2.54mm Pitch Edge Kāleka Mea Hoʻohui Kau PCB Dip 90 180 Type KLS1-603C
ʻIke Huahana 2.54mm Pitch Edge Card Connector Slot PCB Dip 90 180 Type Order InformationKLS1-603C-XX-RXX-No.of 10-100pinS-Straight pin R-Right Angle Pin Material:Housing: Glass filled PBT UL94V-0Contacts: Brass and Bronze Phosphor Contacts Nā hiʻohiʻona: Ka helu o kēia manawa: 2 AMPInsulator Resistance: 1000M Ohm min. ma DC 500V DCContact Kū'ē: 30m Ohm max. ma DC 100mAWiths kūmau Volt...
1.27mm Pitch Hui Kāleka PCI 120 Pin DIP 180 KLS1-503C
ʻIke Huahana 1.27mmPitchPCI Kāleka Hoʻohui 120 Pin DIP 180 ʻIkepili KauohaKLS1-503C-120-S-W120-No.o 120pinS-Piki pololei W-White G-Green B-ʻEleʻele MATERIAL INSULATOR: GLASS-REINFORCED THERMOPLASTICED. HOOLAHA: ALLOY COPPER. PLATING: MATING AREA-GOLD FLASH GOLD OVER NICKEL.SOLDER AREA-TIN/LEAD OVER NICKEL. KA PALAPALA UILA: 250 VAC RMS. KA LĀKAI KĀWAI: 1 AMP. DIELECTRIC WITHSTANDING VILTAGE: 500 VAC RMA 60Hz NO 1 MINUTE. INSULATION...
1.27mm Pitch Hui Kāleka PCI 120 Pin DIP 180 KLS1-503B
ʻIke Huahana 1.27mmPitchPCI Kāleka Hoʻohui 120 Pin DIP 180 ʻIkepili KauohaKLS1-503B-120-S-W120-No.o 120pinS-Piki pololei W-Keʻokeʻo G-Green B-ʻEleʻele MATERIAL INSULATOR: GLASS-REINFORCED THERMOPLASTICED. HOOLAHA: ALLOY COPPER. PLATING: MATING AREA-GOLD FLASH GOLD OVER NICKEL.SOLDER AREA-TIN/LEAD OVER NICKEL. KA PALAPALA UILA: 250 VAC RMS. KA LĀKAI KĀWAI: 1 AMP. DIELECTRIC WITHSTANDING VILTAGE: 500 VAC RMA 60Hz NO 1 MINUTE. INSULATIO...
1.27mm Pitch Edge Kāleka Hoʻohui Kau PCB Dip 90 180 SMT Type KLS1-503
ʻIke Huahana 1.27mmPitch Edge Card Connector Slot PCB Dip 90 180 SMT Type Order InformationKLS1-503-XX-S-BXX-No.of 04-68pinS-Straight pin R-Right Angle Pin T1-SMT PinW-White G-Green B-ʻeleʻele O-PA mea hoʻopiha:PBT. UL94V-0Contacts: BrassPlating: Hoʻokaʻaʻike i ke gula a me ka Dip Tin ma luna o NickelElectrical Characteristics:Ka helu o kēia manawa: 1 AMP Voltage Rating:250 VACIinsulator Resistance: 1000M Ohm min. ma ka DC 500V DCContact Resistan...
1.0mm Pitch PCIE Kāleka Hoʻohui 164P KLS1-PCIE05C
ʻIkepili Huahana 1.0mmPitchPCIE kāleka Connector164P ʻIkepili KauohaKLS1-PCIE05C-164-B-G1U-R164-No.of 164pinsB-ʻeleʻele Y-Yellow L-Blue W-WhitePlating:1u"Gold ~30u"GoldG1U=Gold 1u"GTray Mea Pahu E-Pahu: Hale:PBT/PA66,UL94V-0 Hoʻokaʻaʻike: Pale keleawe: Kau gula ma luna o Nickel. Mechanical Insertion Forge: 1.15N Max Per Contact Pair Withdrawal Force: 0.15N Min no kēlā me kēia hui pilina Hoʻopaʻa Paʻa Manaʻo: 4.9N Min...
1.0mm Pitch PCIE Kāleka Hoʻohui 164P KLS1-PCIE05B
ʻIkepili Huahana 1.0mmPitchPCIE Kāleka Mea Hoʻohui 164P ʻIkepili KauohaKLS1-PCIE05B-164-B-G1U-R164-No.o 164pinsB-ʻeleʻele Y-Yellow L-Blue W-WhitePlating:1u"Gold ~30u"GoldG1U=Gold 1u="AGT-Gold 1u"A Mea Pahu E-Pahu: Hale:PBT/PA66,UL94V-0 Hoʻokaʻaʻike: Pale keleawe: Kau gula ma luna o Nickel. Mechanical Insertion Forge: 1.15N Max Per Contact Pair Withdrawal Force: 0.15N Min per contact pair Contact Retention Force: 4.9N M...
1.0mm Pitch PCIE Kāleka Hoʻohui 164P KLS1-PCIE05A
ʻIke Huahana 1.0mmPitchPCIE Kāleka Hoʻohui 164P ʻIkepili KauohaKLS1-PCIE05A-164-B-G1U-R164-No.of 164pinsB-ʻEleʻele Y-Yellow L-Blue W-WhitePlating:1u"Gold ~30u"GoldG1U=Gold 1u="AGT-Gold 1u"A Mea Pahu E-Pahu: Hale:PBT/PA66,UL94V-0 Hoʻokaʻaʻike: Pale keleawe: Kau gula ma luna o Nickel. Mechanical Insertion Forge: 1.15N Max Per Contact Pair Withdrawal Force: 0.15N Min per contact pair Contact Retention Force: 4.9N Mi...
1.0mm Pitch PCIE kāleka Mea hoʻohui pū pcb dip 90 KLS1-PCIE04
ʻIke Huahana 1.0mmPitchPCIE kāleka Mea hoʻohui slot pcb dip 9036P 64P 98P 164P 280P ʻIke KauohaKLS1-PCIE04-XX-B-G1U-AXX-No.o 36-280PpinsB-ʻeleʻele G-Green O-WhiteuPlatu G-Green O-Alani L-Blue W-3" GoldG1U=Gold 1u" G30U=Gold 30u"A-Tube C-Tray E-Box Material: Hale:PBT/PA66,UL94V-0 Contact: Brass Plating: Gold Plating Over Nickel. Hoʻokomo Mechanical Forge: 1.15N Max no kēlā me kēia hui ʻana i ka hoʻokuʻu ʻana i ka ikaika: 0.15...
1.0mm Pitch PCIE Kāleka Hoʻohui SMT Type KLS1-PCIE03A
ʻIkepili Huahana 1.0mmPitchPCIE Kāleka Mea hoʻohui SMT Type 36P 64P 98P 164P ʻIke KauohaKLS1-PCIE03A-XX-B-G1U-AXX-No.o 36-164pinsB-ʻeleʻele G-Green O-Alani L-Blue W-WhitePlating ~1u"=1u"Gold:1u"=1u" G30U=Gold 30u"A-Tube R-Reel Material: Housing:PA6T/LCP,UL94V-0 Contact: Brass Plating: Gold Plating Over Nickel. Mechanical Insertion Forge: 1.15N Max no kēlā me kēia Hoʻokaʻaʻike Pair Withdrawal Force: 0.15N Min no ka hoʻopili...
1.0mm Pitch PCIE Kāleka Hoʻohui Māhele ʻAno KLS1-PCIE02C
ʻIkepili Huahana 1.0mmPitchPCIE Kāleka Hoʻohui Kāleka Splint Type 36P 64P 98P 164P Order InformationKLS1-PCIE02C-XX-B-G1U-AXX-No.of 36-164pinsB-ʻeleʻele G-Green O-Alani L-Blue W-WhiteGolding ~3u"=1u"=1u" G30U=Gold 30u"A-Tube C-Tray E-Box Material: Housing:PBT/PA66,UL94V-0 Contact: Brass Plating: Gold Plating Over Nickel. Mechanical Insertion Forge: 1.15N Max Per Contact Pair Withdrawal Force: 0.15N ...
1.0mm Pitch PCIE Kāleka Hoʻohui Māhele ʻAno KLS1-PCIE02B
ʻIke Huahana 1.0mmPitchPCIE Kāleka Hoʻohui Kāleka Splint Type 36P 64P 98P 164P Order InformationKLS1-PCIE02B-XX-B-G1U-AXX-No.of 36-164pinsB-ʻeleʻele G-Green O-Alani L-Blue W-WhiteGolding ~3u"=1u"=1u" G30U=Gold 30u"A-Tube C-Tray E-Box Material: Housing:PBT/PA66,UL94V-0 Contact: Brass Plating: Gold Plating Over Nickel. Mechanical Insertion Forge: 1.15N Max no kēlā me kēia Hoʻopili Pair Withdrawal Force: 0.15N Min per cont...
1.0mm Pitch PCIE Kāleka Hoʻohui Māhele ʻAno KLS1-PCIE02A
ʻIkepili Huahana 1.0mmPitchPCIE Kāleka Hoʻohui Kāleka Splint Type 36P 64P 98P 164P Order InformationKLS1-PCIE02A-XX-B-G1U-AXX-No.of 36-164pinsB-ʻEleʻele G-Green O-Alani L-Blue W-WhiteGolding ~3u"=1u"=1u" G30U=Gold 30u"A-Tube C-Tray E-Box Material: Housing:PBT/PA66,UL94V-0 Contact: Brass Plating: Gold Plating Over Nickel. Mechanical Insertion Forge: 1.15N Max no kēlā me kēia Hoʻokaʻaʻike Pair Withdrawal Force: 0.15N Min no ka hoʻopili...
1.0mm Pitch PCIE kāleka Mea hoʻohui pū pcb dip 180 KLS1-PCIE01
ʻIke Huahana 1.0mmPitchPCIE kāleka Mea hoʻohui slot pcb dip 18026P 36P 64P 98P 164P ʻIke KauohaKLS1-PCIE01-XX-B-G1U-AXX-No.o 26-164pinsB-ʻeleʻele G-Green O-Alani L-Blue W-WhiuGold":WhiuGold":30WhiuGold GoldG1U=Gold 1u" G30U=Gold 30u"A-Tube C-Tray E-Box Material: Hale:PBT/PA66,UL94V-0 Contact: Brass Plating: Gold Plating Over Nickel. Hoʻokomo Mechanical Forge: 1.15N Max no kēlā me kēia Hoʻopili Pair Withdrawal Force: 0.1...
0.8mm Pitch Mini PCIE Mea Hoʻohui SMT 52P, Kiʻekiʻe 2.0mm 3.0mm 4.0mm 5.2mm 5.6mm 6.8mm 7.0mm 8.0mm 9.0mm 9.9mm KLS1-PCI06E-52P
ʻIke Huahana 0.8mm Pitch Mini PCI-E Mea hoʻohui SMT 52P,Kiʻekiʻe 2.0mm 3.0mm 4.0mm 5.2mm 5.6mm 6.8mm 7.0mm 8.0mm 9.0mm 9.9mm ʻIke KauohaKLS1-PCI06E-52P-H4.0=H3.0-H2. H3.0=3.0mm H4.0=4.00mm H5.2=5.20mmH5.6=5.60mmH6.8=6.80mmH7.0=7.00mm H8.0=8.00mmH9.0=9.00mm H9.9=9.90mm Plating:1u"Gold 10u" G3U=Gold 3u"G30U=Gold30u" Mea hale hale: Thermoplastic, Temp kiʻekiʻe, UL9...
0.50mm Pitch M.2 NGFF Card Connector 67P, Kiʻekiʻe 1.2mm 1.5mm 1.8mm 3.1mm 4.0mm 5.8mm 6.4mm KLS1-NGFF01
ʻIke Huahana 0.50mm Pitch M.2 NGFF Kāleka Mea Hoʻohui 67P ʻIkepili KauohaKLS1-NGFF01-3.2-67-B-G0 Kiʻekiʻe:1.2mm 1.5mm 1.8mm 3.2mm 4.0mm 5.8mm 6.4mmGʻula: ʻEleʻele Plating:1u"~30u"Gold Gold 3u "G30U-Gold30u" 0.5mm pitch me 67 kūlana Hoʻolālā ʻia no nā modula hoʻokahi a ʻelua ʻaoʻao Loaʻa i nā koho kī like ʻole no nā kāleka module Kākoʻo iā PCI Express 3.0, USB 3.0, a me SATA 3.0 Koho i ke kiʻekiʻe, kūlana, de...
ʻO ka mea hoʻohui kāleka Micro SD e huki huki, H1.5mm, me ka pine CD KLS1-TF-019
ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD e huki huki, H1.5mm, me ka pine CD Material: Hale: Thermoplastic Kiʻekiʻe, UL94V-0, ʻEleʻele. Hoʻokaʻaʻike: Copper Alloy T=0.15.Plated Gold Flash on Contact Area. Shell:Stainless Steel T=0.20.Plated Gold Flash on Solder huelo. Uila: Kuhi ʻia i kēia manawa:0.5A Ka Voltage i koho ʻia: 30V Kūʻai Kūʻai: 50mΩ Max. Kū'ē Kū'ē: 100MΩ Min./100V DC Dielectric Me ka Voltage: 100V AC Paʻa: 5000 Cycles. Oper...
Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.29mm, me ka pine CD KLS1-TF-018
ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD pana pana,H1.29mm, me ka pine CD Material: Insulator:LCP,UL94V-0,Black. Paheʻe:LCP,UL94V-0,ʻEleʻele. Latch: Bronze Phosphor. Hoʻopili: Phosphor Bronze. Shell:SUS304 Puna:Stainless Steel. Crank-axle: Ke kila ʻole. Uila: Voltage:100V AC I kēia manawa:0.5A Max. Kū'ē Pili: 40mΩ Max. Hōʻoiaʻiʻo Voltage:: 500V AC Kū'ē Kū'ē: 1000MΩ Min. Kāleka Hoʻokomo/Hoʻihoʻi Manaʻo:10N Max. Hoʻoikaika i ka ikaika: 10N Durabi...
Hoʻohui kāleka Micro SD HINGED TYPE, H1.9mm KLS1-TF-017
ʻIke Huahana Hoʻohui kāleka Micro SD HINGED TYPE,H1.9mm Material: Insulator: High Temperature Thermoplastic Flammability Raring,UL94V-0,Black. Hoʻokaʻaʻike:Copper Alloys uhi:Stainless Steel Contact Area Plating:Gold voer Ni Solder Tail Coplanarity Pono i loko o 0.10MAX. Māhele No. Hōʻike PCS/CTN GW(KG) CMB(m3) OrderQty. Kauoha Manawa
Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.4mm, me ka pine CD KLS1-TF-016
Product Information Micro SD card connector push push,H1.4mm,me CD pin Notes: 1.Coplanarity spec.for all solder tall and solder pad is 0.10mm 2.Electric features: 2-1.Current Rating:0.5 Amp.max. 2-2.Voltage:100V DC max. 2-3.Low pae conatct kū'ē:100mΩ Max. 2-4.Dielectric Withstanding Voltage:AC500V rms. 2-5. Kū'ē Kū'ē: 1000MΩ Min. (Hoʻopau) 100MΩ Min. 3. Mechanical hiʻona: 3-1. Durability:5000 Cycles. 3-2.Operatin...
ʻO ka mea hoʻohui kāleka Micro SD e huki huki, H1.42mm, me ka pine CD KLS1-TF-015
ʻIke Huahana Mea hoʻohui kāleka Micro SD pahu huki huki, H1.42mm, me ka pine CD Material: Metala ʻiʻo: ʻAi ʻole, Nickel holoʻokoʻa 50u" Hale: Liouid crystal polymer, UL94V-0
ʻAʻohe mea hoʻohui kāleka Micro SD, H1.8mm KLS1-TF-014
ʻIke Huahana Mea hoʻohui kāleka Micro SD ʻaʻohe pana, H1.8mm Material: Hale:LCP,UL94V-0, ʻEleʻele. Terminal: Copper Alloy, Gold Selective on Mating Area. Shell:Iron Electrical: Voltage Rating:5V I kēia manawa:0.5 A Max. Kū'ē Pili: 100mΩ Max. Kū'ē Kū'ē: 1000MΩ Min. Me ka Voltage: 500V 1 Minute. Ka lōʻihi: 10000 Cycles. Māhele No. Hōʻike PCS/CTN GW(KG) CMB(m3) OrderQty. Kauoha Manawa
Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.4mm, me ka pine CD KLS1-TF-012
ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD pana i ka pana,H1.4mm, me ka pine CD Material: Insulator: Thermoplastic High Temperature, UL94V-0. Terminal: Copper Alloy, Plated 50u "Ni Overall. Plated Au Selective Contact Area Plated 100u" Sn Over Ni On Solder Area. Shell:Plated 50u" Ni Ka holoʻokoʻa. Plated Au Selective Contact Area Electrical: ʻO kēia manawa: 0.5 A AC/DC max. Voltage Rating:125V AC/DC Ambient Humidity Range:95% RH Max. Hoʻokaʻaʻike kū'ē:100m&Om...
Kāleka SD Micro CONN; ANO HINGED, H1.5mm & H1.8mm KLS1-TF-007
ʻIke huahana Micro SD Card CONN;HINGED TYPE,H1.5mm & H1.8mm Material: Insulator:Hi-Temperature Plastic,UL94V-0.Black. Terminal: Copper Alloy.AU Plating on all terminal contact area, and tin plating on solder huelo wahi. Shell:Sila ʻole. Uila: Ka helu o kēia manawa:0.5 A Voltage Rating:5.0 vrms Insulation Resistance:1000MΩ Min./500V DC Withstanding Voltage:250V AC No 1 minuke. Kū'ē Hoʻopili:100mΩ Max.AT 10mA/20mV Max Hana Hana ...
Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD ma waena, H1.0mm, hoʻopaʻa me ka pine CD KLS1-TF-003E
ʻIke huahana Mid Mount Micro SD card connector push push,H1.0mm,luu me ka CD pin Material: Hale: Kiʻekiʻe Temperature Thermoplastic,UL94V-0- English
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