Nā mea hoʻopili kāleka SIM a me nā mea hoʻohui kāleka Micro SIM a me nā mea hoʻohui kāleka SIM Nano

Hoʻohui Kāleka Micro SIM, 8P

Hoʻohui Kāleka Micro SIM, 8P

Hoʻohui Kāleka Micro SIM, 6P

Hoʻohui Kāleka SIM Micro; PUSH PUSH, 6P+1P A i ʻole 8P+1P,H1.50mm KLS1-SIM-090

Hoʻohui Kāleka SIM Micro; PUSH PUSH, 6P A i ʻole 6P+1P, H1.35mm KLS1-SIM-069

ʻIke Huahana Hoʻohui Kāleka SIM Micro; PUSH PUSH, 6P A i ʻole 6P+1P, H1.35mm, Me ka leka ʻole. Material: Insulator: High TemperatureThermoplastic, UL94V-0 Contact: Copper Alloy,Plated 50U" NiOverall Contact Au 1U Shell:SUS,Plated 50U" Ni Overall Plated 1u"Au Selective Contact Area Electrical: Current Rating: 0.5A Max. Voltage Rating: 5V. Kū'ē: 1000M Min./500VDC Ambient Humidity Range: 95% RH Ma...

Hoʻohui Kāleka SIM Micro 8P, PUSH PULL, H2.4mm KLS1-SIM-044-8P

ʻIke Huahana Mea Hoʻohui Kāleka Micro SIM 8P, PUSH PULL, H2.4mm Material: Base: Hi-Temp Thermoplastic, UL94V-0.Black. Hoʻokaʻaʻikeʻikepili: Copper Alloy, Gold Plated. Shell: Ke kila ʻole, i uhi ʻia i ke gula. Uila: Kū'ē Kū'ē: 50mΩ maʻamau, 100Ω Max. Kū'ē Kū'ē:> 1000MΩ / 500V DC. 3. Solderability Vapor pae:215ºC.30sec.Max. IR feflow:250ºC.5sec.Max. Kuʻi lima lima:370ºC.3sec.Max. Ka Mahana Hana: -45ºC~+105&o...

Hoʻohui Kāleka SIM Micro 6P, PUSH PULL, H2.4mm KLS1-SIM-044-6P

ʻIke Huahana Mea Hoʻohui Kāleka Micro SIM 6P, PUSH PULL, H2.4mm Material: Base: Hi-Temp Thermoplastic, UL94V-0.Black. Hoʻokaʻaʻikeʻikepili: Copper Alloy, Gold Plated. Shell: Ke kila ʻole, i uhi ʻia i ke gula. Uila: Kū'ē Kū'ē: 50mΩ maʻamau, 100Ω Max. Kū'ē Kū'ē:> 1000MΩ / 500V DC. 3. Solderability Vapor pae:215ºC.30sec.Max. IR feflow:250ºC.5sec.Max. Kuʻi lima lima:370ºC.3sec.Max. Ka Mahana Hana: -45ºC~+105&o...

Hoʻohui Kāleka SIM; PUSH PUSH, 6P+2P, H1.80mm, Me ka leka a me ka ʻole o ka leka. KLS1-SIM-110

ʻIke Huahana Hoʻohui Kāleka SIM; PUSH PUSH,6P+2P,H1.80mm Me ka pou a i ʻole me ka ʻole o ka post.Material:Housing Material: LCP UL94V-0Contact Material: Tin-BronzePackage: Tape and Reel PackageElectrical Characteristics:Voltage rating: 100V ACCurrent Rating: 0Vstand. AC/1MinuteInsulation kū'ē: ≥1000ΜΩContact pale: ≤30mΩLife:

Hoʻohui Kāleka SIM, PUSH PUSH, 8P+1P, H1.9mm, me ka Post KLS1-SIM-108

ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH, 8P + 1P, H1.9mm, me ka Post Material: Hale: Hi-Temp Plastic, UL94V-0.Rated. Hoʻopili: Copper Alloy. Huina: Copper Alloy. Plating: Wahi Hoʻopili: ʻAla gula. Solder wahi: 80u "Min, Matte tin alloy plated. Ma lalo o ka pā: 30u" min, Nickel. Shell: 30u" Min, Nickel plated overallSolder wahi: Gole flash. Uila: Ka helu o kēia manawa: 0.5A. Me ka Voltage Kū'ē: AC500V rms Kū'ē Kū'ē: 1000MΩMin, Ma DC 500V ...

Hoʻohui Kāleka SIM, PUSH PUSH,6P+1P,H1.9mm,me Post KLS1-SIM-107

ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH, 6P + 1P, H1.9mm, me ka Post Material: Hale: Hi-Temp Plastic, UL94V-0.Rated. Hoʻopili: Copper Alloy. Shell: Copper Alloy/Sila. Plating: Wahi Hoʻopili: ʻAla gula. Solder wahi: 80u "Min, Matte tin alloy plated. Ma lalo o ka pā: 30u" min, Nickel. Shell: 30u" Min, Nickel plated holoʻokoʻa Solder wahi: Gole flash. Uila: kēia manawa helu: 0.5A. Withstanding Voltage: AC500V rms Insulation Resistance:1000MΩMin, At...

Hoʻohui Kāleka SIM; PUSH PUSH,6P,H1.85mm KLS1-SIM-106

ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH, 6P, H1.85mm, me ka Hale Paʻi: Hi-Temp Plastic, UL94V-0. Rated. Hoʻopili: Copper Alloy. Puhi:SUS. Hoʻopau: Ua uhi ʻia ke gula ma ka wahi conatct, ua uhi ʻia ka tin ma nā huelo solder. Māhele No. Hōʻike PCS/CTN GW(KG) CMB(m3) OrderQty. Kauoha Manawa

Hoʻohui Kāleka SIM, PUSH PUSH, 6P, H1.85mm, me ka ʻole o ka Post KLS1-SIM-087

ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH, 6P, H1.85mm, me ka ʻole o ka Post Material: Insulator: H-Temperature Plastic, UL94V-0.Black. Hoʻokaʻaʻike: Copper Alloy,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u" min Nickel Underplated on Allover,Gold Plating on Contact Arer,80u"min Tin on Solder Tail. Shell:50u" Nickel Underplated on Allover,Gold Flash on Solder Latch. Uila: Loaʻa i kēia manawa:0.5A. Voltage Rating:5.0 Vrms. Hoʻopaʻa i ka Insulation ...

Hoʻohui Kāleka SIM, PUSH PUSH, 6P+2P, H1.85mm, me ka Post KLS1-SIM-086

ʻIke Huahana Mea Hoʻohui Kāleka SIM, PUSH PUSH, 6P+2P, H1.85mm, me ka ʻole o ka Post Material: Insulator: H-Temperature Plastic, UL94V-0.Black. Hoʻokaʻaʻike: Copper Alloy, T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u" min Nickel Underplated on Allover,GoldPlating on Contact Arer,80u" min Tin on Solder Tail. Shell:50u" Nickel Underplated on Allover,Gold Flash onSolder Latch. Uila: Ka helu o kēia manawa:0.5A. Voltage Rating:5.0 Vrms. Insulation Resis...

Hoʻohui Kāleka SIM, PUSH PUSH, 8P+2P, H1.85mm, me ka ʻole o ka Post KLS1-SIM-085A

ʻIke Huahana Mea Hoʻohui Kāleka SIM, PUSH PUSH, 8P+2P, H1.85mm, me ka ʻole o ka Post Material: Insulator:H-TemperaturePlastic,UL94V-0.Black. Hoʻokaʻaʻike: Copper Alloy,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u" min Nickel Underplated onAllover,Gold Plating on Contact Arer,80u" minTin on Solder Tail. Shell: 50u" Nickel Underplated on Allover,GoldFlash on Solder Latch. Uila: I kēia manawa helu:0.5A. Voltage Rating:5.0 Vrms. Insulation Resist...

Hoʻohui Kāleka SIM, PUSH PUSH, 8P+2P, H1.85mm, me ka ʻole o ka Post KLS1-SIM-085

ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH, 8P+2P, H1.85mm, me ka ʻole o ka Post Material: Insulator: H-Temperature Plastic, UL94V-0.Black. Hoʻokaʻaʻike: Copper Alloy,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u" min Nickel Underplated onAllover,Gold Plating on Contact Arer,80u"min Tin on Solder Tail. Shell:50u" Nickel Underplated on Allover,GoldFlash on Solder Latch. Uila: I kēia manawa helu:0.5A. Voltage Rating:5.0 Vrms. Insulation Resi...

Hoʻohui Kāleka SIM, PUSH PUSH, 6P+2P, H1.85mm, me ka ʻole o ka Post KLS1-SIM-084

ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH, 6P+2P, H1.85mm, me ka ʻole o ka Post Material: Housing:LCP,UL94V-0 Contact:C5210R-H,T=0.15 Shell:SUS304,T=0.20 Mylar:Polyester.Operating Temperature: -45ºCold Finish~+85ºC Flashed Area. Ma SolderTails,Me ka Hoʻopili a pau i hoʻopaʻa ʻia ma lalo o 50u" min Nickel. Shell:50u" min Nickel Underplated Overall, Kau ʻia ke kukui gula ma luna o nā huelo kūʻai. Mahele No. wehewehe PC...

Hoʻohui Kāleka SIM, PUSH PUSH, 8P+1P, H1.85mm, me ka ʻole o ka Post KLS1-SIM-074B

ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH, 8P+1P, H1.85mm, me ka ʻole o ka Post Material: Hale: High Temperature Thermoplastic, UL94V-0.Black. Hoʻopili: Copper Alloy. Ka uhi: Hoʻokaʻaʻike: Copper Alloys Or Steel. Papapalapala: Underplate:Nikela. Wahi Hoʻopili:Gold Over Nickel. Māhele Kūʻai: Tin Over Nickel. Shell:G/F Papa Ma luna o Nickel Ma Solder Huelo Uila: Loaʻa kēia manawa:0.5A. Ka helu Voltage: 5.0 Vrms. Kū'ē Kū'ē: 500M Min.At DC 500V DC Me ka Voltage: 250V A...

Hoʻohui Kāleka SIM, PUSH PUSH, 8P+1P, H1.85mm, me ka ʻole o ka Post KLS1-SIM-074A

ʻIke Huahana Mea Hoʻohui Kāleka SIM, PUSH PUSH, 8P+1P, H1.85mm, me ka ʻole o ka Post Material: Insulator:H-TemperaturePlastic,UL94V-0.Black. Hoʻokaʻaʻike: Copper Alloy,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u" min Nickel Underplated onAllover,Gold Plating on Contact Arer,80u" minTin on Solder Tail. Shell:50u" Nickel Underplated on Allover,GoldFlash on Solder Latch. Uila: I kēia manawa helu:0.5A. Voltage Rating:5.0 Vrms. Insulation Resistanc...

Hoʻohui Kāleka SIM, PUSH PUSH, 6P, H1.85mm, me ka Post a me waho o ka Post KLS1-SIM-073A

ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH, 6P, H1.85mm, me ka Post a me waho o ka Post Electrical: Ka helu o kēia manawa: 0.5A. Ka helu Voltage: 5.0 Vrms. Palekana Insulation: 500M Min.At DC 500V DC Withstanding Voltage:250V ACrms No 1 Minute. Kū'ē Kū'ē: 100M Max.At 10MA / 20mVMAX. Hana Hana: -45ºC~+85ºCMatingCycles:5000 Hoʻokomo. Mea Hana: Insulator:H-Temperature Plastic,UL94V-0.Black. Hoʻokaʻaʻike: Copper Alloy, T=0.15mm Shell:Stainless Steel,T=0.15...

Hoʻohui Kāleka SIM, PUSH PUSH, 6P+2P, H1.85mm, me ka Post KLS1-SIM-064A

ʻIke Huahana Mea Hoʻohui Kāleka SIM, PUSH PUSH, 6P+2P, H1.85mm, me ka ʻole o ka Post Material: Insulator: H-Temperature Plastic, UL94V-0.Black. Hoʻokaʻaʻike: Copper Alloy,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u" min Nickel Underplated onAllover,Gold Plating on Contact Arer,80u" minTin on Solder Tail. Shell: 50u" Nickel Underplated on Allover, Gula Flashon Solder Latch

Hoʻohui Kāleka SIM, PUSH PUSH, 6P+2P, H1.80mm, me ka ʻole o ka Post KLS1-SIM-030C

ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH, 6P+2P, H1.80mm, me ka ʻole o ka Post Material: Hale:LCP,UL94V-0 Contact:C5210R-H,T=0.15 Shell:SUS304,T=0.20 Mylar:Polyester. Hoʻopau: Hoʻokaʻaʻike:Gold Flash Plated On Contact Area;Gold Flash Plated On SolderTails,With Entire ContactUnderplated 50u "min Nickel. Shell:50u" min Nickel Underplated Overall,GoldFlash Plated on Solder Tails.Operating Temperature: -45ºC~+85ºC Part No. Description ...

Hoʻohui Kāleka SIM, PUSH PUSH,6P+2P,H1.85mm,me Post KLS1-SIM-030D

ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH, 6P+2P, H1.85mm, me nā mea hoʻouna: Insulator: H-Temperature Plastic, UL94V-0.Black. Hoʻokaʻaʻike: Copper Alloy,T=0.15mm;Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u" min Nickel Underplated on Allover,Gold Plating on Contact Arer,80u" min Tin on Solder Tail. Shell:50u" Nickel Underplate on Allover,Gold Flash on Solder Latch. Uila: Loaʻa i kēia manawa:0.5AVoltage Rating:5.0 Vrms. Kūʻē Insulation...

Hoʻohui Kāleka SIM, PUSH PUSH,6P+2P,H1.85mm,me Post KLS1-SIM-030F

ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH, 6P+2P, H1.85mm, me nā mea hoʻouna: Insulator: H-Temperature Plastic, UL94V-0.Black. Hoʻokaʻaʻike: Copper Alloy,T=0.15mm;Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u" min Nickel Underplated on Allover,Gold Plating on Contact Arer,80u" min Tin on Solder Tail. Shell:50u" Nickel Underplate on Allover,Gold Flash on Solder Latch. Uila: Loaʻa i kēia manawa:0.5AVoltage Rating:5.0 Vrms. Kūʻē Insulation...

Hoʻohui Kāleka SIM, PUSH PUSH, 6P, H1.85mm, me ka ʻole o ka Post KLS1-SIM-030E

ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH, 6P, H1.85mm, me ka ʻole o ka Post Material: Hale: Hi-Temp Plastic, UL94V-0.Rated. Hoʻopili: Copper Alloy. ʻImi: ʻAiʻa ʻole.SUS 301,T=0.20mm. Plating: Contact area:G/F Plated over 30u" Nickel Solder area:80u" Tin Plated over 30u" Nickel. Under plate:30u" Min Nickel. Shell: 30u" Min, Nickel Plated Over All, SolderArea: Gold Flash. Uila: Loaʻa i kēia manawa: 0.5 A Dielectric Withstanding Voltage:250...
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