PCB Mount SMA Hoʻohui Pololei (Jack, Wahine, 50Ω) KLS1-SMA001G
Nā Kiʻi Huahana ʻIke Huaʻōlelo PCB Mount SMA Connector Jack Female Pololei Mea: Kino: keleawe,Gold Plating Contact Pin:Ber.Copper,Gold Plating Insulator:Teflon,Natural Electrical: Impedance:50Ω Frequency Range:DC-12.4 GHz Mechanical: Durability:500 Cycles Min. Palena Mahana:-65%% DC i + 165%% DC
PCB Mount SMA Connector Pololei (Jack, Wahine, 50Ω) KLS1-SMA001H
Nā Kiʻi Huahana ʻIke Huaʻōlelo PCB Mount SMA Connector Jack Female Pololei Mea: Kino: keleawe,Gold Plating Contact Pin:Ber.Copper,Gold Plating Insulator:Teflon,Natural Electrical: Impedance:50Ω Frequency Range:DC-12.4 GHz Mechanical: Durability:500 Cycles Min. Palena Mahana:-65%% DC i + 165%% DC
[Kopi] Mea hoʻohui Kāleka SIM Micro,6P+1P,PUSH PUSH,H1.85mm,Huli i ka mauna MID KLS1-SIM-097
Nā Kiʻi Huahana ʻIke Huahana Hoʻohui Kāleka Micro SIM, 6P+2P Me ke kuapo, PUSH PUSH,H1.27mm NOTE 1.LEAD Co-planarity:Max 0.08mm 2.No rust.contamination.damage a me deformation effecting on function 3.Switch neʻe wahi 4.Non-cumulative ofirsecuit tolerance Material:Awi. Insulator:LCP,ʻeleʻele. B: Uhi: ʻAʻole Paʻa, ʻAʻole paʻa i lalo: Nikeli; Hoʻopaʻa i lalo: ʻAla Au ma luna o Nickel. C: Hoʻokaʻaʻike Terminal: Copper Alloy.Au ma luna o Nickel D: CAM Plate: Copper Alloy, Nickel. E:CAM Slider:LCP,Bl...
Hoʻohui Kāleka SIM Micro,6P+1P Me ka Huli, PUSH PUSH,H1.29mm KLS1-SIM-093
Nā Kiʻi Huahana ʻIke Huahana Hoʻohui Kāleka Micro SIM, 6P+1P Me ka Hoʻololi, PUSH PUSH, H1.29mm Material: Housing: High Temperature Thermoplastic, UL94V-0 Contact: Copper Alloy, Au 1u ”, Solder area: Gold Flash; Under plate Ni 40u” Min all over Shell: SUS, Plated 30U” Kiʻi uila 0.5A Voltage Rating:50V DC Max Hoʻokaʻaʻike Kū'ē:100mΩ Max Dielectric Kū'ē:500V AC Kū'ē Kū'ē:1000MΩ Min./250VDC Oper...
Hoʻohui Kāleka SIM Micro,8P+1P Me ka Huli, PUSH PUSH,H1.56mm KLS1-SIM-094
Nā Kiʻi Huahana ʻIke Huahana Hoʻohui Kāleka Micro SIM, 8P+1P Me ka Hoʻololi, PUSH PUSH, H1.56mm Material: Housing: High Temperature Thermoplastic, UL94V-0 Contact: Copper Alloy, Au 1u ”, Solder area: Gold Flash; Under plate Ni 40u” Min all over Shell: SUS,Plated 30U” Kiʻi uila 1.0A Voltage Rating:50V Hoʻokaʻaʻike Kū'ē:100mΩ Max Dielectric Withstanding Voltage:500V AC Insulation Kū'ē:1000MΩ Min./250VDC Operating Te...
6P+2P Me ka mea hoʻohui Kāleka SIM hoʻololi, ʻano hinged, H2.5mm KLS1-SIM-010B
Nā Kiʻi Huahana ʻIke Huahana 6P+2P Me ka hoʻololi ʻana i ka mea hoʻohui Kāleka SIM, ʻAno hinged, H2.5mm ʻIke Kauoha: KLS1-SIM-010B-H2.5-8P-1-R Nā Pins: 6+2pin me ka hoʻololi 1=Me ka ʻole o ka peg R=Roll pack T=Tube pack Material: Insulator body:LCP. Kala: ʻEleʻele Hoʻopili: Phosphor Bronze Plating: Finsh: Tin Gold a Duplex plated. Kūlana:Gold flash 3u” a puni Nickel Electrical: Ka helu o kēia manawa:0.5A. Dielectric Withstanding Voltage:500V AC Insulation Resistance:1000MΩ Min Contact Resistance:30mΩ ...
6P+2P Me ka hoʻololi ʻana i ka mea hoʻohui Kāleka SIM, ʻano hinged, H2.5mm KLS1-SIM-012C
Nā Kiʻi Huahana ʻIke Huahana 6P+2P Me ka Hoʻololi Kāleka Kāleka Hoʻohui,Hinged ʻano,H2.5mm Ka ʻike kauoha: KLS1-SIM-012C-6+2P-R Pins:6+2pin me ka hoʻololi R=Roll pack T=Tube pack Material: Housing:LCP UL94V-0 Contact Terminal:Phosphor Bronze Metallic Shell:S0 Contact Plating Metallic Shell:S0 Wahi: 5μ” Wahi Kūʻai gula: 100μ” Kino Ma lalo o ka uhi ʻana: 50μ” Nickel ma luna o Uila: Voltage Rating: 50 V max o kēia manawa: 1A max...