Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.85mm, me ka pine CD KLS1-TF-003D
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Huahana Huahana
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ʻIke Huahana
Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.85mm, me ka pine CD
Material:
Insulator: Thermoplastic Mahana Kiekie, LCP, UL94V-0.
Hoʻokaʻaʻike: Copper Alloy T=0.15, Plated 50u” Ni Ka holoʻokoʻa.
Hoʻopili ʻia Au Selective Contact Area Plated 30u”-70u” Sn Over Ni On Solder Area.
Hoʻopili ʻia Au Selective Contact Area Plated 30u”-70u” Sn Over Ni On Solder Area.
Shell:T=0.15,Plated 30u” Ni Ka nui min.Hoʻopili ʻia 0.5u” Au Selective Contact Area
Uila:
Ka helu o kēia manawa: 0.5mA amx.
Ka helu Voltage: 3.3V
Māhele Haʻahaʻa Ambient:95% RH Max.
Kū'ē Pili: 100mΩ Max.
Kū'ē Kū'ē: 1000MΩ Min./500VDC
Nā pōʻai male:5000 hoʻokomo.
Ka Mahana Hana: -45ºC~+105ºC
