Kauwaena mauna USB Type-C 16P IPX7 mea hookui wai
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ʻIke Huahana
Kauwaena mauna USB Type-C 16P IPX7 mea hookui wai
Material:
ʻO ka hale: Nylon Plastic
Ma luna o ka Molding1: Nylon Plastic
Pākuʻi Solder:SUS304 Plated Solders Nickel
Nā hiʻohiʻona uila:
Voltage/I kēia manawa: 4V/3.0A
Dielectric Withstanding Voltage: 100VAC
Kaulana Mahana: -30%%DC~+ 85%%DC
Kū'ē Pili: 40mΩ Max
Kū'ē Insulator: 100MΩ Min
Ka Mana Hoʻokomo Mua: 5-20N;
Puhi Hoʻokuʻu: 8-20N
Ma hope o ka lōʻihi: 10000 Cycles,
Puhi Hoʻokomo: 5-20N , Puhi Extaction: 6-20N
Papa Waiwai: IP67
inoa mea kūʻai | Hoʻopili USB |
Palapala hōʻoia | ISO9001, ISO14000, ROHS, REACH |
MOQ | Hiki ke ʻae ʻia ke kauoha liʻiliʻi |
Palapala noi | Hoʻohana nui ʻia i nā lako kelepona, kamepiula |
Pūʻolo | E hoʻokomo i loko o ka pahu pahu maʻamau me ka papa inoa packing a me ka hōʻailona hoʻouna |
Laʻana | No ka manuahi |
ʻAno uku ʻae ʻia | T/T, Kāleka ʻaiʻē, PayPal, Western Union |
ʻAe ʻia nā ʻōlelo hoʻouna | FOB, CIF, EXW |
Hāʻawi | E kūʻai i nā huahana ma 3 nā lā hana |
Hoʻopilikino huahana a puni7 nā lā hana |
Mea Hana ʻOihana o ka USB 3.1 Type C Wahine 16P SMT Connector IPX7 | |
1. MATERIAL: | |
1-1. KA PILI KUWAHO: | SUS301-1/2H T=0.20mm |
1-2. ʻO LOKO: | SUS301-1/2H T=0.20mm |
1-3. HOAILONA: | SUS301-H T=0.10mm |
1-4.RFI PAD: | SUS301-H T=0.10mm |
1-5.HALE: | LCP+30%GF UL94 V-0 ELELE |
1-6.TEMINARL: | ALOHA COPPER C19400-HT=0.10mm |
2. PLATING SPECIFICATION | |
2-1.TERMINAL: | LUKA GULA. |
2-2.PELE: | NIKEL PLATED 60μ"MIN. |
3. HANA MECHANICAL | |
3-1. KA MANA HOOKO: | 5N~20N. |
3-2. WITHDRAWAL MANA: | 8N~20N mua, ma hope o 1000 mau pōʻaiapili 6N~20N. |
3-3. LOA: | 10000 PALAPALA. |
4. HANA UILA | |
4-1. KA PALAPALA O KEIA: | 3A. |
4-2.LLCR: Hoʻokaʻaʻike: | 40mΩ MAX(MUA). |
4-3. INSULATION RESISTANCE: | OLE: 100MΩ MIN. |
4-4. DIELECTRIC WITHSTAND VOLTAGE: | 100V/AC. |
5. IR REFLOW: | |
E mālama ʻia ka wela ma luna o ka papa no 10 kekona ma ka 260±5°C. | |
6. KA HANA MAHELE: -55°C~105°C. | |
7. ROHS COMPLIANT OR HALOGEN FREE COMPLIANT. |
Mea Hana ʻOihana o ka USB 3.1 Type C Wahine 16P SMT Connector IPX7 | |
1. MATERIAL: | |
1-1. KA PILI KUWAHO: | SUS301-1/2H T=0.20mm |
1-2. ʻO LOKO: | SUS301-1/2H T=0.20mm |
1-3. HOAILONA: | SUS301-H T=0.10mm |
1-4.RFI PAD: | SUS301-H T=0.10mm |
1-5.HALE: | LCP+30%GF UL94 V-0 ELELE |
1-6.TEMINARL: | ALOHA COPPER C19400-HT=0.10mm |
2. PLATING SPECIFICATION | |
2-1.TERMINAL: | LUKA GULA. |
2-2.PELE: | NIKEL PLATED 60μ"MIN. |
3. HANA MECHANICAL | |
3-1. KA MANA HOOKO: | 5N~20N. |
3-2. WITHDRAWAL MANA: | 8N~20N mua, ma hope o 1000 mau pōʻaiapili 6N~20N. |
3-3. LOA: | 10000 PALAPALA. |
4. HANA UILA | |
4-1. KA PALAPALA O KEIA: | 3A. |
4-2.LLCR: Hoʻokaʻaʻike: | 40mΩ MAX(MUA). |
4-3. INSULATION RESISTANCE: | OLE: 100MΩ MIN. |
4-4. DIELECTRIC WITHSTAND VOLTAGE: | 100V/AC. |
5. IR REFLOW: | |
E mālama ʻia ka wela ma luna o ka papa no 10 kekona ma ka 260±5°C. | |
6. KA HANA MAHELE: -55°C~105°C. | |
7. ROHS COMPLIANT OR HALOGEN FREE COMPLIANT. |
Hua kūʻai
Nā ʻano kiʻi kiʻi: PDF
Hua'ōlelo: E like me kāu kiʻi (ka nui, ka lōʻihi, ke kiʻekiʻe, nā pine, ke ʻano hoʻopili, etc.)
Mea ho'āʻo: Mīkini wili, Mīkini Hoʻokuʻu Uila, Mīkini Milling, Reflow Soldering, Injection Molding Machine, Pressing Machine, Automatic Assembly Machine etc.
ʻO kā mākou pono
1.24 mau hola lawelawe ma ka pūnaewele & ʻōlelo wikiwiki / hoʻouna.
2.100% QC maikaʻi nānā ma mua o ka lawe ʻana, a hiki ke hāʻawi i ka palapala nānā maikaʻi.
3.12 mau makahiki o ka ʻike ma ka wahi hoʻohui a loaʻa iā ia kahi hui hoʻolālā kiʻekiʻe e hāʻawi i nā manaʻo hoʻololi kūpono.
4.ʻoihana hoʻokahi.
Hoʻopaʻa a me ka lawe ʻana
1.Arrange packing i loko o 24 hola, hoʻouna manawa i loko o 7-12days
2. ʻAʻohe uku ʻē aʻe, Pūnaehana maikaʻi ma hope o ke kūʻai aku, Kākoʻo i nā kipa ʻana i ka hale hana
3.100% nānā ʻia ma mua o ka hoʻouna ʻana
4.o nā huahana i loaʻa ka palapala hōʻoia ROHS
5.accept kālepa hōʻoia / kūlana pilikia hoʻihoʻi a hoihoi