Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.85mm, me ka pine CD KLS1-TF-003

Huahana Huahana

Nā Kiʻi Huahana

ʻIke Huahana

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.85mm, me ka pine CD

Material:

Insulator: Thermoplastic wela kiʻekiʻe, UL94V-0.

Hoʻokaʻaʻike: Copper Alloy T=0.15, Plated 50u” Ni Ka holoʻokoʻa.Plated Au Selective

Hoʻokaʻaʻike Area Plated 30u”-70u” Sn Over Ni Ma Solder Area.

Shell:T=0.15,Plated 30u” Ni Ka nui min.Helu 0.5u” Au koho Hoʻokaʻaʻike

Uila:

Ka helu o kēia manawa: 0.5 A

Ka helu Voltage: 3.3V

Māhele Haʻahaʻa Ambient:95% RH Max.

Kū'ē Pili: 100mΩ Max.

Kū'ē Kū'ē: 1000MΩ Min./500VDC

Nā pōʻai male:5000 hoʻokomo.
Ka Mahana Hana: -45ºC~+105ºC

Mua: Hoʻohui Kāleka Micro SD; ʻAno Hined, H1.9mm KLS1-TF-002

Aʻe: Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD ma waena, H1.8mm, me ka pine CD KLS1-TF-003A