Hoʻohui Kāleka SIM Micro,6P＋1P,PUSH PUSH,H1.85mm,Huli i ka mauna MID KLS1-SIM-097

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Hoʻohui Kāleka SIM Micro,6P＋1P,PUSH PUSH,H1.85mm,Huli i ka mauna MID

Material:

Insulator: Thermoplastic wela kiʻekiʻe, UL94V-0, ʻeleʻele.

Hoʻokaʻaʻike: Copper Alloy.Plated 30u” Ni Overall, Solder Area: Tin, Contact G/F

Shell:Stainless, 30u” Ni Ka Laulā G/F Waena Hoʻopili Koho.

Uila:

Ka helu o kēia manawa: 0.5A max.

Voltage Rating:50V DC max.

Māhele Haʻahaʻa Ambient:95% RH Max.

Kū'ē Pili: 100mΩ Max.

Kū'ē Kū'ē: 1000MΩ Min./250V DC

Dielectric Withstanding Voltage:500V AC

Nā pōʻaiapili male:5000 hoʻokomo

Ka Mahana Hana: -45ºC~+85ºC

Mua: Hoʻohui Kāleka SIM Micro,8P＋1P,PUSH PUSH,H3.65mm KLS1-SIM-096

Aʻe: [Kopi] Mea hoʻohui Kāleka SIM Micro,6P＋1P,PUSH PUSH,H1.85mm,Huli i ka mauna MID KLS1-SIM-097