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Nā mea hoʻopili kāleka hoʻomanaʻo a me nā mea hoʻopili kāleka SD & Nā mea hoʻohui CompactFlash

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.68mm, me ka pine CD KLS1-SD114

Nā Kiʻi Huahana ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD pana pana,H1.68mm, me ka pine CD Material: Insulator: Hi-Temperature Plastic, UL94V-0, Black. Terminal: Copper Alloy, Gold flash plating ma ka wahi hoʻopili & solder huelo. Shell:Stainless Steel, Nickel underplated on allover, kukui gula ma ka huelo solder. Uila: Kū'ē Insulation: 1000MΩ Min./500V DC Me ka Voltage Kū'ē: 250V AC / minuke. Kū'ē Pili: 100mΩ Max.AT 20mA/20mV Max Ka helu o kēia manawa:0.5 A Voltage Rating:5.0 vrms Opera...

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.85mm, wehe maʻamau KLS1-SD107

Nā Kiʻi Huahana ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD pana pana,H1.85mm,Wehe maʻamau Ka uila: Hoʻokaʻaʻike i ka helu o kēia manawa:0.5A Max. Kūleʻa pili: 100mΩ Max. Palekana Insulation: 250V DC a i ʻole 300V AC no ka liʻiliʻi ma mua o 1 minuke Ka lōʻihi o ka male: 10000 Cycles Min. Ka ikaika hoʻokomo: 2.0kgf max. Ka ikaika o ka unuhi: 0.5kgf min. Ka Mahana Hana: -25ºC~+85ºC

ʻO ka mea hoʻohui kāleka Micro SD e huki huki, H1.5mm, me ka pine CD KLS1-SD104

Nā Kiʻi Huahana ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD e huki huki,H1.5mm, me ka pine CD Nā memo: Coplanarty spec.No nā huelo kūʻai a pau a me nā pā hao he 0.1mm ka nui. Nā ʻano uila: Ka helu o kēia manawa: 0.5 Amp.MAX. Voltage: 100V DC.MAX Haʻahaʻa Haʻahaʻa Kūʻai Kūʻai: 100mΩ Max.Initially. Dielectric Withstanding Voltage:500V AC MIN.No 1 minuke. Kū'ē Insulation:(Initial)1000MΩ Min.(Hoʻopau)100MΩ Min. Ka Mahana Hana: -45ºC~+105ºC Paʻa: 1500 Cycles.

ʻO ka mea hoʻohui kāleka Micro SD e huki huki, H1.5mm, me ka pine CD KLS1-TF-019

Nā Kiʻi Huahana ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD pana huki,H1.5mm,me CD pin Material: Hale: Kiʻekiʻe Temperature Thermoplastic,UL94V-0,ʻEleʻele. Hoʻokaʻaʻike: Copper Alloy T=0.15.Plated Gold Flash on Contact Area. Shell:Stainless Steel T=0.20.Plated Gold Flash on Solder huelo. Uila: Kuhi ʻia i kēia manawa:0.5A Ka Voltage i koho ʻia: 30V Kūʻai Kūʻai: 50mΩ Max. Kū'ē Kū'ē: 100MΩ Min./100V DC Dielectric Me ka Voltage: 100V AC Paʻa: 5000 Cycles. Ka Mahana Hana: -45...

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.29mm, me ka pine CD KLS1-TF-018

Nā Kiʻi Huahana ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD pana pana,H1.29mm, me ka pine CD Material: Insulator:LCP,UL94V-0,ʻEleʻele. Paheʻe:LCP,UL94V-0,ʻEleʻele. Latch: Bronze Phosphor. Hoʻopili: Phosphor Bronze. Shell:SUS304 Puna:Stainless Steel. Crank-axle: Ke kila ʻole. Uila: Voltage:100V AC I kēia manawa:0.5A Max. Kū'ē Pili: 40mΩ Max. Hōʻoiaʻiʻo Voltage:: 500V AC Kū'ē Kū'ē: 1000MΩ Min. Kāleka Hoʻokomo/Hoʻihoʻi Manaʻo:10N Max. Hoʻoikaika i ka ikaika: 10N Durabitity: 10000 Cycles. ʻOpe...

Hoʻohui kāleka Micro SD ʻAno Hinged, H1.9mm KLS1-TF-017

Nā Kiʻi Huahana ʻIke Huahana Hoʻohui kāleka Micro SD ʻAno Hinged,H1.9mm Material: Insulator: High Temperature Thermoplastic Flammability Raring,UL94V-0,Black. Hoʻokaʻaʻike:Copper Alloys uhi:Stainless Steel Contact Area Plating:Gold voer Ni Solder Tail Coplanarity Pono i loko o 0.10MAX.

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.4mm, me ka pine CD KLS1-TF-016

Nā Kiʻi Huahana Huahana ʻIkepili Micro SD card connector push push,H1.4mm,me CD pin Notes: 1.Coplanarity spec.for all solder tall and solder pad is 0.10mm 2.Electric features: 2-1.Current Rating:0.5 Amp.max. 2-2.Voltage:100V DC max. 2-3.Low pae conatct kū'ē:100mΩ Max. 2-4.Dielectric Withstanding Voltage:AC500V rms. 2-5. Kū'ē Kū'ē: 1000MΩ Min. (Hoʻopau) 100MΩ Min. 3. Mechanical hiʻona: 3-1. Durability:5000 Cycles. 3-2.Ka Mahana Hana: -45ºC~+105ºC ...

ʻO ka mea hoʻohui kāleka Micro SD e huki huki, H1.42mm, me ka pine CD KLS1-TF-015

Nā Kiʻi Huahana ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD e huki huki, H1.42mm, me ka pin CD Material: Metala ʻiʻo: Kūleʻa ʻole, Nickel holoʻokoʻa 50u" Hale: Liouid crystal polymer, UL94V-0， ʻEleʻele. Nā hopena pili: Phosphor Bronze.Contact:Gold flash; Solder Tail:Gold 1u”Min. E ʻike i ka Terminal:Phosphor Bronze.Contact:Gold flash;Solder Tail:Gold 1u” Min. Switch Terminal:Phosphor Bronze.Contact:Gold flash;Solder Tail:Gold 1u” Min.

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.8mm KLS1-TF-014

Nā Kiʻi Huahana ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD pana huki, Kiʻekiʻe 1.8mm, Rol Pack. Mea: Hale:LCP,UL94V-0,ʻEleʻele. Terminal: Copper Alloy, Gold Selective on Mating Area. Shell:Iron Electrical: Voltage Rating:5V I kēia manawa:0.5 A Max. Kū'ē Pili: 100mΩ Max. Kū'ē Kū'ē: 1000MΩ Min. Me ka Voltage: 500V 1 Minute. Ka lōʻihi: 10000 Cycles.

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.4mm, me ka pine CD KLS1-TF-012

Nā Kiʻi Huahana ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD pana pana,H1.4mm, me ka pine CD Material: Insulator: Kiʻekiʻe Temperature Thermoplastic, UL94V-0. Terminal: Copper Alloy,Plated 50u "Ni Overall. Plated Au Selective Contact Area Plated 100u" Sn Over Ni On Solder Area. Shell:Plated 50u” Ni Ka holoʻokoʻa. Plated Au Selective Contact Area Electrical: ʻO kēia manawa: 0.5 A AC/DC max. Voltage Rating:125V AC/DC Ambient Humidity Range:95% RH Max. Hoʻokaʻaʻike kū'ē:100mΩ Max. Ins...

Hoʻohui Kāleka Micro SD; ʻAno Hined, H1.5mm & H1.8mm KLS1-TF-007

Nā Kiʻi Huahana Huahana ʻIkepili Kāleka Micro SD Connector;Hinged Type,H1.5mm & H1.8mm Material: Insulator:Hi-Temperature Plastic,UL94V-0.Black. Terminal: Copper Alloy.AU Plating on all terminal contact area, and tin plating on solder huelo wahi. Shell:Sila ʻole. Uila: Ka helu o kēia manawa:0.5 A Voltage Rating:5.0 vrms Insulation Resistance:1000MΩ Min./500V DC Withstanding Voltage:250V AC No 1 minuke. Kūʻai Kūʻai: 100mΩ Max.AT 10mA/20mV Max Hana Hana: -45ºC~...

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD ma waena, H1.8mm, luʻu me ka pine CD KLS1-TF-003E

Nā Kiʻi Huahana ʻIke Huahana ʻO Mid Mount Micro SD card connector push push,H1.8mm,luu me ka CD pin Material: Hale: High Temperature Thermoplastic,UL94V-0，Black. Terminal: Copper Alloy . Shell:Sila ʻole. Hoʻokaʻaʻike: Contact Area: Au G / F, Solder wahi: Matte tin 80u "Min; Ma lalo o ka pā Ni 30u" Min a pau. Pin CD: Wahi Hoʻokaʻaʻike: Au G/F, Ma lalo o ka pā Ni 30u "Min a pau. Uila: Hoʻohālikelike ʻia i kēia manawa: 1.0 A Ka Voltage Rated: 30V Kūʻai Kūʻai50mΩ Max. Kūʻē Insulation:100...

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.85mm, me ka pine CD KLS1-TF-003D

Nā Kiʻi Huahana ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD pana pana,H1.85mm, me ka pine CD Material: Insulator: Kiʻekiʻe Temperature Thermoplastic,LCP,UL94V-0. Hoʻokaʻaʻike: Copper Alloy T=0.15,Plated 50u "Ni Overall. Plated Au Selective Contact Area Plated 30u"-70u" Sn Over Ni On Solder Area. Shell:T=0.15,Plated 30u" Ni Ka nui min. Pa'a 0.5u” Au Selective ContactArea Uila: Ka helu o kēia manawa:0.5mA amx. Voltage Rating:3.3V Ambient Humidity Range:95% RH Max. Co...

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.85mm, me ka pine CD, GOLD KLS1-TF-003C

Nā Kiʻi Huahana ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD pana pana,H1.85mm, me ka pine CD, GOLD Material: Insulator: High Temperature Thermoplastic, LCP, UL94V-0. Hoʻokaʻaʻike: Copper Alloy T=0.15,Plated 50u "Ni Overall. Plated Au Selective Contact Area Plated 30u"-70u" Sn Over Ni On Solder Area. Shell:T=0.15,Plated 30u" Ni Ka nui min. Pa'a 0.5u" Au Waena Ho'oka'a koho. Uila: Ka helu o kēia manawa:0.5mA AC/DC amx. Voltage Rating:125V AC/DC Ambient Humidity Ran...

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD ma waena, H1.8mm, me ka pine CD KLS1-TF-003A

Nā Kiʻi Huahana ʻIke ʻIke Huahana ʻO Mid Mount Micro SD card connector push push,H1.8mm,me CD pin Material: Insulator: High Temperature Thermoplastic,UL94V-0. Hoʻokaʻaʻike: Copper Alloy ,Plated 50u "Ni Overall. Plated Au Selective Contact Area Plated 100u" Sn Over Ni On Solder Area. Shell:Plated 50u” Ni Ka holoʻokoʻa. Plated 1u” Au Selective Contact Area. Uila: Ka helu o kēia manawa:0.5mA AC/DC amx. Voltage Rating:125V AC/DC Ambient Humidity Range:95% RH Max. Hoʻokaʻaʻike Resi...

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.85mm, me ka pine CD KLS1-TF-003

Nā Kiʻi Huahana ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD pana pana,H1.85mm, me ka pine CD Material: Insulator: High Temperature Thermoplastic, UL94V-0. Hoʻokaʻaʻike: Copper Alloy T=0.15,Plated 50u "Ni Overall. Plated Au Selective Contact Area Plated 30u"-70u" Sn Over Ni On Solder Area. Shell:T=0.15,Plated 30u" Ni Ka nui min. Papa 0.5u” Au Waena Hoʻokaʻa koho Uila: Ka helu o kēia manawa:0.5 A Voltage Rating:3.3V Ambient Humidity Range:95% RH Max. Contact Re...

Hoʻohui Kāleka Micro SD; ʻAno Hined, H1.9mm KLS1-TF-002

Nā Kiʻi Huahana ʻIke Huahana Kāleka Micro SD Connector;Hinged Type,H1.9mm Material: Housing Material: LCP UL94V-0 Contact Material: Tin-Bronze Package: Tape and Reel Package Nā ʻano uila: Voltage rating: 100V AC Current Rating: 0.5A ( Max Withstand voltage: 200V AC/1Minute Insulation resistance: 200V AC / 1Minute Insulation1: Hoʻokaʻaʻike ✉ ≤30MΩ Ola: ＞ 5000 Cycles Ka Mahana Hana: -45ºC~+105ºC

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.85mm, pani ʻia KLS1-TF-001B

Nā Kiʻi Huahana ʻIke Huahana ʻO ka mea hoʻohui kāleka Micro SD pana pana,H1.85mm,Paʻa mau Mea: Hale:LCP,UL94V-0， ʻEleʻele. Hoʻopili: Phosphor Bronze. Puhi:SUS304. Uila: Kū'ē Kū'ē: 100mΩ Max. Dielectric Withstanding Voltage: 500V AC Max me 1 Minute. Kū'ē Kū'ē: 1000MΩ Min. Ka helu o kēia manawa:0.5mA AC/DC max. Voltage koho: 100V RMS Min. ʻO ka ikaika o ka male: 13.8N Max. Ka ikaika ʻole: 13.8N Min. Hoʻopili i ka ikaika kū'ē: 100g Min.Per Pin. Ka Mahana Hana: -45ºC~+...

Hoʻokuʻu ʻia ka mea hoʻohui kāleka Micro SD, H1.85mm, pani ʻia KLS1-TF-001

Nā Kiʻi Huahana ʻIke Huahana ʻO ka micro SD card connector push push,H1.85mm,Paʻa maʻamau Material: Hale: Thermoplastic High Temperature,UL94V-0，Black. Hoʻokaʻaʻike: Copper Alloy . Shell:Sila ʻole, Nickle. Lever: Ke kila kila, Nickle. Puna:Pianowire, Nickle. Papapalapala: Underplate:Nikela. Wahi Hoʻopili:Gold over Nickel. Māhele Kūʻai: Tin ma luna o ka nickel.
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