Hoʻohui Kāleka SIM, PUSH PUSH, 6P+2P, H2.25mm, me ka Post KLS1-SIM-030A
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Hoʻohui Kāleka SIM, PUSH PUSH, 6P+2P, H2.25mm, me ka ʻole o ka Post
Material:
Hale:Hi-Temp Plastic,UL94V-0.Rated.
Hoʻopili: Copper Alloy.
ʻImi: ʻAiʻa ʻole.SUS 301,T=0.20mm.
Pāpala:
Wahi pili: G/F i uhi ʻia ma luna o 30u” Nickel
Solder wahi: 80u "Tina Plated ma luna o 30u" Nickel.Under pā:30u "Min Nickel.
Shell:30u” Min, Nickel Plated Over All, Solder Area: Gold Flash.
Uila:
Ka helu o kēia manawa: 0.5 A
Dielectric Withstanding Voltage:250V AC/DC.
Kū'ē Kū'ē: 500MΩ Min.
Kū'ē Pili: 100mΩ Max.
Nā pōʻai male:5000 hoʻokomo.
Ka Mahana Hana: -45ºC~+85ºC
