Hoʻohui Kāleka SIM, PUSH PUSH, 8P+2P, H1.85mm, me ka ʻole o ka Post KLS1-SIM-085A
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| Hoʻohui Kāleka SIM, PUSH PUSH, 8P+2P, H1.85mm, me ka ʻole o ka Post Material: Insulator:H-Ka welaPalaki, UL94V-0. ʻEleʻele. Hoʻopili: Copper Alloy, T=0.15mm ʻO ka pūpū: ʻOi ʻole, T=0.15mm Finnish: Terminal: 50u" min Nickel Underplated onʻO Allover, Kāleka gula ma ka Contact Arer, 80u" minPin ma ka huelo Solder. Shell:50u" Nickel Underplated on Allover,GoldFlash ma ka Solder Latch. Uila: Ka helu o kēia manawa: 0.5A. Ka helu Voltage: 5.0 Vrms. Kū'ē Kū'ē: 500M Min.At DC 500V DC Me ka Voltage: 250V ACrms No 1 Minute. Kū'ē Kū'ē: 100M Max.At 10MA/20mVMAX. Nā pōʻai male:5000 hoʻokomo. Ka Mahana Hana: -45ºC~+85ºC |
| Mahele No. | wehewehe | PCS/CTN | GW(KG) | CMB(m3) | OrderQty. | Manawa | Kauoha |
