Nā Kiʻi Huahana
ʻIke Huahana
Hoʻohui Kāleka SIM, PUSH PUSH, 8P+2P, H1.85mm, me ka ʻole o ka Post
Material:
Insulator:H-Pila Pīkini, UL94V-0. ʻEleʻele.
Hoʻopili: Copper Alloy, T=0.15mm
ʻOhi: ʻAi ʻole, T=0.15mm
Finnish:
Terminal: 50u” min Nickel Underplated on Allover,Gold Plating on Contact Arer,80u”min Tin on Solder Tail.
Shell: 50u” Nickel Underplated ma Allover, ʻO ke kukui gula ma ka Solder Latch.
Uila:
Ka helu o kēia manawa: 0.5A.
Ka helu Voltage: 5.0 Vrms.
Kū'ē Kū'ē: 500M Min.At DC 500V DC
Me ka Voltage: 250V ACrms No 1 Minute.
Kū'ē Kū'ē: 100M Max.At 10MA/20mV MAX.
Nā pōʻaiapili male:5000 hoʻokomo.
Ka Mahana Hana: -45ºC~+85ºC
Mua: 115x90x55mm Paʻa wai ʻole KLS24-PWP101T Aʻe: Hoʻohui Kāleka SIM, PUSH PUSH, 8P+2P, H1.85mm, me ka ʻole o ka Post KLS1-SIM-085