Hoʻohui Kāleka SIM; PUSH PUSH, 6P+2P, H1.80mm, Me ka leka a me ka ʻole o ka leka. KLS1-SIM-110
ʻIke Huahana Hoʻohui Kāleka SIM; PUSH PUSH,6P+2P,H1.80mm Me ka pou a i ʻole me ka ʻole o ka post.Material:Housing Material: LCP UL94V-0Contact Material: Tin-BronzePackage: Tape and Reel PackageElectrical Characteristics:Voltage rating: 100V ACCurrent Rating: 0Vstand. AC/1MinuteInsulation kū'ē: ≥1000ΜΩContact pale: ≤30mΩLife:
ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH, 6P, H1.85mm, me ka Hale Paʻi: Hi-Temp Plastic, UL94V-0. Rated. Hoʻopili: Copper Alloy. Puhi:SUS. Hoʻopau: Ua uhi ʻia ke gula ma ka wahi conatct, ua uhi ʻia ka tin ma nā huelo solder. Māhele No. Hōʻike PCS/CTN GW(KG) CMB(m3) OrderQty. Kauoha Manawa
Hoʻohui Kāleka SIM, PUSH PUSH, 6P, H1.85mm, me ka ʻole o ka Post KLS1-SIM-087
ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH, 6P, H1.85mm, me ka ʻole o ka Post Material: Insulator: H-Temperature Plastic, UL94V-0.Black. Hoʻokaʻaʻike: Copper Alloy,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u" min Nickel Underplated on Allover,Gold Plating on Contact Arer,80u"min Tin on Solder Tail. Shell:50u" Nickel Underplated on Allover,Gold Flash on Solder Latch. Uila: Loaʻa i kēia manawa:0.5A. Voltage Rating:5.0 Vrms. Hoʻopaʻa i ka Insulation ...
Hoʻohui Kāleka SIM, PUSH PUSH, 6P+2P, H1.85mm, me ka Post KLS1-SIM-086
ʻIke Huahana Mea Hoʻohui Kāleka SIM, PUSH PUSH, 6P+2P, H1.85mm, me ka ʻole o ka Post Material: Insulator: H-Temperature Plastic, UL94V-0.Black. Hoʻokaʻaʻike: Copper Alloy, T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u" min Nickel Underplated on Allover,GoldPlating on Contact Arer,80u" min Tin on Solder Tail. Shell:50u" Nickel Underplated on Allover,Gold Flash onSolder Latch. Uila: Ka helu o kēia manawa:0.5A. Voltage Rating:5.0 Vrms. Insulation Resis...
Hoʻohui Kāleka SIM, PUSH PUSH, 8P+2P, H1.85mm, me ka ʻole o ka Post KLS1-SIM-085A
ʻIke Huahana Mea Hoʻohui Kāleka SIM, PUSH PUSH, 8P+2P, H1.85mm, me ka ʻole o ka Post Material: Insulator:H-TemperaturePlastic,UL94V-0.Black. Hoʻokaʻaʻike: Copper Alloy,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u" min Nickel Underplated onAllover,Gold Plating on Contact Arer,80u" minTin on Solder Tail. Shell: 50u" Nickel Underplated on Allover,GoldFlash on Solder Latch. Uila: I kēia manawa helu:0.5A. Voltage Rating:5.0 Vrms. Insulation Resist...
Hoʻohui Kāleka SIM, PUSH PUSH, 8P+2P, H1.85mm, me ka ʻole o ka Post KLS1-SIM-085
ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH, 8P+2P, H1.85mm, me ka ʻole o ka Post Material: Insulator: H-Temperature Plastic, UL94V-0.Black. Hoʻokaʻaʻike: Copper Alloy,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u" min Nickel Underplated onAllover,Gold Plating on Contact Arer,80u"min Tin on Solder Tail. Shell:50u" Nickel Underplated on Allover,GoldFlash on Solder Latch. Uila: I kēia manawa helu:0.5A. Voltage Rating:5.0 Vrms. Insulation Resi...
Hoʻohui Kāleka SIM, PUSH PUSH, 6P+2P, H1.85mm, me ka ʻole o ka Post KLS1-SIM-084
ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH, 6P+2P, H1.85mm, me ka ʻole o ka Post Material: Housing:LCP,UL94V-0 Contact:C5210R-H,T=0.15 Shell:SUS304,T=0.20 Mylar:Polyester.Operating Temperature: -45ºCold Finish~+85ºC Flashed Area. Ma SolderTails,Me ka Hoʻopili a pau i hoʻopaʻa ʻia ma lalo o 50u" min Nickel. Shell:50u" min Nickel Underplated Overall, Kau ʻia ke kukui gula ma luna o nā huelo kūʻai. Mahele No. wehewehe PC...
Hoʻohui Kāleka SIM, PUSH PUSH, 8P+1P, H1.85mm, me ka ʻole o ka Post KLS1-SIM-074B
ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH, 8P+1P, H1.85mm, me ka ʻole o ka Post Material: Hale: High Temperature Thermoplastic, UL94V-0.Black. Hoʻopili: Copper Alloy. Ka uhi: Hoʻokaʻaʻike: Copper Alloys Or Steel. Papapalapala: Underplate:Nikela. Wahi Hoʻopili:Gold Over Nickel. Māhele Kūʻai: Tin Over Nickel. Shell:G/F Papa Ma luna o Nickel Ma Solder Huelo Uila: Loaʻa kēia manawa:0.5A. Ka helu Voltage: 5.0 Vrms. Kū'ē Kū'ē: 500M Min.At DC 500V DC Me ka Voltage: 250V A...
Hoʻohui Kāleka SIM, PUSH PUSH, 8P+1P, H1.85mm, me ka ʻole o ka Post KLS1-SIM-074A
ʻIke Huahana Mea Hoʻohui Kāleka SIM, PUSH PUSH, 8P+1P, H1.85mm, me ka ʻole o ka Post Material: Insulator:H-TemperaturePlastic,UL94V-0.Black. Hoʻokaʻaʻike: Copper Alloy,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u" min Nickel Underplated onAllover,Gold Plating on Contact Arer,80u" minTin on Solder Tail. Shell:50u" Nickel Underplated on Allover,GoldFlash on Solder Latch. Uila: I kēia manawa helu:0.5A. Voltage Rating:5.0 Vrms. Insulation Resistanc...
Hoʻohui Kāleka SIM, PUSH PUSH, 6P, H1.85mm, me ka Post a me waho o ka Post KLS1-SIM-073A
ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH, 6P, H1.85mm, me ka Post a me waho o ka Post Electrical: Ka helu o kēia manawa: 0.5A. Ka helu Voltage: 5.0 Vrms. Palekana Insulation: 500M Min.At DC 500V DC Withstanding Voltage:250V ACrms No 1 Minute. Kū'ē Kū'ē: 100M Max.At 10MA / 20mVMAX. Hana Hana: -45ºC~+85ºCMatingCycles:5000 Hoʻokomo. Mea Hana: Insulator:H-Temperature Plastic,UL94V-0.Black. Hoʻokaʻaʻike: Copper Alloy, T=0.15mm Shell:Stainless Steel,T=0.15...
Hoʻohui Kāleka SIM, PUSH PUSH, 6P+2P, H1.85mm, me ka Post KLS1-SIM-064A
ʻIke Huahana Mea Hoʻohui Kāleka SIM, PUSH PUSH, 6P+2P, H1.85mm, me ka ʻole o ka Post Material: Insulator: H-Temperature Plastic, UL94V-0.Black. Hoʻokaʻaʻike: Copper Alloy,T=0.15mm Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u" min Nickel Underplated onAllover,Gold Plating on Contact Arer,80u" minTin on Solder Tail. Shell: 50u" Nickel Underplated on Allover, Gula Flashon Solder Latch
Hoʻohui Kāleka SIM, PUSH PUSH,6P+2P,H1.85mm,me Post KLS1-SIM-030D
ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH, 6P+2P, H1.85mm, me nā mea hoʻouna: Insulator: H-Temperature Plastic, UL94V-0.Black. Hoʻokaʻaʻike: Copper Alloy,T=0.15mm;Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u" min Nickel Underplated on Allover,Gold Plating on Contact Arer,80u" min Tin on Solder Tail. Shell:50u" Nickel Underplate on Allover,Gold Flash on Solder Latch. Uila: Loaʻa i kēia manawa:0.5AVoltage Rating:5.0 Vrms. Kūʻē Insulation...
Hoʻohui Kāleka SIM, PUSH PUSH,6P+2P,H1.85mm,me Post KLS1-SIM-030F
ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH, 6P+2P, H1.85mm, me nā mea hoʻouna: Insulator: H-Temperature Plastic, UL94V-0.Black. Hoʻokaʻaʻike: Copper Alloy,T=0.15mm;Shell:Stainless Steel,T=0.15mm Finsh: Terminal:50u" min Nickel Underplated on Allover,Gold Plating on Contact Arer,80u" min Tin on Solder Tail. Shell:50u" Nickel Underplate on Allover,Gold Flash on Solder Latch. Uila: Loaʻa i kēia manawa:0.5AVoltage Rating:5.0 Vrms. Kūʻē Insulation...
Hoʻohui Kāleka SIM, PUSH PUSH, 6P, H1.85mm, me ka ʻole o ka Post KLS1-SIM-030E
ʻIke Huahana Hoʻohui Kāleka SIM, PUSH PUSH, 6P, H1.85mm, me ka ʻole o ka Post Material: Hale: Hi-Temp Plastic, UL94V-0.Rated. Hoʻopili: Copper Alloy. ʻImi: ʻAiʻa ʻole.SUS 301,T=0.20mm. Plating: Contact area:G/F Plated over 30u" Nickel Solder area:80u" Tin Plated over 30u" Nickel. Under plate:30u" Min Nickel. Shell: 30u" Min, Nickel Plated Over All, SolderArea: Gold Flash. Uila: Loaʻa i kēia manawa: 0.5 A Dielectric Withstanding Voltage:250...