Hoʻohui Kāleka SIM, PUSH PUSH, 8P+2P, H1.85mm, me ka ʻole o ka Post KLS1-SIM-085

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Hoʻohui Kāleka SIM, PUSH PUSH, 8P+2P, H1.85mm, me ka ʻole o ka Post

Material:

Insulator:H-Ka wela

Palaki, UL94V-0. ʻEleʻele.

Hoʻopili: Copper Alloy, T=0.15mm

ʻO ka pūpū: ʻOi ʻole, T=0.15mm

Finnish:

Terminal: 50u" min Nickel Underplated on Allover, Kāleka gula ma ka Contact Arer, 80u" min

Pin ma ka huelo Solder.

Shell:50u” Nickel Underplated on Allover,Gold Flash on Solder Latch.

Uila:

Ka helu o kēia manawa: 0.5A.

Ka helu Voltage: 5.0 Vrms.

Kū'ē Kū'ē: 500M Min.At DC 500V DC

Me ka Voltage: 250V ACrms No 1 Minute.

Kū'ē Kū'ē: 100M Max.At 10MA/20mV MAX.

Nā pōʻai male:5000 hoʻokomo.
Ka Mahana Hana: -45ºC~+85ºC

Mua: Hoʻohui Kāleka SIM, PUSH PUSH, 6P+2P, H1.85mm, me ka ʻole o ka Post KLS1-SIM-084

Aʻe: Hoʻohui Kāleka SIM, PUSH PUSH, 8P+2P, H1.85mm, me ka ʻole o ka Post KLS1-SIM-085A