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Nā mea hoʻohui kāleka SIM a me nā mea hoʻohui kāleka Micro SIM a me nā mea hoʻohui Kāleka Nano SIM

Hoʻohui Kāleka SIM Micro,6P＋1P Me ka Huli, PUSH PUSH,H1.29mm KLS1-SIM-093

Nā Kiʻi Huahana ʻIke Huahana Hoʻohui Kāleka Micro SIM, 6P＋1P Me ka Hoʻololi, PUSH PUSH, H1.29mm Material: Housing: High Temperature Thermoplastic, UL94V-0 Contact: Copper Alloy, Au 1u ”, Solder area: Gold Flash; Under plate Ni 40u” Min all over Shell: SUS, Plated 30U” Kiʻi uila 0.5A Voltage Rating:50V DC Max Hoʻokaʻaʻike Kū'ē:100mΩ Max Dielectric Kū'ē:500V AC Kū'ē Kū'ē:1000MΩ Min./250VDC Oper...

Hoʻohui Kāleka SIM Micro,8P＋1P Me ka Huli, PUSH PUSH,H1.56mm KLS1-SIM-094

Nā Kiʻi Huahana ʻIke Huahana Hoʻohui Kāleka Micro SIM, 8P＋1P Me ka Hoʻololi, PUSH PUSH, H1.56mm Material: Housing: High Temperature Thermoplastic, UL94V-0 Contact: Copper Alloy, Au 1u ”, Solder area: Gold Flash; Under plate Ni 40u” Min all over Shell: SUS,Plated 30U” Kiʻi uila 1.0A Voltage Rating:50V Hoʻokaʻaʻike Kū'ē:100mΩ Max Dielectric Withstanding Voltage:500V AC Insulation Kū'ē:1000MΩ Min./250VDC Operating Te...

Hoʻohui Kāleka SIM Micro,8P＋2P,PUSH PUSH,H1.28mm KLS1-SIM-095

Nā Kiʻi Huahana ʻIke Huahana Mea Hoʻohui Kāleka Micro SIM,8P＋2P,PUSH PUSH,H1.28mm Material: Insulator:Kiʻekiʻe Temperature Thermoplastic,UL94V-0,Black. Hoʻokaʻaʻike: Copper Alloy.Gold or Nickel. Shell:Stainless.Gold or Nickel. Wahi Solder: Matte Tin 80u” Plated'Gold Flash. Uila: Ka helu o kēia manawa: 1A Rating Voltage:30V Hoʻokaʻaʻike Kū'ē:100mΩ Max. Kū'ē Kū'ē:1000MΩ Min./500V DC Dielectric Withstanding Voltage:500V AC Hoʻohui Hoʻohui: 5000 Inserations ...

Hoʻohui Kāleka SIM Micro,8P＋1P,PUSH PUSH,H3.65mm KLS1-SIM-096

Nā Kiʻi Huahana ʻIke Huahana Hoʻohui Kāleka Micro SIM,8P＋1P,PUSH PUSH,H3.65mm Material: Hale: Kiʻekiʻe Temperature Thermoplastic,UL94V-0,ʻEleʻele. Terminal: Copper Alloy.Contact Au:GF Plating Shell:Stainless Steel.Slider Plating Au:1u”,Ni:30u”Min. Uila: Ka helu o kēia manawa: 1.0A Ka helu Voltage: 50V Hoʻopili Kūʻē: 100mΩ Max. Kū'ē Kū'ē: 1000MΩ Min./500V DC Dielectric Me ka Voltage: 500V AC Humidity: 80% RH Max. Ka lōʻihi: 5000 Cycles Min. Ke hana nei...

Hoʻohui Kāleka SIM Micro,6P＋1P,PUSH PUSH,H1.85mm,Huli i ka mauna MID KLS1-SIM-097

Nā Kiʻi Huahana ʻIke Huahana Mea Hoʻohui Kāleka SIM Micro,6P＋1P,PUSH PUSH,H1.85mm,Reverse MID Mount Material: Insulator: High Temperature Thermoplastic,UL94V-0,Black. Hoʻokaʻaʻike: Copper Alloy.Plated 30u” Ni Overall,Solder Area:Tin,Contact G/F Shell:Stainless,30u” Ni Overall Plated G/F Selective Contact Area. Uila: Ka helu o kēia manawa:0.5A max. Voltage Rating:50V DC max. Māhele Haʻahaʻa Ambient:95% RH Max. Kū'ē Pili: 100mΩ Max. Kū'ē kū'ē: 1000MΩ Min./250V...

[Kopi] Mea hoʻohui Kāleka SIM Micro,6P＋1P,PUSH PUSH,H1.85mm,Huli i ka mauna MID KLS1-SIM-097

Nā Kiʻi Huahana ʻIke Huahana Hoʻohui Kāleka Micro SIM, 6P＋2P Me ke kuapo, PUSH PUSH,H1.27mm NOTE 1.LEAD Co-planarity:Max 0.08mm 2.No rust.contamination.damage a me deformation effecting on function 3.Switch neʻe wahi 4.Non-cumulative ofirsecuit tolerance Material:Awi. Insulator:LCP,ʻeleʻele. B: Uhi: ʻAʻole Paʻa, ʻAʻole paʻa i lalo: Nikeli; Hoʻopaʻa i lalo: ʻAla Au ma luna o Nickel. C: Hoʻokaʻaʻike Terminal: Copper Alloy.Au ma luna o Nickel D: CAM Plate: Copper Alloy, Nickel. E:CAM Slider:LCP,Bl...

6P＋2P Me ka mea hoʻohui Kāleka SIM hoʻololi, ʻano hinged, H2.5mm KLS1-SIM-010B

Nā Kiʻi Huahana ʻIke Huahana 6P＋2P Me ka hoʻololi ʻana i ka mea hoʻohui Kāleka SIM, ʻAno hinged, H2.5mm ʻIke Kauoha: KLS1-SIM-010B-H2.5-8P-1-R Nā Pins: 6+2pin me ka hoʻololi 1=Me ka ʻole o ka peg R=Roll pack T=Tube pack Material: Insulator body:LCP. Kala: ʻEleʻele Hoʻopili: Phosphor Bronze Plating: Finsh: Tin Gold a Duplex plated. Kūlana:Gold flash 3u” a puni Nickel Electrical: Ka helu o kēia manawa:0.5A. Dielectric Withstanding Voltage:500V AC Insulation Resistance:1000MΩ Min Contact Resistance:30mΩ ...

6P＋2P Me ka hoʻololi ʻana i ka mea hoʻohui Kāleka SIM, ʻano hinged, H2.5mm KLS1-SIM-012C

Nā Kiʻi Huahana ʻIke Huahana 6P+2P Me ka Hoʻololi Kāleka Kāleka Hoʻohui,Hinged ʻano,H2.5mm Ka ʻike kauoha: KLS1-SIM-012C-6+2P-R Pins:6+2pin me ka hoʻololi R=Roll pack T=Tube pack Material: Housing:LCP UL94V-0 Contact Terminal:Phosphor Bronze Metallic Shell:S0 Contact Plating Metallic Shell:S0 Wahi: 5μ” Wahi Kūʻai gula: 100μ” Kino Ma lalo o ka uhi ʻana: 50μ” Nickel ma luna o Uila: Voltage Rating: 50 V max o kēia manawa: 1A max...

Hoʻohui Kāleka SIM ʻelua, PUSH PULL, H3.0mm KLS1-SIM2-002A

Nā Kiʻi Huahana ʻIke Huahana Hoʻohui Kāleka SIM ʻElua, PUSH PULL, H3.0mm Material: Hale: Hi-TEMP Plastic, UL94V-0.Black. Terminal: Copper alloy Shell:Stainless Steel Finish: Terminal:Au Plated on the contact area , Matte tin plated on the solder huelo underplated over nickel Shell:Au Plated on the solder huelo underplated over nickel Electrical: Contact Resistance:50mΩ Max Withstanding Voltage:350V AC rms no ka 1 minut Insulation ...

2 In 1 Micro SIM & Kāleka Kāleka SD, 8P,H2.26mm KLS1-SIM-109

Nā Kiʻi Huahana ʻIke Huahana 2 In 1 Micro SIM & SD Card Connector, 8P,H2.26mm Material: Insulator: High Temp Thermoplastic,UL94V-0.Black. Terminal: Copper Alloy,Gold plating ma contact area 1u”,Solding Area gilding 1u” Upper Shell:Stainless Steel,Plate Nickel 50u”. Down Shell:SUS304 R-1/2H T=0.10mm,Plate Nickel 50u”. Uila: Mana Hookomo 1kgf Max.Withdrawal Force 0.1kgf Min. Ka lōʻihi: SIM 5000 Cycles, Hoʻokaʻaʻike Kūʻē: Ma mua o ka hoʻāʻo ʻana iā 80mΩ Max, Ma hope ...

Hoʻohui Kāleka SIM ʻelua, PUSH PULL, H3.0mm KLS1-SIM-033

Nā Kiʻi Huahana ʻIke Huahana Hoʻohui Kāleka SIM ʻElua, PUSH PULL,H3.0mm Material: Hale:Hi-Temperature Plastic,UL94V-0.Black. Terminal: Copper Alloy.Gold Flash Plated on All Terminal, AND 50u "Min Nickel Underplated On Allover. Shell:Stainless Steel.50u" Nickel Underplated on Allover,Gold Flash On Solder PAD. Uila: Ka helu o kēia manawa:0.5 A. Voltage Rating:5.0 vrms. Kū'ē Kū'ē: 1000MΩ Min.At DC500V DC. Me ka Voltage: 250V AC RMS No 1 Minute. Hoʻokaʻaʻike...

2 Ma 1 Kāleka SIM + Hoʻohui Micro SD, PUSH PULL, H2.7mm KLS1-SIM-024

Nā Kiʻi Huahana ʻIke Huahana 2 In 1 SIM Kāleka + Micro SD Connector,PUSH PULL,H2.7mm Uila: Voltage:100V AC i kēia manawa:0.5A Max. Kū'ē Pili: 100mΩ Max. Dielectric Withstanding Voltage:500V AC. Palekana Insulation: 1000MΩ Min Mechanical: Kāleka Hoʻokomo ʻana i ka ikaika: 13.8N Max. Puhi I ka ikaika:19.6N Max. Ka lōʻihi: 10000 Cycles. Hana Hana: -45ºC~+85ºC Uila: Voltage:100V AC i kēia manawa:0.5A Max. Kū'ē Pili: 100mΩ Max. Dielectric Withstandin...

Mea hoʻohui Kāleka SIM Nano; PUSH PULL, 6Pin, H1.40mm KLS1-SIM-113

Nā Kiʻi Huahana ʻIke Huahana Nā Mea Hoʻohui Kāleka SIM Nano;PUSH PULL,6Pin,H1.40mm Material: Insulator:LCP,UL94V-0. Contact:C5210.Plated 50u” Ni Overall,Contact All Au 1u. Shell:SUS,Plated 50u” Ni Overall,PAD Au 1u. Uila: Ka helu o kēia manawa:0.5A AC/DC max. Ka helu Voltage: 30V AC/DC Kūʻai Kūʻē: 30mΩ Max. Kū'ē Insulation: 1000MΩ Min Hana Hana: -45ºC ~ + 85ºC

Hoʻohui Kāleka Nano SIM, PUSH PUSH, 6Pin, H1.37mm, me CD Pin KLS1-SIM-066

Nā Kiʻi Huahana ʻIke Huahana Nā Mea Hoʻohui Kāleka Nano SIM, PUSH PUSH, 6Pin, H1.37mm, me CD Pin Material: Insulator: High Temperature Thermoplastic, UL94V-0. Hoʻokaʻaʻike: Copper Alloy, Plated 50u "Ni Overall, PAD Au 1u". Shell:SUS.All Ni 30U/MIN. Uila: Ka helu o kēia manawa:0.5A ampers Voltage Rating:5V AC/DC Kū'ē Kū'ē:100mΩ Max. Kū'ē Kū'ē: 1000MΩ Min./500V DC Hana Hana Maha: -45ºC~+85ºC

Hoʻohui Kāleka Nano SIM, PUSH PUSH, 6Pin, H1.25mm, me CD Pin KLS1-SIM-103

Nā Kiʻi Huahana ʻIke Huahana Nano SIM Kāleka Hoʻohui, PUSH PUSH, 6Pin, H1.25mm, me CD Pin Material: Hoʻokaʻaʻike: Copper Alloy.Au ma luna o Ni. Hale: LCP piha i ke aniani. Shell:Stainless.Au ma luna o Ni.GND Frame: Copper Alloy.Au ma luna o Ni. Hoʻololi ʻike: Copper Alloy.Au ma luna o Ni.Slide: Glass Filled Pa10t. Puna: ʻAʻole. Hook: ʻAʻole. Uila: Ua helu ʻia i kēia manawa:0.5A ʻO ka Voltage i koho ʻia: 30V AC Kūʻai Kūʻē: 100mΩ Max. Kū'ē Insulation:1000MΩ Min./500VDC Dielectric Withstanding Voltage:500...

Hoʻohui Kāleka Nano SIM, ʻano pā, 6Pin, H1.55mm, me ka Pin CD KLS1-SIM-104

Nā Kiʻi Huahana ʻIke Huahana Nano SIM Kāleka Hoʻohui, ʻAno pā, 6Pin,H1.55mm,me CD Pin Uila: Ka helu o kēia manawa:1 Amp/Pin.MAX. Voltage: 30V DC.MAX Haʻahaʻa Kūʻai Kūʻai Kūʻē: 30mΩ Max.Initially. Dielectric Withstanding Voltage:500V AC MIN.No 1 minuke. Palekana Insulation: 100MΩ Min.500V DC .No 1 minuke. Ka lōʻihi: 1500 Cycles. Ka Mahana Hana: -45ºC~+85ºC

Hoʻohui Kāleka Nano SIM, ʻano pā, 6Pin, H1.5mm, me ka Pin CD KLS1-SIM-102

Nā Kiʻi Huahana ʻIke Huahana Kāleka Nano SIM Hoʻohui, ʻAno pā, 6Pin,H1.5mm,me CD Pin Uila: Ka helu o kēia manawa:1 Amp/Pin.MAX. Voltage: 30V DC.MAX Haʻahaʻa Kūʻai Kūʻai Kūʻē: 30mΩ Max.Initially. Dielectric Withstanding Voltage:500V AC MIN.No 1 minuke. Palekana Insulation: 100MΩ Min.500V DC .No 1 minuke. Ka lōʻihi: 1000 Cycles. Ka Mahana Hana: -45ºC~+85ºC

Mea Hoʻohui Kāleka SIM Nano; ʻAno MID Mount Tray, 6Pin, H1.5mm, me CD Pin KLS1-SIM-100

Nā Kiʻi Huahana ʻIke Huahana Nano SIM Kāleka Hoʻohui;MID Mount Tray type,6Pin,H1.5mm,me CD Pin Material: Plastics:LCP,UL94V-0.Black. Hoʻokaʻaʻike:C5210 Shell:SUS304 Tray:LCP,UL94V-0.Black. Plating: Contact:Contact Area:G/F Plating;Soldertail Area:80u” Matte Tin Shell:Plating over 30u”Ni Solderable 30u”Ni Plating over all.Contact and tail coplanarity to be 0.10mm all.

Hoʻohui Kāleka Nano SIM, 6Pin, H1.4mm, ʻAno Hined, me ka Pin CD KLS1-SIM-101

Nā Kiʻi Huahana ʻIke Huahana Nano SIM Kāleka Hoʻohui,6Pin,H1.4mm,Hinged Type,me CD Pin Material: Hale: High Temperature Thermoplastic,UL94V-0.Black. Terminal: Copper Alloy, Plated Gold ma ka wahi pili a me nā huelo solder, Underplated Nickel ma luna o nā mea a pau. Shell:Stainless Steel, Kāwili ʻia i ke gula ma nā huelo solder, Underplated Nickel ma luna o nā mea a pau. Uila: Ua helu ʻia i kēia manawa:0.5A ʻO ka Voltage i koho ʻia: 30V AC Kūʻai Kūʻē: 100mΩ Max. Kū'ē Kū'ē: 1000MΩ Min./500V DC Dielectric Withsta...

Hoʻohui Kāleka Nano SIM, 6Pin, H1.4mm, ʻAno Hined, me ka Pin CD KLS1-SIM-077A

Nā Kiʻi Huahana ʻIke Huahana Nano SIM Kāleka Hoʻohui,6Pin,H1.4mm,Hinged Type,me CD Pin Material: Insulator: High Temperature Thermoplastic,UL94V-0. Hoʻokaʻaʻike:Copper Alloy,Plated 50u” Ni Ka holoʻokoʻa Hoʻokaʻaʻike All Au 1U. Shell:SUS.All Ni 30U MIN. Uila: Ka helu o kēia manawa:0.5A AC/DC MAX. Voltage Rating:125V AC/DC Ambient Humidity Range:95% RH Max. Hoʻokaʻaʻike kū'ē:80mΩ Max. Nā pōʻaiapili male: 5000 hoʻokomo ʻana i ka wela hana: -45ºC~+85...

Hoʻohui Kāleka Nano SIM, 6Pin, H1.4mm, ʻAno Hined, me ka ʻole CD Pin KLS1-SIM-077

Nā Kiʻi Huahana Nā Mea Hoʻohui Kāleka SIM Nano,6Pin,H1.4mm,Hinged Type,me ka ʻole CD Pin Material: Insulator:Kiʻekiʻe Temperature Thermoplastic,UL94V-0. Hoʻokaʻaʻike:C5210,Plated 50u” Ni Kakau Hoʻokaʻaʻike All Au 1U. Shell:SUS.All Ni 30U/MIN. Uila: Ka helu o kēia manawa:0.5A Voltage Rating:5V AC/DC Ambient Humidity Range:95% RH Max. Hoʻokaʻaʻike kū'ē: 80mΩ Max. Maikaʻi Min.V DC. Nā pōʻai: 10000 Hoʻokomo ʻana i ka wela hana: -45ºC~+85ºC Nano SIM Kāleka Hoʻohui, 6Pin, H1....

Hoʻohui Kāleka Nano SIM, PUSH PULL, 6Pin, H1.4mm, me CD Pin KLS1-SIM-092

Nā Kiʻi Huahana Huahana ʻIkepili Kāleka Nano SIM, PUSH PULL,6Pin,H1.4mm,me CD Pin Material: Hale:Hi-Temperature Thermoplastic,UL94V-0.Black. Terminal:Copper Alloy,koho 1u" Au ma ka wahi pili. Shell:Stainless Steel.selective Gold Flash ma ka solder wahi. Uila: Rated keia manawa:0.5A Max Rated Voltage:30V AC Contact Resistance:100mΩ Max. Insulation Resistance:1000MΩ Min./500V DC AC/50V DC Dielectric Withstanding Voltage. Nā pōʻaiapuni.

Mea hoʻohui Kāleka SIM Nano; PUSH PULL, 6Pin, H1.35mm KLS1-SIM-076

Nā Kiʻi Huahana ʻIke Huahana Nā Mea Hoʻohui Kāleka SIM Nano;PUSH PULL,6Pin,H1.35mm Material: Insulator: Kiʻekiʻe Mahana Thermoplastic,UL94V-0. Contact:C5210.Plated 50u” Ni Overall,Contact All Au 1u. Shell:SUS,Plated 50u” Ni Overall,PAD Au 1u. Uila: Ka helu o kēia manawa:0.5A AC/DC max. Voltage Rating:125V AC/DC Hoʻokaʻaʻike Kūʻē:100mΩ Max. Kū'ē Kū'ē: 1000MΩ Min.500V DC Hana Hana: -45ºC~+85ºC

Mea hoʻohui Kāleka SIM Nano; PUSH PULL, 6Pin, H1.2mm KLS1-SIM-D01

Nā Kiʻi Huahana Huahana Mea Pono: Hale: High Temp.Thermoplastic,UL94V-0.Black Contact: Copper Alloy 0.10T,Gold Flash On Contact Area and Solder Area 50U” Min Nickel Under-Plated Shell:Stainless Steel 0.10T,Nickel Plating Over ALL Electrical: Current Rating:10A Contact Resistance:1A Ins ΩM Resistance:1A Ω. Min Dielectric Withstanding Voltage:500V RMS Min Life Test:1500 Cycles
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