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Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD 4.0 KLS1-SD4.0-004

ʻIke Huahana ʻO Micro SD 4.0 ka mea hoʻokuʻi kāleka pahu pahu Mea: Plastic:LCP,Thermoplastic UL94V-0.Black. Hoʻopili: Copper Alloy. Shell:Sila ʻole. Plating: Contact Area:Au 3u" Over Ni 50u". ʻĀpana Hiʻu Kūʻai: ʻO ka Tin Matted 80u "Min. Ma luna o Ni 50u". Solderability:Over Plating Ni 50" Over All. Part No. Description PCS/CTN GW(KG) CMB(m3) OrderQty. Time Order

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.28mm, me ka pine CD KLS1-SD113

ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD pana pana,H1.28mm, me ka pine CD Material: Insulator: Thermoplastic Kiʻekiʻe LCP SZ6505,UL94V-0, ʻEleʻele. Hoʻokaʻaʻike: Berylliun Copper (7035-TM06, T = 0.15mm), Plated 80u "min Ni holoʻokoʻa plated 1u" min Au ma luna o Ni ma solder wahi. Shell:SUS301-3/4H T=0.10mm.Solder huelo plated 1u "min Au overll 50u" min Ni. Uila: Ka helu o kēia manawa:0.5A AC/DC max. Voltage Rating:12V AC/DC Ambient Humidity Range:95% RH ...

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.68mm, me ka pine CD KLS1-SD114

ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD pana pana,H1.68mm, me ka pine CD Material: Insulator: Hi-Temperature Plastic, UL94V-0, Black. Terminal: Copper Alloy, Gold flash plating ma ka wahi hoʻopili & solder huelo. Shell:Stainless Steel, Nickel underplated on allover, kukui gula ma ka huelo solder. Uila: Kū'ē Insulation: 1000MΩ Min./500V DC Me ka Voltage Kū'ē: 250V AC / minuke. Kū'ē Pili: 100mΩ Max.AT 20mA/20mV Max Ka helu o kēia manawa:0.5 A Voltage...

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.85mm, wehe maʻamau KLS1-SD107

ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD pana pana,H1.85mm,Wehe maʻamau Uila: Hoʻokaʻaʻike i ka helu o kēia manawa:0.5A Max. Kūleʻa pili: 100mΩ Max. Palekana Insulation: 250V DC a i ʻole 300V AC no ka liʻiliʻi ma mua o 1 mau minuke Ka lōʻihi o ka male: 10000 Cycles Min. Ka ikaika hoʻokomo: 2.0kgf max. Ka ikaika o ka unuhi: 0.5kgf min. Ka Mahana Hana: -25ºC~+85ºC Māhele No. Hōʻike PCS/CTN GW(KG) CMB(m3) OrderQty. Kauoha Manawa

ʻO ka mea hoʻohui kāleka Micro SD e huki huki, H1.5mm, me ka pine CD KLS1-SD104

ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD e huki huki, H1.5mm, me ka pine CD Nā memo: Coplanarty spec.No nā huelo kūʻai a pau a me nā pad solder he 0.1mm max. Nā ʻano uila: Ka helu o kēia manawa: 0.5 Amp.MAX. Voltage: 100V DC.MAX Haʻahaʻa Haʻahaʻa Kūʻai Kūʻai: 100mΩ Max.Initially. Dielectric Withstanding Voltage:500V AC MIN.No 1 minuke. Kū'ē Insulation:(Initial)1000MΩ Min.(Hoʻopau)100MΩ Min. Ka Mahana Hana: -45ºC~+105ºC Durabilit...

Hoʻohui Kāleka SIM ʻelua, PUSH PULL, H3.0mm KLS1-SIM2-002A

ʻIke Huahana Hoʻohui Kāleka SIM ʻElua, PUSH PULL, H3.0mm Material: Hale: Hi-TEMP Plastic, UL94V-0.Black. Terminal:Copper alloy Shell:Stainless Steel Finish: Terminal:Au Plated on the contact area , Matte tin plated on the solder huelo underplated over nickel Shell:Au Plated on the solder huelo underplated over nickel Electrical: Contact Resistance:50mΩ Max Withstanding Voltage:350V AC rms no 1 minute Insulation...

2 In 1 Micro SIM & Kāleka Kāleka SD, 8P,H2.26mm KLS1-SIM-109

ʻIke Huahana 2 In 1 Micro SIM & SD Card Connector, 8P,H2.26mm Material: Insulator: High Temp Thermoplastic,UL94V-0.Black. Terminal: Copper Alloy,Gold plating in contact area 1u”,Solding Area gilding 1u"Upper Shell:Stainless Steel,Plate Nickel 50u". Down Shell:SUS304 R-1/2H T=0.10mm,Plate Nickel 50u". Uila: Mana Hookomo 1kgf Max.Withdrawal Force 0.1kgf Min. Ka lōʻihi: SIM 5000 Cycles, Hoʻokaʻaʻike Kūʻē: Ma mua o ka hoʻāʻo ʻana 8...

Hoʻohui Kāleka SIM ʻelua, PUSH PULL, H3.0mm KLS1-SIM-033

ʻIke Huahana Hoʻohui Kāleka SIM ʻElua, PUSH PULL, H3.0mm Material: Hale: Hi-Temperature Plastic, UL94V-0.Black. Terminal: Copper Alloy.Gold Flash Plated on All Terminal, AND 50u "Min Nickel Underplated on Allover. Shell:Stainless Steel.50u" Nickel Underplated on Allover,Gold Flash On Solder PAD. Uila: Ka helu o kēia manawa:0.5 A. Voltage Rating:5.0 vrms. Kū'ē Kū'ē: 1000MΩ Min.At DC500V DC. Me ka Voltage: 250V AC RMS No 1 ...

2 Ma 1 Kāleka SIM + Hoʻohui Micro SD, PUSH PULL, H2.7mm KLS1-SIM-024

ʻIke Huahana 2 Ma 1 Kāleka SIM + Hoʻohui Micro SD, PUSH PULL, H2.7mm Uila: Voltage: 100V AC i kēia manawa: 0.5A Max. Kū'ē Pili: 100mΩ Max. Dielectric Withstanding Voltage:500V AC. Palekana Insulation: 1000MΩ Min Mechanical: Kāleka Hoʻokomo ʻana i ka ikaika: 13.8N Max. Puhi I ka ikaika:19.6N Max. ʻO ka lōʻihi: 10000 Cycles. Ka Mahana Hana: -45ºC ~ + 85ºC Māhele No. Hōʻike PCS / CTN GW (KG) CMB (m3) OrderQty. Manawa...

Mea hoʻohui Kāleka SIM Nano; PUSH PULL, 6Pin, H1.40mm KLS1-SIM-113

ʻIke Huahana Nā Mea Hoʻohui Kāleka SIM Nano;PUSH PULL,6Pin,H1.40mm Material: Insulator:LCP,UL94V-0. Contact:C5210.Plated 50u" Ni Overall,Contact All Au 1u. Shell:SUS,Plated 50u" Ni Overall,PAD Au 1u. Uila: Ka helu o kēia manawa:0.5A AC/DC max. Ka helu Voltage: 30V AC/DC Kūʻai Kūʻē: 30mΩ Max. Kū'ē Insulation: 1000MΩ MinOperating Temperature: -45ºC ~ + 85ºC Part No. Description PCS/CTN GW(KG) CMB(m3) OrderQty...

Hoʻohui Kāleka Nano SIM, PUSH PUSH, 6Pin, H1.37mm, me CD Pin KLS1-SIM-066

ʻIke Huahana Nā Mea Hoʻohui Kāleka SIM Nano, PUSH PUSH,6Pin,H1.37mm,me CD Pin Material: Insulator:Kiʻekiʻe Temperature Thermoplastic,UL94V-0. Hoʻokaʻaʻike: Copper Alloy, Plated 50u "Ni Overall, PAD Au 1u". Shell:SUS.All Ni 30U/MIN. Uila: Ka helu o kēia manawa:0.5A ampers Voltage Rating:5V AC/DC Kū'ē Kū'ē:100mΩ Max. Kū'ē Kū'ē: 1000MΩ Min./500V DCOperating Temperature: -45ºC ~ + 85ºC Māhele No. wehewehe PCS / CTN G...

Hoʻohui Kāleka Nano SIM, PUSH PUSH, 6Pin, H1.25mm, me CD Pin KLS1-SIM-103

ʻIke huahana Nano SIM Kāleka Hoʻohui, PUSH PUSH, 6Pin, H1.25mm, me CD Pin Material: Hoʻokaʻaʻike: Copper Alloy.Au ma luna o Ni. Hale: LCP piha i ke aniani. Shell:Stainless.Au ma luna o Ni.GND Frame: Copper Alloy.Au ma luna o Ni. Hoʻololi ʻike: Copper Alloy.Au ma luna o Ni.Slide: Glass Filled Pa10t. Puna: ʻAʻole. Hook: ʻAʻole. Uila: Ua helu ʻia i kēia manawa:0.5A ʻO ka Voltage i koho ʻia: 30V AC Kūʻai Kūʻē: 100mΩ Max. Kū'ē Kū'ē: 1000MΩ Min./500VDC Dielectric Wi...

Hoʻohui Kāleka Nano SIM, ʻano pā, 6Pin, H1.55mm, me ka Pin CD KLS1-SIM-104

ʻIke Huahana Mea Hoʻohui Kāleka SIM Nano, ʻAno pā, 6Pin, H1.55mm, me CD Pin Uila: Ka helu o kēia manawa:1 Amp/Pin.MAX. Voltage: 30V DC.MAX Haʻahaʻa Kūʻai Kūʻai Kūʻē: 30mΩ Max.Initially. Dielectric Withstanding Voltage:500V AC MIN.No 1 minuke. Palekana Insulation: 100MΩ Min.500V DC .No 1 minuke. ʻO ka lōʻihi: 1500 Cycles. Ka Mahana Hana: -45ºC ~ + 85ºC Māhele No. Hōʻike PCS / CTN GW (KG) CMB (m3) OrderQty. Manawa A i ʻole...

Hoʻohui Kāleka Nano SIM, ʻano pā, 6Pin, H1.5mm, me ka Pin CD KLS1-SIM-102

ʻIke Huahana Mea Hoʻohui Kāleka SIM Nano, ʻAno pā, 6Pin, H1.5mm, me CD Pin Uila: Ka helu o kēia manawa:1 Amp/Pin.MAX. Voltage: 30V DC.MAX Haʻahaʻa Kūʻai Kūʻai Kūʻē: 30mΩ Max.Initially. Dielectric Withstanding Voltage:500V AC MIN.No 1 minuke. Palekana Insulation: 100MΩ Min.500V DC .No 1 minuke. ʻO ka lōʻihi: 1000 Cycles. Ka Mahana Hana: -45ºC ~ + 85ºC Māhele No. Hōʻike PCS / CTN GW (KG) CMB (m3) OrderQty. Ka Manawa...

Mea Hoʻohui Kāleka SIM Nano; ʻAno MID Mount Tray, 6Pin, H1.5mm, me CD Pin KLS1-SIM-100

ʻIke huahana Nano SIM Kāleka Hoʻohui; MID Mount Tray type,6Pin,H1.5mm,me CD Pin Material: Plastics:LCP,UL94V-0.Black. Hoʻokaʻaʻike:C5210 Shell:SUS304 Tray:LCP,UL94V-0.Black. Plating: Contact:Contact Area:G/F Plating;Soldertail Area:80u" Matte Tin Shell:Plating over 30u"NiSolderable 30u"Ni Plating over all.Contact and tail coplanarity to be 0.10mm all. Part No. Description PCS/CTN GW(KG) CMB(m3) OrderQty. Time

Hoʻohui Kāleka Nano SIM, 6Pin, H1.4mm, ʻAno Hined, me ka Pin CD KLS1-SIM-101

ʻIke Huahana Nā Mea Hoʻohui Kāleka SIM Nano,6Pin,H1.4mm,Hinged Type,me CD Pin Material: Hale: High Temperature Thermoplastic,UL94V-0.Black. Terminal: Copper Alloy, Plated Gold ma ka wahi pili a me nā huelo solder, Underplated Nickel ma luna o nā mea a pau. Shell:Stainless Steel, Kāwili ʻia i ke gula ma nā huelo solder, Underplated Nickel ma luna o nā mea a pau. Uila: Ua helu ʻia i kēia manawa:0.5A ʻO ka Voltage i koho ʻia: 30V AC Kūʻai Kūʻē: 100mΩ Max. Kū'ē Kū'ē: 1000MΩ Min./500V...

Hoʻohui Kāleka Nano SIM, 6Pin, H1.4mm, ʻAno Hined, me ka Pin CD KLS1-SIM-077A

ʻIke Huahana Nā Mea Hoʻohui Kāleka SIM Nano,6Pin,H1.4mm,Hinged Type,me CD Pin Material: Insulator: High Temperature Thermoplastic,UL94V-0. Hoʻokaʻaʻike:Copper Alloy,Plated 50u" Ni Overall Contact All Au 1U. Shell:SUS.All Ni 30U MIN. Uila: Ka helu o kēia manawa:0.5A AC/DC MAX. Voltage Rating:125V AC/DC Ambient Humidity Range:95% RH Max. Kū'ē Kū'ē: 80mΩ Max. Nā pōʻaiapili male: 5000 hoʻokomo ...

Hoʻohui Kāleka Nano SIM, 6Pin, H1.4mm, ʻAno Hined, me ka ʻole CD Pin KLS1-SIM-077

ʻIke Huahana Nā Mea Hoʻohui Kāleka SIM Nano, 6Pin, H1.4mm, ʻAno Hinged, me ka ʻole CD Pin Material: Insulator: Kiʻekiʻe Temperature Thermoplastic, UL94V-0. Contact:C5210,Plated 50u" Ni Overall Contact All Au 1U. Shell:SUS.All Ni 30U/MIN. Uila: Ka helu o kēia manawa:0.5A Voltage Rating:5V AC/DC Ambient Humidity Range:95% RH Max. Hoʻokaʻaʻike kū'ē:80mΩ Max. Insulation Maika 000 DC. Nā pōʻaiapuni: 10000 Hoʻokomo. Ka Mahana Hana: -45&...

Hoʻohui Kāleka Nano SIM, PUSH PULL, 6Pin, H1.4mm, me CD Pin KLS1-SIM-092

ʻIke Huahana Nā Mea Hoʻohui Kāleka SIM Nano, PUSH PULL,6Pin,H1.4mm,me CD Pin Material: Hale:Hi-Temperature Thermoplastic,UL94V-0.Black. Terminal: Copper Alloy, koho 1u" Au ma ka wahi pili. Shell:Stainless Steel.selective Gold Flash ma solder wahi. Uila: Rated keia manawa:0.5A Max Rated Voltage:30V AC Contact Resistance:100mΩ Max. Insulation Resistance:1000MΩ Min./500V DC AC/500V DC Dielectric Withstanding Voltage.

Mea hoʻohui Kāleka SIM Nano; PUSH PULL, 6Pin, H1.35mm KLS1-SIM-076

ʻIke Huahana Mea Hoʻohui Kāleka SIM Nano; PUSH PULL, 6Pin, H1.35mm Material: Insulator: Thermoplastic Kiʻekiʻe, UL94V-0. Contact:C5210.Plated 50u" Ni Overall,Contact All Au 1u. Shell:SUS,Plated 50u" Ni Overall,PAD Au 1u. Uila: Ka helu o kēia manawa:0.5A AC/DC max. Voltage Rating:125V AC/DC Hoʻokaʻaʻike Kūʻē:100mΩ Max. Kū'ē Insulation: 1000MΩ Min.500V DCOperating Temperature: -45ºC ~ + 85ºC Māhele No.

Hoʻohui Kāleka SIM Micro, 8Pin H1.5mm, ʻAno Hīkini KLS1-SIM-089

ʻIke Huahana Mea Hoʻohui Kāleka SIM Micro, 8Pin H1.5mm, ʻAno Hinged Mea Hale: Thermoplastic, UL94V-0. Terminal:Phosphor Bronze,T=0.15,NiPlated Under,Au Plated On ContactArea,G/F Plated on Soldertail. Shell:Stainless Steel,T=0.15,Ni PlatedUnder,G/F i hoʻopaʻa ʻia ma Soldertail. Kū'ē Pili Uila:60mΩ Max. Kū'ē Kū'ē: 1000MΩ Min. Dielectric Withstanding Voltage:500V AC No1 Minute. Ka lōʻihi:5000 Cycles.Operating Temperature: ...

Hoʻohui Kāleka SIM Micro, 6Pin H1.8mm, ʻAno Hinged KLS1-SIM-072

ʻIke Huahana Mea Hoʻohui Kāleka SIM Micro, 6Pin H1.8mm, ʻAno Hinged Mea: Hale: LCP, UL94V-0, ʻEleʻele. Terminal: Copper Alloy. Shell:Sila ʻole. Uila: Ka helu o kēia manawa: 1A Max. Ka helu Voltage: 30V DC max. Kū'ē Pili: 30mΩ Max. Kū'ē Kū'ē: 1000MΩ Min. Ka Voltage Dielectric: 500V rms / min. ʻO ka lōʻihi: 5000 Cycles. Ka Mahana Hana: -45ºC ~ + 85ºC Māhele No. Hōʻike PCS / CTN GW (KG) CMB (m3) OrderQty. ...

Hoʻohui Kāleka SIM Micro, 6Pin H1.5mm, ʻAno pā KLS1-SIM-075

ʻIke Huahana Mea Hoʻohui Kāleka SIM Micro,6Pin H1.5mm, ʻAno pā Mea: Insulator: Hi–Temperature Plastic, UL94V-0, ʻEleʻele. Terminal: Copper Alloy.Gold Flash Plating on allterminal,Aad 50u" min Nickel Underplated on allover. Shell:50u" Nickel Underplating on allover,Gold flash onsolder pad. Uila: Ka helu o kēia manawa:0.5A Voltage Rating Voltage:5.0 vrms Insulation Resistance:1000MΩ Min./500V DC Withstanding Voltage:250V ACrms No 1Minute ...

Hoʻohui Kāleka SIM Micro,6P, PUSH PULL, H1.5mm KLS1-SIM-099

ʻIke Huahana Mea Hoʻohui Kāleka SIM Micro,6P, PUSH PULL, H1.5mm Mea Hale: Thermoplastic, UL94V-0. Terminal: Copper Alloy, Gold Plated on ContactArea and Solder Tails, Nickel Plated Overall. Shell:Stainless Steel.Nickel Plated Overall.GoldPlated on solder huelo. Uila: Ka helu o kēia manawa: 1.0 A max. Kū'ē Pili: 30mΩ Max. Dielectric Me ka Voltage: 500V AC Kū'ē Kū'ē: 1000MΩ Min./500V DC Ke Ana Hana Hana: -45ºC~+8...
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