Hoʻohui Kāleka SIM Micro,8P＋1P Me ka Huli, PUSH PUSH,H1.56mm KLS1-SIM-094
E ʻoluʻolu e hoʻoiho i ka ʻike PDF:
Huahana Huahana
Huahana Huahana
Nā Kiʻi Huahana
 |  |
ʻIke Huahana
Hoʻohui Kāleka Micro SIM, 8P＋1P Me ka hoʻololi, PUSH PUSH, H1.56mm
Material:
Noho: Thermoplastic wela kiʻekiʻe, UL94V-0
Hoʻokaʻaʻike: Copper Alloy, Au 1u ", Solder wahi: Gold Flash; Ma lalo o ka pā Ni 40u" Min a pau.
Shell:SUS,Plated 30U” Ni Ka holoʻokoʻa, Solder wahi:Gold Flash
Uila:
Ka helu o kēia manawa: 1.0A
Ka helu Voltage: 50V
Kū'ē Pili: 100mΩ Max.
Dielectric Withstanding Voltage:500V AC
Kū'ē Kū'ē: 1000MΩ Min./250VDC
Ka Mahana Hana: -45ºC~+85ºC
