
Hoʻokaʻaʻike Area Plated 30u”-70u” Sn Over Ni On Solder Area.
Shell:T=0.15,Plated 30u” Ni Overall min. Plated 0.5u” Au Selective Contact Area
Uila:
Ka helu o kēia manawa: 0.5 A
Ka helu Voltage: 3.3V
Māhele Haʻahaʻa Ambient:95% RH Max.
Kū'ē Pili: 100mΩ Max.
Kū'ē Kū'ē: 1000MΩ Min./500VDC
Nā pōʻaiapili male:5000 hoʻokomo.
Ka Mahana Hana: -45ºC~+105ºC

 

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