Hoʻohui Kāleka SIM Micro,8P＋1P,PUSH PUSH,H3.65mm KLS1-SIM-096
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Hoʻohui Kāleka SIM Micro,8P＋1P,PUSH PUSH,H3.65mm
Material:
Hale Noho: Thermoplastic wela kiʻekiʻe, UL94V-0, ʻeleʻele.
Terminal: Copper Alloy.Contact Au: GF Plating
Shell:Stainless Steel.Slider Plating Au:1u”,Ni:30u” Min.
Uila:
Ka helu o kēia manawa: 1.0A
Ka Uo Uila: 50V
Kū'ē Pili: 100mΩ Max.
Kū'ē Kū'ē: 1000MΩ Min./500V DC
Dielectric Withstanding Voltage:500V AC
Kaha: 80% RH Max.
Ka lōʻihi: 5000 Cycles Min.
Ka Mahana Hana: -45ºC~+85ºC
