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Hoʻohui Kāleka SIM Micro,8P, PUSH PULL, H1.5mm KLS1-SIM-091

ʻIke Huahana Mea hoʻohui Kāleka SIM Micro,8P, PUSH PULL, H1.5mm Uila: Hoʻoholo ʻia i kēia manawa:1.0A Ka Voltage i koho ʻia:30V Kūʻai Kūʻē: 50mΩ Max. Kū'ē Insulation: 1000MΩ Min./500V DC Dielectric Withstanding Voltage: 500V AC Solder abiltiy: 250oC~%% P5oC,10%%P0.5s Ka lōʻihi: 5000 Cycles Min.Contact Resistance:50mΩ Max.Operating Temperature: TN45ºC ~ ʻAʻohe. GW(KG) CMB(m3) OrderQty. Manawa O...

Hoʻohui Kāleka SIM Micro,6P,H1.45mm KLS1-SIM-046

ʻIke Huahana Mea Hoʻohui Kāleka SIM Micro,6P,H1.45mm Material: Insulator:Hi-Temperature Plastic,UL94V-0.Black. Terminal: Copper Alloy,50u" min Nickel underplated onallover,gole plated allover. Shell:Stainless Steel,50u" Nickel underplated onallover,gole flash on solder latch. Uila: Ka helu o kēia manawa:0.5 A Voltage Rating:5.0 V Insulation Resistance:500MΩ Min./500V DC Withstanding Voltage:250V AC No 1 minuke. Kū'ē pili:100mΩ ...

Hoʻohui Kāleka Micro SIM, 6P

Hoʻohui Kāleka Micro SIM, 6P

Hoʻohui Kāleka Micro SIM, 8P

Hoʻohui Kāleka Micro SIM, 8P

Hoʻohui Kāleka Micro SIM, 8P

Hoʻohui Kāleka Micro SIM, 6P

Hoʻohui Kāleka SIM Micro; PUSH PUSH, 6P+1P A i ʻole 8P+1P,H1.50mm KLS1-SIM-090

Hoʻohui Kāleka SIM Micro; PUSH PUSH, 6P A i ʻole 6P+1P, H1.35mm KLS1-SIM-069

ʻIke Huahana Hoʻohui Kāleka SIM Micro; PUSH PUSH, 6P A i ʻole 6P+1P, H1.35mm, Me ka leka ʻole. Material: Insulator: High TemperatureThermoplastic, UL94V-0 Contact: Copper Alloy,Plated 50U" NiOverall Contact Au 1U Shell:SUS,Plated 50U" Ni Overall Plated 1u"Au Selective Contact Area Electrical: Current Rating: 0.5A Max. Voltage Rating: 5V. Kū'ē: 1000M Min./500VDC Ambient Humidity Range: 95% RH Ma...

Hoʻohui Kāleka SIM Micro 8P, PUSH PULL, H2.4mm KLS1-SIM-044-8P

ʻIke Huahana Mea Hoʻohui Kāleka Micro SIM 8P, PUSH PULL, H2.4mm Material: Base: Hi-Temp Thermoplastic, UL94V-0.Black. Hoʻokaʻaʻikeʻikepili: Copper Alloy, Gold Plated. Shell: Ke kila ʻole, i uhi ʻia i ke gula. Uila: Kū'ē Kū'ē: 50mΩ maʻamau, 100Ω Max. Kū'ē Kū'ē:> 1000MΩ / 500V DC. 3. Solderability Vapor pae:215ºC.30sec.Max. IR feflow:250ºC.5sec.Max. Kuʻi lima lima:370ºC.3sec.Max. Ka Mahana Hana: -45ºC~+105&o...

Hoʻohui Kāleka SIM Micro 6P, PUSH PULL, H2.4mm KLS1-SIM-044-6P

ʻIke Huahana Mea Hoʻohui Kāleka Micro SIM 6P, PUSH PULL, H2.4mm Material: Base: Hi-Temp Thermoplastic, UL94V-0.Black. Hoʻokaʻaʻikeʻikepili: Copper Alloy, Gold Plated. Shell: Ke kila ʻole, i uhi ʻia i ke gula. Uila: Kū'ē Kū'ē: 50mΩ maʻamau, 100Ω Max. Kū'ē Kū'ē:> 1000MΩ / 500V DC. 3. Solderability Vapor pae:215ºC.30sec.Max. IR feflow:250ºC.5sec.Max. Kuʻi lima lima:370ºC.3sec.Max. Ka Mahana Hana: -45ºC~+105&o...

Hoʻohui Kāleka SIM; PUSH PUSH, 6P+2P, H1.80mm, Me ka leka a me ka ʻole o ka leka. KLS1-SIM-110

ʻIke Huahana Hoʻohui Kāleka SIM; PUSH PUSH,6P+2P,H1.80mm Me ka pou a i ʻole me ka ʻole o ka post.Material:Housing Material: LCP UL94V-0Contact Material: Tin-BronzePackage: Tape and Reel PackageElectrical Characteristics:Voltage rating: 100V ACCurrent Rating: 0Vstand. AC/1MinuteInsulation kū'ē: ≥1000ΜΩContact pale: ≤30mΩLife:

Hoʻohui Kāleka SIM, PUSH PUSH, 8P+1P, H1.9mm, me ka Post KLS1-SIM-108

ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH, 8P + 1P, H1.9mm, me ka Post Material: Hale: Hi-Temp Plastic, UL94V-0.Rated. Hoʻopili: Copper Alloy. Huina: Copper Alloy. Palena: Wahi Hoʻopili: ʻAla gula. Solder wahi: 80u "Min, Matte tin alloy plated. Ma lalo o ka pā: 30u" min, Nickel. Shell: 30u" Min, Nickel plated overallSolder wahi: Gole flash. Uila: Ka helu o kēia manawa: 0.5A. Me ka Voltage Kū'ē: AC500V rms Kū'ē Kū'ē: 1000MΩMin, Ma DC 500V ...

Hoʻohui Kāleka SIM, PUSH PUSH,6P+1P,H1.9mm,me Post KLS1-SIM-107

ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH, 6P + 1P, H1.9mm, me ka Post Material: Hale: Hi-Temp Plastic, UL94V-0.Rated. Hoʻopili: Copper Alloy. Shell: Copper Alloy/Sila. Palena: Wahi Hoʻopili: ʻAla gula. Solder wahi: 80u "Min, Matte tin alloy plated. Ma lalo o ka pā: 30u" min, Nickel. Shell: 30u" Min, Nickel plated holoʻokoʻa Solder wahi: Gole flash. Uila: kēia manawa helu: 0.5A. Withstanding Voltage: AC500V rms Insulation Resistance:1000MΩMin, At...

Hoʻohui Kāleka SIM; PUSH PUSH,6P,H1.85mm KLS1-SIM-106

ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH, 6P, H1.85mm, me ka Hale Paʻi: Hi-Temp Plastic, UL94V-0. Rated. Hoʻopili: Copper Alloy. Puhi:SUS. Hoʻopau: Ua uhi ʻia ke gula ma ka wahi conatct, ua uhi ʻia ka tin ma nā huelo solder. Māhele No. Hōʻike PCS/CTN GW(KG) CMB(m3) OrderQty. Kauoha Manawa

Hoʻohui Kāleka SIM, PUSH PUSH, 6P, H1.85mm, me ka ʻole o ka Post KLS1-SIM-087

ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH, 6P, H1.85mm, me ka ʻole o ka Post Material: Insulator: H-Temperature Plastic, UL94V-0.Black. Hoʻokaʻaʻike: Copper Alloy,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u" min Nickel Underplated on Allover,Gold Plating on Contact Arer,80u"min Tin on Solder Tail. Shell:50u" Nickel Underplated on Allover,Gold Flash on Solder Latch. Uila: Loaʻa i kēia manawa:0.5A. Voltage Rating:5.0 Vrms. Hoʻopaʻa i ka Insulation ...

Hoʻohui Kāleka SIM, PUSH PUSH, 6P+2P, H1.85mm, me ka Post KLS1-SIM-086

ʻIke Huahana Mea Hoʻohui Kāleka SIM, PUSH PUSH, 6P+2P, H1.85mm, me ka ʻole o ka Post Material: Insulator: H-Temperature Plastic, UL94V-0.Black. Hoʻokaʻaʻike: Copper Alloy, T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u" min Nickel Underplated on Allover,GoldPlating on Contact Arer,80u" min Tin on Solder Tail. Shell:50u" Nickel Underplated on Allover,Gold Flash onSolder Latch. Uila: Ka helu o kēia manawa:0.5A. Voltage Rating:5.0 Vrms. Insulation Resis...

Hoʻohui Kāleka SIM, PUSH PUSH, 8P+2P, H1.85mm, me ka ʻole o ka Post KLS1-SIM-085A

ʻIke Huahana Mea Hoʻohui Kāleka SIM, PUSH PUSH, 8P+2P, H1.85mm, me ka ʻole o ka Post Material: Insulator:H-TemperaturePlastic,UL94V-0.Black. Hoʻokaʻaʻike: Copper Alloy,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u" min Nickel Underplated onAllover,Gold Plating on Contact Arer,80u" minTin on Solder Tail. Shell: 50u" Nickel Underplated on Allover,GoldFlash on Solder Latch. Uila: I kēia manawa helu:0.5A. Voltage Rating:5.0 Vrms. Insulation Resist...

Hoʻohui Kāleka SIM, PUSH PUSH, 8P+2P, H1.85mm, me ka ʻole o ka Post KLS1-SIM-085

ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH, 8P+2P, H1.85mm, me ka ʻole o ka Post Material: Insulator: H-Temperature Plastic, UL94V-0.Black. Hoʻokaʻaʻike: Copper Alloy,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u" min Nickel Underplated onAllover,Gold Plating on Contact Arer,80u"min Tin on Solder Tail. Shell:50u" Nickel Underplated on Allover,GoldFlash on Solder Latch. Uila: I kēia manawa helu:0.5A. Voltage Rating:5.0 Vrms. Insulation Resi...

Hoʻohui Kāleka SIM, PUSH PUSH, 6P+2P, H1.85mm, me ka ʻole o ka Post KLS1-SIM-084

ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH, 6P+2P, H1.85mm, me ka ʻole o ka Post Material: Housing:LCP,UL94V-0 Contact:C5210R-H,T=0.15 Shell:SUS304,T=0.20 Mylar:Polyester.Operating Temperature: -45ºCold Finish~+85ºC Flashed Area. Ma SolderTails,Me ka Hoʻopili a pau i hoʻopaʻa ʻia ma lalo o 50u" min Nickel. Shell:50u" min Nickel Underplated Overall, Kau ʻia ke kukui gula ma luna o nā huelo kūʻai. Mahele No. wehewehe PC...

Hoʻohui Kāleka SIM, PUSH PUSH, 8P+1P, H1.85mm, me ka ʻole o ka Post KLS1-SIM-074B

ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH, 8P+1P, H1.85mm, me ka ʻole o ka Post Material: Hale: High Temperature Thermoplastic, UL94V-0.Black. Hoʻopili: Copper Alloy. Ka uhi: Hoʻokaʻaʻike: Copper Alloys Or Steel. Papapalapala: Underplate:Nikela. Wahi Hoʻopili:Gold Over Nickel. Māhele Kūʻai: Tin Over Nickel. Shell:G/F Papa Ma luna o Nickel Ma Solder Huelo Uila: Loaʻa kēia manawa:0.5A. Ka helu Voltage: 5.0 Vrms. Kū'ē Kū'ē: 500M Min.At DC 500V DC Me ka Voltage: 250V A...

Hoʻohui Kāleka SIM, PUSH PUSH, 8P+1P, H1.85mm, me ka ʻole o ka Post KLS1-SIM-074A

ʻIke Huahana Mea Hoʻohui Kāleka SIM, PUSH PUSH, 8P+1P, H1.85mm, me ka ʻole o ka Post Material: Insulator:H-TemperaturePlastic,UL94V-0.Black. Hoʻokaʻaʻike: Copper Alloy,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u" min Nickel Underplated onAllover,Gold Plating on Contact Arer,80u" minTin on Solder Tail. Shell:50u" Nickel Underplated on Allover,GoldFlash on Solder Latch. Uila: I kēia manawa helu:0.5A. Voltage Rating:5.0 Vrms. Insulation Resistanc...

Hoʻohui Kāleka SIM, PUSH PUSH, 6P, H1.85mm, me ka Post a me waho o ka Post KLS1-SIM-073A

ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH, 6P, H1.85mm, me ka Post a me waho o ka Post Electrical: Ka helu o kēia manawa: 0.5A. Ka helu Voltage: 5.0 Vrms. Palekana Insulation: 500M Min.At DC 500V DC Withstanding Voltage:250V ACrms No 1 Minute. Kū'ē Kū'ē: 100M Max.At 10MA / 20mVMAX. Hana Hana: -45ºC~+85ºCMatingCycles:5000 Hoʻokomo. Mea Hana: Insulator:H-Temperature Plastic,UL94V-0.Black. Hoʻokaʻaʻike: Copper Alloy, T=0.15mm Shell:Stainless Steel,T=0.15...
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